FQB52N20TM Schematic Diagram Functional Circuit Principle Chip Pin Definition Pin Diagram and Functions - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

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  • Shenzhen Chenhao Technology Co., Ltd

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FQB55N06 Product Parameters
model: FQB55N06
Rohs certification or not: Non conformance
Lifecycle: Obsolete
IHS Manufacturer: FAIRCHILD SEMICONDUCTOR CORP
Part package code: TO-263
Packing instructions: SMALL OUTLINE, R-PSSO-G2
Number of stitches: three
Reach Compliance Code: unknown
ECCN code: EAR99
Risk level: five point three one
Is Samacsys: N
Avalanche energy efficiency grade (Eas): 545 mJ
Enclosure connection: DRAIN
to configure: SINGLE WITH BUILT-IN DIODE
Minimum drain source breakdown voltage: 60 V
Maximum drain current (Abs) (ID): 55 A
Maximum drain current (ID): 55 A
Maximum drain source on resistance: 0.02 Ω
FET technology: METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code: TO-263AB
JESD-30 code: R-PSSO-G2
JESD-609 code: e0
Number of elements: one
Number of terminals: two
Operating mode: ENHANCEMENT MODE
Maximum operating temperature: 175 °C
Packaging body material: PLASTIC/EPOXY
Package shape: RECTANGULAR
Packaging form: SMALL OUTLINE
Peak reflux temperature (° C): NOT SPECIFIED
Polarity/Channel Type: N-CHANNEL
Maximum power dissipation (Abs): 133 W
Maximum pulse drain current (IDM): 220 A
Certification status: Not Qualified
Subcategory: FET General Purpose Power
Surface mounting: YES
Terminal surface layer: Tin/Lead (Sn/Pb)
Terminal type: GULL WING
Terminal location: SINGLE
Maximum time at peak reflux temperature: NOT SPECIFIED
Transistor applications: SWITCHING
Transistor element material: SILICON
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