| model: | FPF2411BUCX_F130 |
|
| Brand Name： | Fairchild Semiconductor |
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Transferred |
| Part package code: | CSP |
| Packing instructions: | VFBGA, |
| Number of stitches: | twelve |
| Manufacturer's package code: | 12BALL WLCSP, 3X4 ARRAY, 0.4MM PITCH, 250UM BALL |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.39.00.01 |
| Risk level: | seven point nine seven |
| Analog integrated circuits - Other types: | SPST |
| JESD-30 code: | R-PBGA-B12 |
| JESD-609 code: | e1 |
| Length: | 1.625 mm |
| Humidity sensitivity level: | one |
| Number of channels: | one |
| Number of functions: | one |
| Number of terminals: | twelve |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | VFBGA |
| Package shape: | RECTANGULAR |
| Packaging form: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak reflux temperature (° C): | two hundred and sixty |
| Maximum height of seating surface: | 0.625 mm |
| Maximum supply voltage (Vsup): | 5.5 V |
| Minimum supply voltage (Vsup): | 2.3 V |
| Nominal supply voltage (Vsup): | 3.8 V |
| Surface mounting: | YES |
| Terminal surface layer: | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal type: | BALL |
| Terminal pitch: | 0.4 mm |
| Terminal location: | BOTTOM |
| Maximum time at peak reflux temperature: | NOT SPECIFIED |
| Width: | 1.235 mm |
| Base Number Matches： | one |
|
