| model: | FM25L16B-DG |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Active |
| Part package code: | DFN |
| Packing instructions: | HVSON, SOLCC8,.16,37 |
| Number of stitches: | eight |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.32.00.71 |
| Factory Lead Time： | 1 week |
| Risk level: | one point four |
| JESD-30 code: | R-PDSO-N8 |
| JESD-609 code: | e3 |
| Length: | 4.5 mm |
| Memory density: | 16384 bit |
| Memory IC type: | MEMORY CIRCUIT |
| Memory width: | eight |
| Humidity sensitivity level: | three |
| Number of functions: | one |
| Number of terminals: | eight |
| Number of words: | 2048 words |
| Word number code: | two thousand |
| Operating mode: | SYNCHRONOUS |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| Organization: | 2KX8 |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | HVSON |
| Encapsulation equivalent code: | SOLCC8,.16,37 |
| Package shape: | RECTANGULAR |
| Packaging form: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak reflux temperature (° C): | two hundred and sixty |
| Power Supply: | 3/3.3 V |
| Certification status: | Not Qualified |
| Maximum height of seating surface: | 0.85 mm |
| Maximum standby current: | 0.000006 A |
| Subcategory: | SRAMs |
| Maximum slewing rate: | 0.003 mA |
| Maximum supply voltage (Vsup): | 3.6 V |
| Minimum supply voltage (Vsup): | 2.7 V |
| Nominal supply voltage (Vsup): | 3.3 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | INDUSTRIAL |
| Terminal surface layer: | Matte Tin (Sn) |
| Terminal type: | NO LEAD |
| Terminal pitch: | 0.95 mm |
| Terminal location: | DUAL |
| Maximum time at peak reflux temperature: | thirty |
| Width: | 4 mm |
| Base Number Matches： | one |
|
