model: | FM25L16-DG |
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Rohs certification or not: | accord with |
Lifecycle: | Obsolete |
Part package code: | DFN |
Packing instructions: | HVSON, |
Number of stitches: | eight |
Reach Compliance Code: | unknown |
HTS Code: | 8542.32.00.71 |
Risk level: | five point six four |
JESD-30 code: | R-PDSO-N8 |
Length: | 6.4 mm |
Memory density: | 16384 bit |
Memory IC type: | MEMORY CIRCUIT |
Memory width: | eight |
Humidity sensitivity level: | one |
Number of functions: | one |
Number of terminals: | eight |
Number of words: | 2048 words |
Word number code: | two thousand |
Operating mode: | SYNCHRONOUS |
Maximum operating temperature: | 85 °C |
Minimum operating temperature: | -40 °C |
Organization: | 2KX8 |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | HVSON |
Package shape: | RECTANGULAR |
Packaging form: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Certification status: | Not Qualified |
Maximum height of seating surface: | 0.8 mm |
Maximum supply voltage (Vsup): | 3.6 V |
Minimum supply voltage (Vsup): | 2.7 V |
Nominal supply voltage (Vsup): | 3.3 V |
Surface mounting: | YES |
Technology: | CMOS |
Temperature class: | INDUSTRIAL |
Terminal type: | NO LEAD |
Terminal pitch: | 0.65 mm |
Terminal location: | DUAL |
Width: | 3 mm |
Base Number Matches: | one |
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