model: | FM25L04B-GTR |
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Lead free: | Lead free |
Rohs certification or not: | accord with |
Lifecycle: | Active |
IHS Manufacturer: | CYPRESS SEMICONDUCTOR CORP |
Part package code: | SOIC |
Packing instructions: | SOP, SOP8,.25 |
Number of stitches: | eight |
Reach Compliance Code: | compliant |
ECCN code: | EAR99 |
HTS Code: | 8542.32.00.71 |
Risk level: | zero point eight three |
JESD-30 code: | R-PDSO-G8 |
JESD-609 code: | e4 |
Length: | 4.9 mm |
Memory density: | 4096 bit |
Memory IC type: | MEMORY CIRCUIT |
Memory width: | eight |
Humidity sensitivity level: | three |
Number of functions: | one |
Number of terminals: | eight |
Number of words: | 512 words |
Word number code: | five hundred and twelve |
Operating mode: | SYNCHRONOUS |
Maximum operating temperature: | 85 °C |
Minimum operating temperature: | -40 °C |
Organization: | 512X8 |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | SOP |
Encapsulation equivalent code: | SOP8,.25 |
Package shape: | RECTANGULAR |
Packaging form: | SMALL OUTLINE |
Peak reflux temperature (° C): | two hundred and sixty |
Power Supply: | 3/3.3 V |
Certification status: | Not Qualified |
Maximum height of seating surface: | 1.75 mm |
Maximum standby current: | 0.000006 A |
Subcategory: | SRAMs |
Maximum slewing rate: | 0.003 mA |
Maximum supply voltage (Vsup): | 3.6 V |
Minimum supply voltage (Vsup): | 2.7 V |
Nominal supply voltage (Vsup): | 3.3 V |
Surface mounting: | YES |
Technology: | CMOS |
Temperature class: | INDUSTRIAL |
Terminal surface layer: | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal type: | GULL WING |
Terminal pitch: | 1.27 mm |
Terminal location: | DUAL |
Maximum time at peak reflux temperature: | thirty |
Width: | 3.9 mm |
Base Number Matches: | one |
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