model: | FGA25N120ANTDTU |
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Rohs certification or not: | accord with |
Lifecycle: | Active |
IHS Manufacturer: | ON SEMICONDUCTOR |
Packing instructions: | , |
Reach Compliance Code: | compliant |
ECCN code: | EAR99 |
HTS Code: | 8541.29.00.95 |
Factory Lead Time: | 1 week |
Risk level: | zero point eight eight |
Samacsys Confidence: | four |
Samacsys Status: | Released |
2D Presentation: | https://componentsearchengine.com/2D/0T/866137.2.1.png |
Schematic Symbol: | https://componentsearchengine.com/symbol.php?partID=866137 |
PCB Footprint: | https://componentsearchengine.com/footprint.php?partID=866137 |
3D View: | https://componentsearchengine.com/viewer/3D.php?partID=866137 |
Samacsys PartID: | eight hundred and sixty-six thousand one hundred and thirty-seven |
Samacsys Image: | https://componentsearchengine.com/Images/9/FGA25N120ANTDTU.jpg |
Samacsys Thumbnail Image: | https://componentsearchengine.com/Thumbnails/2/FGA25N120ANTDTU.jpg |
Samacsys Pin Count: | three |
Samacsys Part Category: | Transistor IGBT |
Samacsys Package Category: | Transistor Outline, Vertical |
Samacsys Footprint Name: | TO-3P_1 |
Samacsys Released Date: | 2018-02-23 11:25:42 |
Is Samacsys: | N |
Maximum collector current (IC): | 25 A |
Maximum collector emitter voltage: | 1200 V |
Maximum threshold voltage of gate emitter: | 7.5 V |
Gate emitter maximum voltage: | 20 V |
JESD-609 code: | e3 |
Maximum operating temperature: | 150 °C |
Peak reflux temperature (° C): | NOT SPECIFIED |
Polarity/Channel Type: | N-CHANNEL |
Maximum power dissipation (Abs): | 312 W |
Subcategory: | Insulated Gate BIP Transistors |
Surface mounting: | NO |
Terminal surface layer: | Tin (Sn) |
Maximum time at peak reflux temperature: | NOT SPECIFIED |
Base Number Matches: | one |
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