FDD86102LZ-VB Chinese Information Application Article Market Situation Hot Spot Use Introduction - China IC Network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

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  •  FDD86102LZ-VB diagram
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  • FDD86102LZ-VB
  • number 12706 
  • manufactor VBsemi
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  •  FDD86102LZ-VB diagram
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  • number 58600 
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FDD86110 product parameters
model: FDD86110
Brand Name: ON Semiconductor
Lead free: Lead free
Lifecycle: Active
IHS Manufacturer: ON SEMICONDUCTOR
Packing instructions: SMALL OUTLINE, R-PSSO-G2
Manufacturer's package code: 369AS
Reach Compliance Code: not_compliant
ECCN code: EAR99
HTS Code: 8541.29.00.95
Factory Lead Time: 26 weeks
Risk level: zero point nine five
Is Samacsys: N
Avalanche energy efficiency grade (Eas): 135 mJ
Enclosure connection: DRAIN
to configure: SINGLE WITH BUILT-IN DIODE
Minimum drain source breakdown voltage: 100 V
Maximum drain current (Abs) (ID): 50 A
Maximum drain current (ID): 12.5 A
Maximum drain source on resistance: 0.0102 Ω
FET technology: METAL-OXIDE SEMICONDUCTOR
JEDEC-95 code: TO-252
JESD-30 code: R-PSSO-G2
JESD-609 code: e3
Humidity sensitivity level: one
Number of elements: one
Number of terminals: two
Operating mode: ENHANCEMENT MODE
Maximum operating temperature: 150 °C
Packaging body material: PLASTIC/EPOXY
Package shape: RECTANGULAR
Packaging form: SMALL OUTLINE
Peak reflux temperature (° C): NOT SPECIFIED
Polarity/Channel Type: N-CHANNEL
Maximum power dissipation (Abs): 127 W
Maximum pulse drain current (IDM): 60 A
Subcategory: FET General Purpose Power
Surface mounting: YES
Terminal surface layer: Tin (Sn)
Terminal type: GULL WING
Terminal location: SINGLE
Maximum time at peak reflux temperature: NOT SPECIFIED
Transistor applications: SWITCHING
Transistor element material: SILICON
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