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  • Shenzhen Xinfulin Electronics Co., Ltd

         This member has used this website for more than 15 years

  • FA5502M-TE1
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      This member has used this website for more than 11 years
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  • Shenzhen Xinmai Industrial Co., Ltd

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  • Qichuang Technology (Shanghai, Beijing, Qingdao) Co., Ltd

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  • Shenzhen Fortune Electronic Technology Co., Ltd

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  • Shenzhen Yichuangteng Electronic Technology Co., Ltd

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  • Shenzhen Lichuangyuan Technology Co., Ltd

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  • number 3000 
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Product parameters of product model FA5502M-TE1 and instructions for use of FA5502M-TE1

introduction

FA5502M-TE1 is a chip that integrates multiple functions and is widely used in modern electronic equipment. As a chip oriented to consumer electronics, industrial control and communication fields, FA5502M-TE1 has attracted extensive attention in the industry due to its superior performance and stability. This article will give a comprehensive introduction to FA5502M-TE1, including its parameters, manufacturer information, packaging and packaging, pin and circuit diagram descriptions, and specific use cases.

Chip Overview

FA5502M-TE1 is a high-performance multi-function chip, mainly used in power management, signal conditioning, data processing and other fields. The chip integrates a variety of digital and analog circuits, and has the characteristics of low power consumption, low noise and high efficiency, which makes it have a broad application prospect in mobile devices, household appliances, industrial automation and other fields.

Detailed parameters

The detailed parameters of FA5502M-TE1 include:

-Operating voltage range: 2.7V to 5.5V -Maximum operating frequency: nearly 200MHz -Power consumption: The standby power consumption is less than 10 µ A, and the working power consumption can change dynamically according to the load. -Input/output current: up to 20mA -Operating temperature range: - 40 ° C to 85 ° C -Package type: TSSOP-20 package -Features: including overvoltage protection, overcurrent protection and thermal shutdown functions.

It can be seen from these parameters that the design of FA5502M-TE1 fully considers the requirements of modern electronic equipment for low power consumption and high performance to ensure the stability and reliability of its operation.

Manufacturer, packaging and packaging

The manufacturer of FA5502M-TE1 is a well-known electronic component supplier. The company has a profound technological accumulation and market influence in the field of integrated circuits. The chip is usually packaged with TSSOP-20, which has good heat dissipation characteristics and advantages of miniaturization, and is suitable for use in electronic products with limited volume.

In terms of packaging, the company usually provides anti-static packaging to reduce the loss during transportation and storage. In addition, manufacturers also provide different quantities of packaging options to meet the needs of different customers.

Pin and circuit diagram description

The pin layout of the FA5502M-TE1 contains several important ports. The functions of each port are as follows:

1. VCC: power supply pin, connected to power supply. 2. GND: ground pin, used to connect the ground wire of the circuit. 3. IN: input pin, receiving external signal input. 4. OUT: output pin, output corresponding signal. 5. EN: enable pin, control the working state of the chip. 6. PWM: pulse width modulation input, suitable for adjusting output power. 7. SENSE: current detection pin, used to monitor current status. 8. AGND: analog ground pin, which provides reference voltage for analog circuit. 9. DIO: digital input/output port, which can be used for digital signal processing.

In the circuit diagram, the typical application circuit of FA5502M-TE1 shows how to connect external equipment and power supply. A circuit is formed between pins through resistance, capacitance and other components to ensure stable signal transmission and processing.

Use Cases

In practical applications, FA5502M-TE1 is widely used in the power management system of mobile devices. For example, in the design of a smart phone, FA5502M-TE1 is used to manage the charging and discharging process of the battery. Through its over-voltage protection and over-current protection functions, the chip can effectively extend the service life of the battery and ensure that the device will not have unexpected battery failure during use.

In addition, FA5502M-TE1 is also widely used in the field of industrial control. For example, in the automatic control system, FA5502M-TE1 can receive control signals and adjust the output to maintain the stability of the system. Its high frequency and low power characteristics make it very suitable for time sensitive real-time control scenarios.

In recent years, with the development of the Internet of Things, FA5502M-TE1 has also been used in various smart home devices. In these applications, the chip provides monitoring and management of device status, and improves the security and convenience of smart home. For example, how to realize wireless control of smart light bulb through FA5502M-TE1 reflects its application potential in modern household appliances.

In the field of data processing, FA5502M-TE1 also reflects its powerful processing capability. For example, in the data acquisition system, the chip can efficiently process sensor data and convert it into usable signals, which are further transmitted to the upper system for statistical analysis. Its design characteristics in noise suppression and signal integrity make data processing more stable and efficient.

The unique application scenario of FA5502M-TE1 makes it an indispensable component in the design process of electronic products. Whether it is a personal consumer device or an industrial automation control system, the chip performs well. With the development of technology, the application prospect of FA5502M-TE1 will be broader, and technological progress will continue to promote the expansion and improvement of its functions.

Direct train with order
FA5502P product parameters
model: FA5502P
Lifecycle: Active
Part package code: DIP
Packing instructions: DIP,
Number of stitches: sixteen
Reach Compliance Code: unknown
ECCN code: EAR99
HTS Code: 8542.39.00.01
Risk level: five point seven two
Analog integrated circuits - Other types: POWER FACTOR CONTROLLER
Control mode: CURRENT-MODE
Control technology: PULSE WIDTH MODULATION
Maximum input voltage: 28 V
Minimum input voltage: 10 V
Nominal input voltage: 18 V
JESD-30 code: R-PDIP-T16
Length: 19.4 mm
Number of functions: one
Number of terminals: sixteen
Maximum operating temperature: 105 °C
Minimum operating temperature: -30 °C
Maximum output current: 1.5 A
Packaging body material: PLASTIC/EPOXY
Encapsulation code: DIP
Package shape: RECTANGULAR
Packaging form: IN-LINE
Certification status: Not Qualified
Maximum height of seating surface: 4.3 mm
Surface mounting: NO
Switcher configuration: SINGLE
Maximum switching frequency: 150 kHz
Technology: CMOS
Temperature class: OTHER
Terminal type: THROUGH-HOLE
Terminal pitch: 2.54 mm
Terminal location: DUAL
Width: 7.62 mm
Base Number Matches: one
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