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  • Shenzhen Xinfulin Electronics Co., Ltd

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  • Shenzhen Xinmai Industrial Co., Ltd

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Product parameters of product model FA5501N-D1-TE1 and instructions for use of FA5501N-D1-TE1

Overview of chip FA5501N-D1-TE1

FA5501N-D1-TE1 is a high-performance integrated circuit, which is widely used in power management and regulation applications. The chip is designed specifically for high-performance, compact power converters to meet the requirements of modern electronic equipment for power efficiency and volume. FA5501N-D1-TE1 has a high degree of integration and powerful functions, which makes it get attention in many fields, such as consumer electronics, industrial automation, communication equipment, etc.

FA5501N-D1-TE1 uses an advanced process technology, which can generally maintain good performance under multiple operating conditions. Its core design includes voltage regulator, monitoring and protection function unit, so as to realize real-time power management. Through its unique design architecture, FA5501N-D1-TE1 can still provide stable and reliable power output under high load working conditions.

Detailed parameters of chip FA5501N-D1-TE1

The detailed parameters of FA5501N-D1-TE1 are as follows:

-Operating voltage range: 4.5V to 16V -Output voltage range: adjustable, usually 1.5V to 10V -Output current: up to 3A -Switching frequency: 300KHz to 1.5MHz, adjustable -Power conversion efficiency: up to 95% -Thermal protection feature: integrated thermal shutdown function -Current mode control: it has current mode control function to improve power supply stability -Package type: TSSOP-16 package

These parameters show the advantages of FA5501N-D1-TE1. Especially in terms of power conversion efficiency and output current, FA5501N-D1-TE1 stands out, making it reach a new height in the combination of performance and function.

Manufacturer, packaging and packaging of chip FA5501N-D1-TE1

FA5501N-D1-TE1 is produced by a famous semiconductor manufacturer, which has a high reputation in the field of power management IC. The chip is usually packaged in the form of TSSOP-16, which not only saves space, but also improves the thermal and electrical performance, which is crucial for the design of high-density circuit boards.

In terms of packaging, FA5501N-D1-TE1 is usually supplied in the form of tape and Reel, which can facilitate automatic placement in large quantities and meet the requirements of production automation. Each roll of tape contains a certain number of chips, depending on the manufacturer's standard.

Description of pin and circuit diagram of chip FA5501N-D1-TE1

FA5501N-D1-TE1 has 16 pins, and the functional characteristics of each pin are as follows:

1. VIN: input voltage pin, used to connect power supply. 2. GND: ground pin to reduce noise and interference. 3. SW: power switch pin, connecting external inductance and diode. 4. COMP: compensation pin, used to control feedback and stability. 5. CSN: current sensing pin, used for feedback current mode regulation. 6. FB: feedback pin, connect output voltage to adjust output. 7. VOUT: output voltage pin, connected to load. 8. SS: Soft start pin to prevent the output current from being too high. 9. SEL: Select the switch frequency pin and adjust the frequency. 10. PGND: power grounding pin to reduce power loss. 11. VCC: power supply pin, connected to the power supply of internal circuit. 12. EN: enable pin, used to turn on or off the chip. 13. RT: frequency setting pin, which can connect external resistance to set frequency. 14. ISW: switch current pin, used to monitor switch status. 15. TSD: temperature monitoring pin to realize thermal protection. 16. NC: No pin connection, reserved for future use.

The reasonable layout and design of these pins enable the FA5501N-D1-TE1 to achieve efficient power management in complex circuits.

The circuit diagram is usually composed of FA5501N-D1-TE1 pin connections. The core of the whole circuit is to control the switch on and off through the SW pin to achieve the regulation of voltage output. In the circuit diagram, the power input and output loads, as well as the connection forms of external components such as current induced resistance, capacitance and inductance can be displayed.

Use case of chip FA5501N-D1-TE1

FA5501N-D1-TE1 is widely used in various electronic products, and its main use cases include:

1. Portable electronic equipment: In smart phones and tablets, FA5501N-D1-TE1 can be used as a power management unit to achieve efficient battery charging and power supply and optimize battery life.

2. Industrial automation control: In the automatic control system, the chip can drive sensors, actuators and other external devices to ensure stable power output under high load conditions.

3. LED driving power supply: FA5501N-D1-TE1 can be used to drive high-power LED lights, especially in applications requiring high brightness and stable current, such as billboards and lighting equipment.

4. Communication equipment: In wireless communication equipment, the chip can ensure stable power supply, help overcome signal interference, and improve communication quality.

5. Household appliances: In household appliances, such as washing machines, microwave ovens and other devices, FA5501N-D1-TE1 is widely used in power management to improve operating efficiency and safety.

By using FA5501N-D1-TE1, designers can more easily realize efficient power management and make the design more flexible.

Direct train with order
FA5501P product parameters
model: FA5501P
Lifecycle: Active
IHS Manufacturer: FUJI ELECTRIC CO LTD
Part package code: DIP
Packing instructions: DIP,
Number of stitches: eight
Reach Compliance Code: unknown
ECCN code: EAR99
HTS Code: 8542.39.00.01
Risk level: five point seven four
Analog integrated circuits - Other types: SWITCHING CONTROLLER
Control mode: CURRENT-MODE
Maximum input voltage: 28 V
Minimum input voltage: 10 V
Nominal input voltage: 12 V
JESD-30 code: R-PDIP-T8
Number of functions: one
Number of terminals: eight
Maximum operating temperature: 105 °C
Minimum operating temperature: -30 °C
Maximum output current: 1 A
Packaging body material: PLASTIC/EPOXY
Encapsulation code: DIP
Package shape: RECTANGULAR
Packaging form: IN-LINE
Certification status: Not Qualified
Surface mounting: NO
Switcher configuration: SINGLE
Technology: CMOS
Temperature class: OTHER
Terminal type: THROUGH-HOLE
Terminal location: DUAL
Base Number Matches: one
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