EPM1270L256C5N brand new original schematic diagram Functional circuit principle of each pin Chip pin definition - China IC network - Core 37
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  • Shenzhen Xinfulin Electronics Co., Ltd

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  •  QQ:2881495808 QQ:308365177
  • thirteen billion four hundred and eighteen million five hundred and sixty-four thousand three hundred and thirty-seven  QQ:2881495808 QQ:308365177
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EPM1270M100C3N product parameters
model: EPM1270M100C3N
Rohs certification or not: accord with
Lifecycle: Active
IHS Manufacturer: INTEL CORP
Packing instructions: BGA,
Reach Compliance Code: compliant
HTS Code: 8542.39.00.01
Risk level: five point six two
Other features: IT CAN ALSO OPERATE AT 3.3V
JESD-30 code: S-PBGA-B100
JESD-609 code: e1
Number of special inputs:
Number of I/O lines:
Number of terminals: one hundred
Organization: 0 DEDICATED INPUTS, 0 I/O
Output function: MACROCELL
Packaging body material: PLASTIC/EPOXY
Encapsulation code: BGA
Package shape: SQUARE
Packaging form: GRID ARRAY
Peak reflux temperature (° C): two hundred and sixty
Programmable logic type: FLASH PLD
Certification status: Not Qualified
Maximum supply voltage: 2.625 V
Minimum supply voltage: 2.375 V
Nominal supply voltage: 2.5 V
Surface mounting: YES
Terminal surface layer: TIN SILVER COPPER
Terminal type: BALL
Terminal location: BOTTOM
Maximum time at peak reflux temperature: forty
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