model: | EP3C5F256C8N |
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Rohs certification or not: | accord with |
Lifecycle: | Active |
Packing instructions: | 17 X 17 MM, 1.55 MM HEIGHT, 1 MM PITCH, LEAD FREE, FBGA-256 |
Reach Compliance Code: | compliant |
ECCN code: | EAR99 |
HTS Code: | 8542.39.00.01 |
Risk level: | one point five nine |
Maximum clock frequency: | 472.5 MHz |
JESD-30 code: | R-PBGA-B256 |
JESD-609 code: | e1 |
Length: | 17 mm |
Humidity sensitivity level: | three |
Number of configurable logical blocks: | five thousand one hundred and thirty-six |
Number of entries: | one hundred and eighty-two |
Number of logical units: | five thousand one hundred and thirty-six |
Output times: | one hundred and eighty-two |
Number of terminals: | two hundred and fifty-six |
Maximum operating temperature: | 85 °C |
Minimum operating temperature: | |
Organization: | 5136 CLBS |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | LBGA |
Encapsulation equivalent code: | BGA256,16X16,40 |
Package shape: | RECTANGULAR |
Packaging form: | GRID ARRAY, LOW PROFILE |
Peak reflux temperature (° C): | two hundred and sixty |
Programmable logic type: | FIELD PROGRAMMABLE GATE ARRAY |
Certification status: | Not Qualified |
Maximum height of seating surface: | 1.55 mm |
Subcategory: | Field Programmable Gate Arrays |
Maximum supply voltage: | 1.25 V |
Minimum supply voltage: | 1.15 V |
Nominal supply voltage: | 1.2 V |
Surface mounting: | YES |
Technology: | CMOS |
Temperature class: | OTHER |
Terminal surface layer: | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal type: | BALL |
Terminal pitch: | 1 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | thirty |
Width: | 17 mm |
Base Number Matches: | one |
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