| model: | EP2S130F780I5 |
|
| Rohs certification or not: | Non conformance |
| Lifecycle: | Active |
| IHS Manufacturer: | INTEL CORP |
| Packing instructions: | BGA, BGA780,28X28,40 |
| Reach Compliance Code： | compliant |
| Risk level: | five point five nine |
| JESD-30 code: | S-PBGA-B780 |
| JESD-609 code: | e0 |
| Length: | 29 mm |
| Number of configurable logical blocks: | seven thousand and forty-seven |
| Number of entries: | five hundred and thirty-four |
| Number of logical units: | one hundred and thirty-two thousand five hundred and forty |
| Output times: | five hundred and twenty-six |
| Number of terminals: | seven hundred and eighty |
| Organization: | 7047 CLBS |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | BGA |
| Encapsulation equivalent code: | BGA780,28X28,40 |
| Package shape: | SQUARE |
| Packaging form: | GRID ARRAY |
| Peak reflux temperature (° C): | two hundred and twenty |
| Power Supply: | 1.2,1.5/3.3,3.3 V |
| Programmable logic type: | FIELD PROGRAMMABLE GATE ARRAY |
| Certification status: | Not Qualified |
| Maximum height of seating surface: | 3.5 mm |
| Subcategory: | Field Programmable Gate Arrays |
| Maximum supply voltage: | 1.25 V |
| Minimum supply voltage: | 1.15 V |
| Nominal supply voltage: | 1.2 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Terminal surface layer: | TIN LEAD |
| Terminal type: | BALL |
| Terminal pitch: | 1 mm |
| Terminal location: | BOTTOM |
| Maximum time at peak reflux temperature: | thirty |
| Width: | 29 mm |
|
