model: | EP2C8F256I8N |
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Rohs certification or not: | accord with |
Lifecycle: | Active |
IHS Manufacturer: | INTEL CORP |
Packing instructions: | LEAD FREE, FBGA-256 |
Reach Compliance Code: | compliant |
ECCN code: | EAR99 |
HTS Code: | 8542.39.00.01 |
Risk level: | one point four one |
Other features: | ALSO REQUIRES 3.3 SUPPLY |
Maximum clock frequency: | 402.5 MHz |
JESD-30 code: | S-PBGA-B256 |
JESD-609 code: | e1 |
Length: | 17 mm |
Humidity sensitivity level: | three |
Number of configurable logical blocks: | five hundred and sixteen |
Number of entries: | one hundred and eighty-two |
Number of logical units: | eight thousand two hundred and fifty-six |
Output times: | one hundred and seventy-four |
Number of terminals: | two hundred and fifty-six |
Organization: | 516 CLBS |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | LBGA |
Encapsulation equivalent code: | BGA256,16X16,40 |
Package shape: | SQUARE |
Packaging form: | GRID ARRAY, LOW PROFILE |
Peak reflux temperature (° C): | two hundred and sixty |
Power Supply: | 1.2,1.5/3.3,3.3 V |
Programmable logic type: | FIELD PROGRAMMABLE GATE ARRAY |
Certification status: | Not Qualified |
Maximum height of seating surface: | 1.55 mm |
Subcategory: | Field Programmable Gate Arrays |
Maximum supply voltage: | 1.25 V |
Minimum supply voltage: | 1.15 V |
Nominal supply voltage: | 1.2 V |
Surface mounting: | YES |
Technology: | CMOS |
Terminal surface layer: | TIN SILVER COPPER |
Terminal type: | BALL |
Terminal pitch: | 1 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | forty |
Width: | 17 mm |
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