model: | EP2AGX190FF35I3N |
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Rohs certification or not: | accord with |
Lifecycle: | Transferred |
IHS Manufacturer: | ALTERA CORP |
Part package code: | BGA |
Packing instructions: | HBGA, BGA1152,34X34,40 |
Number of stitches: | one thousand one hundred and fifty-two |
Reach Compliance Code: | compliant |
ECCN code: | 3A001.A.7.A |
HTS Code: | 8542.39.00.01 |
Risk level: | five point two eight |
Maximum clock frequency: | 500 MHz |
JESD-30 code: | S-PBGA-B1152 |
JESD-609 code: | e1 |
Length: | 35 mm |
Number of entries: | six hundred and twelve |
Number of logical units: | one hundred and eighty-one thousand one hundred and sixty-five |
Output times: | six hundred and twelve |
Number of terminals: | one thousand one hundred and fifty-two |
Maximum operating temperature: | 100 °C |
Minimum operating temperature: | -40 °C |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | HBGA |
Encapsulation equivalent code: | BGA1152,34X34,40 |
Package shape: | SQUARE |
Packaging form: | GRID ARRAY, HEAT SINK/SLUG |
Peak reflux temperature (° C): | NOT SPECIFIED |
Power Supply: | 0.9,1.2/3.3,1.5,2.5 V |
Programmable logic type: | FIELD PROGRAMMABLE GATE ARRAY |
Certification status: | Not Qualified |
Maximum height of seating surface: | 2.6 mm |
Subcategory: | Field Programmable Gate Arrays |
Maximum supply voltage: | 0.93 V |
Minimum supply voltage: | 0.87 V |
Nominal supply voltage: | 0.9 V |
Surface mounting: | YES |
Technology: | CMOS |
Temperature class: | INDUSTRIAL |
Terminal surface layer: | TIN SILVER COPPER |
Terminal type: | BALL |
Terminal pitch: | 1 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | NOT SPECIFIED |
Width: | 35 mm |
Base Number Matches: | one |
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