model: | EP1S20F672I7 |
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Lead free: | Lead |
Rohs certification or not: | Non conformance |
Lifecycle: | Transferred |
Part package code: | BGA |
Packing instructions: | 35 X 35 MM, 1.27 MM PITCH, BGA-672 |
Number of stitches: | six hundred and seventy-two |
Reach Compliance Code: | not_compliant |
ECCN code: | 3A991 |
HTS Code: | 8542.39.00.01 |
Risk level: | seven point seven |
JESD-30 code: | S-PBGA-B672 |
JESD-609 code: | e0 |
Humidity sensitivity level: | three |
Number of entries: | five hundred and eighty-six |
Number of logical units: | eighteen thousand four hundred and sixty |
Output times: | five hundred and eighty-six |
Number of terminals: | six hundred and seventy-two |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | BGA |
Encapsulation equivalent code: | BGA672,26X26,40 |
Package shape: | SQUARE |
Packaging form: | GRID ARRAY |
Peak reflux temperature (° C): | two hundred and twenty |
Power Supply: | 1.5,1.5/3.3 V |
Programmable logic type: | FIELD PROGRAMMABLE GATE ARRAY |
Certification status: | Not Qualified |
Subcategory: | Field Programmable Gate Arrays |
Maximum supply voltage: | 1.575 V |
Minimum supply voltage: | 1.425 V |
Nominal supply voltage: | 1.5 V |
Surface mounting: | YES |
Technology: | CMOS |
Terminal surface layer: | Tin/Lead (Sn63Pb37) |
Terminal type: | BALL |
Terminal pitch: | 1 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | twenty |
Base Number Matches: | one |
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