| model: | BR25H010FJ-WCE2 |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Not Recommended |
| Part package code: | SOIC |
| Packing instructions: | LSOP, SOP8,.25 |
| Number of stitches: | eight |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.32.00.51 |
| Risk level: | five point six six |
| Maximum clock frequency (fCLK): | 5 MHz |
| Data retention time - minimum: | forty |
| Durability: | 1000000 Write/Erase Cycles |
| JESD-30 code: | R-PDSO-G8 |
| Length: | 4.9 mm |
| Memory density: | 1024 bit |
| Memory IC type: | EEPROM |
| Memory width: | eight |
| Number of functions: | one |
| Number of terminals: | eight |
| Number of words: | 128 words |
| Word number code: | one hundred and twenty-eight |
| Operating mode: | SYNCHRONOUS |
| Maximum operating temperature: | 125 °C |
| Minimum operating temperature: | -40 °C |
| Organization: | 128X8 |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | LSOP |
| Encapsulation equivalent code: | SOP8,.25 |
| Package shape: | RECTANGULAR |
| Packaging form: | SMALL OUTLINE, LOW PROFILE |
| Parallel/serial: | SERIAL |
| Peak reflux temperature (° C): | NOT SPECIFIED |
| Power Supply: | 3/5 V |
| Certification status: | Not Qualified |
| Filter level: | AEC-Q100 |
| Maximum height of seating surface: | 1.65 mm |
| Serial bus type: | SPI |
| Maximum standby current: | 0.00001 A |
| Subcategory: | EEPROMs |
| Maximum slewing rate: | 0.003 mA |
| Maximum supply voltage (Vsup): | 5.5 V |
| Minimum supply voltage (Vsup): | 2.5 V |
| Nominal supply voltage (Vsup): | 5 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | AUTOMOTIVE |
| Terminal type: | GULL WING |
| Terminal pitch: | 1.27 mm |
| Terminal location: | DUAL |
| Maximum time at peak reflux temperature: | NOT SPECIFIED |
| Width: | 3.9 mm |
| Maximum write cycle time (tWC): | 5 ms |
| Write Protect: | HARDWARE |
| Base Number Matches： | one |
|
