model: | ADSP-21261SKBC-150 |
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Lead free: | Lead |
Rohs certification or not: | Non conformance |
Lifecycle: | Active |
Part package code: | BGA |
Packing instructions: | LFBGA, |
Number of stitches: | one hundred and thirty-six |
Reach Compliance Code: | unknown |
Risk level: | five point seven eight |
Other features: | ALSO REQUIRES 3.3V SUPPLY |
Address bus width: | sixteen |
Barrel Shifter: | YES |
Boundary scan: | YES |
Maximum clock frequency: | 50 MHz |
External data bus width: | sixteen |
Format: | FLOATING POINT |
Internal bus architecture: | MULTIPLE |
JESD-30 code: | S-PBGA-B136 |
JESD-609 code: | e0 |
Length: | 12 mm |
Low power mode: | NO |
Humidity sensitivity level: | three |
Number of terminals: | one hundred and thirty-six |
Maximum operating temperature: | 70 °C |
Minimum operating temperature: | |
Packaging body material: | PLASTIC/EPOXY |
Encapsulation code: | LFBGA |
Package shape: | SQUARE |
Packaging form: | GRID ARRAY, LOW PROFILE, FINE PITCH |
Peak reflux temperature (° C): | two hundred and forty |
Certification status: | COMMERCIAL |
Maximum height of seating surface: | 1.7 mm |
Maximum supply voltage: | 1.26 V |
Minimum supply voltage: | 1.14 V |
Nominal supply voltage: | 1.2 V |
Surface mounting: | YES |
Technology: | CMOS |
Temperature class: | COMMERCIAL |
Terminal surface layer: | TIN LEAD SILVER |
Terminal type: | BALL |
Terminal pitch: | 0.8 mm |
Terminal location: | BOTTOM |
Maximum time at peak reflux temperature: | thirty |
Width: | 12 mm |
UPs/uCs/peripheral integrated circuit type: | DIGITAL SIGNAL PROCESSOR, OTHER |
Base Number Matches: | one |
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