| model: | ADC11DV200CISQ/NOPB |
|
| Brand Name： | Texas Instruments |
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Active |
| Part package code: | QFN |
| Packing instructions: | HVQCCN, LCC60,.35SQ,20 |
| Number of stitches: | sixty |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.39.00.01 |
| Risk level: | five point two one |
| Maximum analog input voltage: | 1 V |
| Minimum analog input voltage: | -1.5 V |
| Maximum conversion time: | 0.005 µs |
| Converter type: | ADC, PROPRIETARY METHOD |
| JESD-30 code: | S-PQCC-N60 |
| JESD-609 code: | e3 |
| Length: | 9 mm |
| Maximum linear error (EL): | 0.0732% |
| Humidity sensitivity level: | three |
| Number of analog input channels: | two |
| Number of digits: | eleven |
| Number of functions: | one |
| Number of terminals: | sixty |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| Output Bitcode: | OFFSET BINARY, 2'S COMPLEMENT BINARY |
| Output format: | PARALLEL, WORD |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | HVQCCN |
| Encapsulation equivalent code: | LCC60,.35SQ,20 |
| Package shape: | SQUARE |
| Packaging form: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak reflux temperature (° C): | two hundred and sixty |
| Power Supply: | 1.8 V |
| Certification status: | Not Qualified |
| Sample rate: | 200 MHz |
| Sample and hold/track and hold: | SAMPLE |
| Maximum height of seating surface: | 0.8 mm |
| Subcategory: | Analog to Digital Converters |
| Maximum slewing rate: | 41 mA |
| Nominal supply voltage: | 1.8 V |
| Surface mounting: | YES |
| Technology: | CMOS |
| Temperature class: | INDUSTRIAL |
| Terminal surface layer: | Matte Tin (Sn) |
| Terminal type: | NO LEAD |
| Terminal pitch: | 0.5 mm |
| Terminal location: | QUAD |
| Maximum time at peak reflux temperature: | NOT SPECIFIED |
| Width: | 9 mm |
| Base Number Matches： | one |
|
