| model: | 24LC64F-I/P |
|
| Lead free: | Lead free |
| Rohs certification or not: | accord with |
| Lifecycle: | Active |
| IHS Manufacturer: | MICROCHIP TECHNOLOGY INC |
| Part package code: | DIP |
| Packing instructions: | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 |
| Number of stitches: | eight |
| Reach Compliance Code： | compliant |
| ECCN code: | EAR99 |
| HTS Code: | 8542.32.00.51 |
| Factory Lead Time： | 6 weeks |
| Risk level: | one point four seven |
| Samacsys Confidence： | three |
| Samacsys Status： | Released |
| 2D Presentation： | https://componentsearchengine.com/2D/0T/676473.2.1.png |
| Schematic Symbol： | https://componentsearchengine.com/symbol.php?partID=676473 |
| PCB Footprint： | https://componentsearchengine.com/footprint.php?partID=676473 |
| 3D View： | https://componentsearchengine.com/viewer/3D.php?partID=676473 |
| Samacsys PartID： | six hundred and seventy-six thousand four hundred and seventy-three |
| Samacsys Image： | https://componentsearchengine.com/Images/9/24LC64F-I/P.jpg |
| Samacsys Thumbnail Image： | https://componentsearchengine.com/Thumbnails/2/24LC64F-I/P.jpg |
| Samacsys Pin Count： | eight |
| Samacsys Part Category： | Integrated Circuit |
| Samacsys Package Category： | Dual-In-Line Packages |
| Samacsys Footprint Name： | 24LC64F-I/P |
| Samacsys Released Date： | 2019-02-22 14:29:38 |
| Is Samacsys： | N |
| Maximum clock frequency (fCLK): | 0.4 MHz |
| Data retention time - minimum: | two hundred |
| Durability: | 1000000 Write/Erase Cycles |
| I2C control byte: | 1010DDDR |
| JESD-30 code: | R-PDIP-T8 |
| JESD-609 code: | e3 |
| Length: | 9.271 mm |
| Memory density: | 65536 bit |
| Memory IC type: | EEPROM |
| Memory width: | eight |
| Number of functions: | one |
| Number of terminals: | eight |
| Number of words: | 8192 words |
| Word number code: | eight thousand |
| Operating mode: | SYNCHRONOUS |
| Maximum operating temperature: | 85 °C |
| Minimum operating temperature: | -40 °C |
| Organization: | 8KX8 |
| Packaging body material: | PLASTIC/EPOXY |
| Encapsulation code: | DIP |
| Encapsulation equivalent code: | DIP8,.3 |
| Package shape: | RECTANGULAR |
| Packaging form: | IN-LINE |
| Parallel/serial: | SERIAL |
| Peak reflux temperature (° C): | NOT APPLICABLE |
| Power Supply: | 3/5 V |
| Certification status: | Not Qualified |
| Maximum height of seating surface: | 5.334 mm |
| Serial bus type: | I2C |
| Maximum standby current: | 0.000001 A |
| Subcategory: | EEPROMs |
| Maximum slewing rate: | 0.003 mA |
| Maximum supply voltage (Vsup): | 5.5 V |
| Minimum supply voltage (Vsup): | 2.5 V |
| Nominal supply voltage (Vsup): | 5 V |
| Surface mounting: | NO |
| Technology: | CMOS |
| Temperature class: | INDUSTRIAL |
| Terminal surface layer: | Matte Tin (Sn) - annealed |
| Terminal type: | THROUGH-HOLE |
| Terminal pitch: | 2.54 mm |
| Terminal location: | DUAL |
| Maximum time at peak reflux temperature: | NOT APPLICABLE |
| Width: | 7.62 mm |
| Maximum write cycle time (tWC): | 5 ms |
| Write Protect: | HARDWARE |
| Base Number Matches： | one |
|
