LOCTITE 3220， Epoxy resin, adhesive and sealant Optical communication sealant
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
LOCTITE 3220， Epoxy resin, adhesive and sealant Optical communication sealant Reflective adhesive
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
Light reflection
Heat curing
Application of adhesives and sealants
Typical application LED, image sensor or multimedia card
(MMC) Assembly
LOCTITE 3220W is designed for heat sensitivity
Optoelectronic components and other microelectronic devices.
The reflective properties of this material.
Loctite 3220W is the white version of Loctite 3220
an adhesive
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire wire defoamer parallel sealing and welding glue dispenser wafer cleaning liquid crystal circular scribing protective liquid.
LOCTITE 3220， Epoxy resin, adhesive and sealant Optical communication sealant Reflective adhesive
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
Light reflection
Heat curing
Application of adhesives and sealants
Typical application LED, image sensor or multimedia card
(MMC) Assembly
LOCTITE 3220W is designed for heat sensitivity
Optoelectronic components and other microelectronic devices.
The reflective properties of this material.
Loctite 3220W is the white version adhesive of Loctite 3220
Beijing Xiyuan Technology Co., Ltd
With the continuous upgrading of electronic products and semiconductor products, Xiyuan Technology also provides good protection for the electronic semiconductor industry with the strong support of the state for the high-tech industry.
Xiyuan Technology Electronic Materials:
Potting glue: Lodhenhan High Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments TSV Electroplating Equipment Bonding Machine Parallel Sealing Welder.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The scope of application involves electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card, radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding of liquid crystal circles, thinning of bond alloy wires and other fields.
In 2017, Xiyuan Technology started joint research and development of integrated circuit/discrete device materials, domestic conductive silver adhesive insulation adhesive gold solder and other products. It has been recognized by China Electronics Technology Group/Aerospace Science and Industry Group and other enterprises. It has passed the relevant test certification of GJB.
LOCTITE 3220， Epoxy resin, adhesive and sealant Optical communication sealant Reflective adhesive
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
Light reflection
Heat curing
Application of adhesives and sealants
Typical application LED, image sensor or multimedia card
(MMC) Assembly
LOCTITE 3220W is designed for heat sensitivity
Optoelectronic components and other microelectronic devices.
The reflective properties of this material.
Loctite 3220W is the white version adhesive of Loctite 3220
Ablestik：
Conductive silver glue: mainly engaged in ABLEBOND 84-1A, 84-1LMI, 84-1LMINB (B1), 84-1LMISR4, 84-1LMIT (T1), 826-1DS, 826-2, 2600AT, 2600BT, 2185A, 2030SC, 2100A, 3185, 8290, 8340, 8360, 8352L, 968-2, 979-1, 71-1, JM7000 and a series of products, suitable for semiconductor (IC) packaging (such as DIP/SOP/TO-92/BGA...) LED (such as ordinary LED/LAMP/high-power tube/digital tube...) It is used in various processes such as sticking, dispensing and backing
Insulating adhesive: mainly engaged in ABLEBOND84-3, 84-3J, 84-3LV, 84-3MV, 789-3, 789-4, 2025D, 2025M, 2035SC, 8384, 8387A, 8387B, 2039H, DX-10, DX-20-4 and a series of products, which are suitable for semiconductor (IC) packaging, camera (CMOS/CCD) process, LED, smart card and other fields, and are used for various pastes, or sticking and other processes
UV adhesive: mainly engaged in a series of UV curing adhesives such as ABLELUXHGA-3E, HGA-3S, A4021T, A4035T, A4039T, A4061T, A4083T, A4086T, A4088T, A4502, CC4310, AA50T, BF-4, OG RFI146T, which are suitable for photoelectric, photoelectric instrument, optical fiber, mobile phone camera (CMOS) and other fields; For example, phone camera Lens fixation, fiber coupler, laser, jumper, attenuator, detector, etc.
Adhesive film: mainly engaged in ABLEFILM506, 508, 550S, 561K, 570K, 5020, 5020K, 5025E and a series of products, suitable for various electronic products, military products, power supplies, etc.
Bottom filling glue: FP4450, UF1173, 4531, 4451 and other series.
Epoxy resin adhesive system, with low moisture absorption of silver adhesive, is used for packaging and bonding of electronic components and components such as LCD, LED, wireless wired communication equipment, crystal oscillator, integrated circuit chip, etc., as well as bonding between metals.
Product benefits
N Suitable for high-speed dispensing process, with thixotropy and no creeping phenomenon
N Meet the requirements of high temperature resistance
Bonding force of n
85 ℃/85% RH stability of n
Domestic chip conductive adhesive, H20E domestic substitute conductive adhesive, insulating adhesive 9969 conductive adhesive 9973 insulating adhesive. LOCTITE 3220， Epoxy resin, adhesive and sealant Optical communication sealant Reflective adhesive
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
Light reflection
Heat curing
Application of adhesives and sealants
Typical application LED, image sensor or multimedia card
(MMC) Assembly
LOCTITE 3220W is designed for heat sensitivity
Optoelectronic components and other microelectronic devices.
The reflective properties of this material.
Loctite 3220W is the white version adhesive of Loctite 3220
Ablestik：
Conductive silver glue: mainly engaged in ABLEBOND 84-1A, 84-1LMI, 84-1LMINB (B1), 84-1LMISR4, 84-1LMIT (T1), 826-1DS, 826-2, 2600AT, 2600BT, 2185A, 2030SC, 2100A, 3185, 8290, 8340, 8360, 8352L, 968-2, 979-1, 71-1, JM7000 and a series of products, suitable for semiconductor (IC) packaging (such as DIP/SOP/TO-92/BGA...) LED (such as ordinary LED/LAMP/high-power tube/digital tube...) It is used in various processes such as sticking, dispensing and backing
Insulating adhesive: mainly engaged in ABLEBOND84-3, 84-3J, 84-3LV, 84-3MV, 789-3, 789-4, 2025D, 2025M, 2035SC, 8384, 8387A, 8387B, 2039H, DX-10, DX-20-4 and a series of products, which are suitable for semiconductor (IC) packaging, camera (CMOS/CCD) process, LED, smart card and other fields, and are used for various pastes, or sticking and other processes
UV adhesive: mainly engaged in a series of UV curing adhesives such as ABLELUXHGA-3E, HGA-3S, A4021T, A4035T, A4039T, A4061T, A4083T, A4086T, A4088T, A4502, CC4310, AA50T, BF-4, OG RFI146T, which are suitable for photoelectric, photoelectric instrument, optical fiber, mobile phone camera (CMOS) and other fields; For example, phone camera Lens fixation, fiber coupler, laser, jumper, attenuator, detector, etc.
Adhesive film: mainly engaged in ABLEFILM506, 508, 550S, 561K, 570K, 5020, 5020K, 5025E and a series of products, suitable for various electronic products, military products, power supplies, etc.
Bottom filling glue: FP4450, UF1173, 4531, 4451 and other series.
Epoxy resin adhesive system, with low moisture absorption of silver adhesive, is used for packaging and bonding of electronic components and components such as LCD, LED, wireless wired communication equipment, crystal oscillator, integrated circuit chip, etc., as well as bonding between metals.
Product benefits
N Suitable for high-speed dispensing process, with thixotropy and no creeping phenomenon
N Meet the requirements of high temperature resistance
Bonding force of n
85 ℃/85% RH stability of n
Domestic chip conductive adhesive, H20E domestic substitute conductive adhesive, insulating adhesive 9969 conductive adhesive 9973 insulating adhesive.
LOCTITE 3220， Epoxy resin, adhesive and sealant Optical communication sealant Reflective adhesive
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
Light reflection
Heat curing
Application of adhesives and sealants
Typical application LED, image sensor or multimedia card
(MMC) Assembly
LOCTITE 3220W is designed for heat sensitivity
Optoelectronic components and other microelectronic devices.
The reflective properties of this material.
Loctite 3220W is the white version adhesive of Loctite 3220
LOCTITE 3220， Epoxy resin, adhesive and sealant Optical communication sealant Reflective adhesive
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
Light reflection
Heat curing
Application of adhesives and sealants
Typical application LED, image sensor or multimedia card
(MMC) Assembly
LOCTITE 3220W is designed for heat sensitivity
Optoelectronic components and other microelectronic devices.
The reflective properties of this material.
Loctite 3220W is the white version of Loctite 3220 adhesive LOCTITE 3220, epoxy resin, adhesive and sealant optical communication sealant reflective adhesive
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
Light reflection
Heat curing
Application of adhesives and sealants
Typical application LED, image sensor or multimedia card
(MMC) Assembly
LOCTITE 3220W is designed for heat sensitivity
Optoelectronic components and other microelectronic devices.
The reflective properties of this material.
Loctite 3220W is the white version adhesive of Loctite 3220
LOCTITE 3220， Epoxy resin, adhesive and sealant Optical communication sealant Reflective adhesive
LOCTITE ® 3220 is specifically designed for thermal devices.
Single component - no mixing required
Low temperature rapid curing
Adhesion
Storage temperature - 15.0 ° C
Shear strength 2960.0 psi
Carson viscosity, cone and plate, Haake PK100, M10/PK1, 2 °, @ 25.0 ° C 2500.0 mPa. s (cP)
Curing mode: heat+ultraviolet ray
Curing time, @ 80.0 ° C 5.0 - 10.0 minutes
Type of technology Epoxy resin
Viscosity, Bolefield CP51, @ 25.0 ° C Speed 20 rpm 7150.0 mPa. s (cP)
Component quantity Single component
Thixotropic index 3.3
Light reflection
Heat curing
Application of adhesives and sealants
Typical application LED, image sensor or multimedia card
(MMC) Assembly
LOCTITE 3220W is designed for heat sensitivity
Optoelectronic components and other microelectronic devices.
The reflective properties of this material.
Loctite 3220W is the white version adhesive of Loctite 3220
Beijing Xiyuan Technology Co., Ltd
LOCTITE STYCAST 2651MM/CATALYST 23LV
LOCTITE STYCAST 2651MM/CATALYST 9
LOCTITE STYCAST 2850FT/CAT 11
LOCTITE STYCAST 2850FT/CAT 23 LV
LOCTITE STYCAST 2850KT/CATALYST 9
LOCTITE STYCAST 2850MT/CATALYST 24LV
Loctite STYCAST 50500D
Loctite STYCAST A312
Loctite STYCAST E1070
Loctite STYCAST E1847
LOCTITE STYCAST EFF15 SYNTACTIC FOAM POWDER
Loctite STYCAST U2500
LOCTITE ABLESTIK 104
LOCTITE ABLESTIK 16-1
LOCTITE ABLESTIK 2000
LOCTITE ABLESTIK 2000B
LOCTITE ABLESTIK 2000T
LOCTITE ABLESTIK 2025D
LOCTITE ABLESTIK 2025DSI
LOCTITE ABLESTIK 2030SC
LOCTITE ABLESTIK 2035SC
LOCTITE ABLESTIK 2053S
LOCTITE ABLESTIK 2100A
LOCTITE ABLESTIK 2106
LOCTITE ABLESTIK 2106T
LOCTITE ABLESTIK 2115
LOCTITE ABLESTIK 2116
LOCTITE ABLESTIK 2151
LOCTITE ABLESTIK 2158
LOCTITE ABLESTIK 2300
LOCTITE ABLESTIK 2310
LOCTITE ABLESTIK 2332LOCTITE ABLESTIK 8384
LOCTITE ABLESTIK 8384
LOCTITE ABLESTIK 8387A
LOCTITE ABLESTIK 8387B
LOCTITE ABLESTIK 8387B-1B2
LOCTITE ABLESTIK 8387BS
LOCTITE ABLESTIK 8387BSW
LOCTITE ABLESTIK 84-1A
LOCTITE ABLESTIK 84-1LMI
LOCTITE ABLESTIK 84-1LMISR3
LOCTITE ABLESTIK 84-1LMISR4
LOCTITE ABLESTIK 84-1LMISR4-S25
LOCTITE ABLESTIK 84-1LMISR8
LOCTITE ABLESTIK 84-1LMIT1
LOCTITE ABLESTIK 84-3
LOCTITE ABLESTIK 85-1
LOCTITE ABLESTIK 8700E
LOCTITE ABLESTIK 8700K
Assembly adhesive conductive adhesive
LOCTITE ABLESTIK ABLEBOND 84-1LMI
LOCTITE ABLESTIK ABLEBOND 84-1LMISR4
LOCTITE ABLESTIK ICP-3535M1
LOCTITE ABLESTIK ICP-4001
LOCTITE ECCOBOND CE3103WLV
LOCTITE ECCOBOND CE3520-3
LOCTITE ECCOBOND CE8500
LOCTITE 3880
LOCTITE 59C
LOCTITE 3888
LOCTITE 2902
LOCTITE 56C
Non-conductive adhesive
LOCTITE ABLESTIK ABLEBOND 2025D
LOCTITE ABLESTIK ABLEBOND 84-3
LOCTITE ABLESTIK ABLEBOND 8700D
LOCTITE ABLESTIK ABLEBOND 104 A/B
LOCTITE ABLESTIK ABLEBOND QMI536NB
Thin film conductive type
Loctite CF3350
