Seven days down, the top stream of semiconductor industry will appear at the NI Semiconductor Test Technology Summit

Topic: Application of digital transformation in semiconductor product development

Speaker: What is (Pearl He) -Global Semiconductor Business Development Director - NI

Content summary: At first glance, you may think that digital conversion is only applicable to IT organizations, e-commerce systems or personal strategies to store family photos in the cloud. However, many of the same technologies that improve our consumer experience are fundamentally changing the way semiconductor organizations design, test and manufacture semiconductor products. We will share some of the latest trends and technologies used by leading semiconductor companies to accelerate and improve product design. More specifically, we will share some practical examples to illustrate how companies can transform modern engineering laboratories and enterprises with technologies ranging from remote automation to cloud to artificial intelligence.

Support modern laboratory construction

Content summary: With the increase of chip complexity, the laboratory verification team is evolving towards a more standardized and automated modern laboratory. Through the standardization of organizational processes, test equipment, interfaces, and data, the overall test verification efficiency is improved and the time to market of chips is accelerated.

In addition to instruments in the traditional sense, hardware needs to be able to fully expand for the increase of product lines, and software based on the standard framework will better serve the whole process of modern chip testing, including Bring up, feature analysis, system level testing, and small batch project batch verification, And use the standard test library for the part to be tested to help engineers speed up chip verification time.

In this sharing, NI will display the latest released register control tool based on the standard verification framework to help verification engineers, application engineers and chip system engineers quickly target such as I2C Visual debugging and automatic verification of SPI registers, and we also invited Suzhou TwinSolution to release the latest laboratory small system level three temperature handler to further help engineers speed up the laboratory small batch automatic verification, and help design companies to improve test efficiency more quickly towards a modern laboratory.

Speaker: Maliksi -Product Marketing Manager - NI

Speaker: Xu Liang -Senior Product Director - Shanghai Taosheng Electronic Technology Co., Ltd

Content summary : From 802.11ac to 802.11be, the constant iteration of technology brings new challenges to WiFi chip R&D and product design. The modulation technology has been upgraded from 256QAM to 1024QAM and then to 4096QAM; Support user mode transformation, from single user single point technology to multi-user collaborative technology; The maximum rate that can be supported has been continuously improved, from 866Mbps to a maximum rate greater than 30Gbps; The supported frequency band and bandwidth are increasing. 802.11be supports 7.125GHz 320M BW, and it is required to support multi-channel coordination technology. The above new technologies bring new challenges to R&D personnel in the design and product evaluation stages. Relying on decades of technology accumulation, NI has proposed a unique global assessment tool and method for the above new challenges.

Speaker: Fan Min  - APAC Semi Business development Manager - NI

Content summary: The 5G era has come, and RF front-end is the first to benefit. As one of the key RF front-end devices, the power amplifier PA, according to the prediction of Marketandmarkets, will grow its market share from US $21.4 billion in 2018 to US $30.6 billion in 2023, with a compound annual growth rate of 7.4%. Engineers know that in order to make the power amplifier work at the optimal impedance point, it is necessary to traverse and evaluate the output power, efficiency, linearity and other indicators of the amplifier under different load impedances. It takes too much time, so it is urgent to speed up. NI launched RFIC test software version 20.0, which uses NI's leading vector signal transceiver VST to support load pull tuner and realize automatic test of PA load traction, greatly improving test efficiency, and more convenient and effective optimization and characterization of power amplifier design.

Speaker: Jessica Liu  - Principle FAE - NI