Packaging old chip renovation CPU chip disassembly, BGA planting ball packaging old chip renovation

BGA (Ball Grid Array) chip ball planting is a common electronic assembly technology, especially suitable for integrated circuit chips with high integration and many pins. On the BGA chip, the pins are arranged in a spherical manner at the bottom, rather than the traditional pin arrangement. This arrangement can improve the pin density, reduce the package area, and help improve the reliability of signal transmission.

The ball planting process is to coat solder paste on the bottom of the pin of BGA chip, and melt it by heating to form a spherical connection, then install the chip on the PCB (Printed Circuit Board), and use the melting point welding technology to weld the spherical pin and PCB together. This ensures good electrical connection and mechanical stability.

Control temperature and pressure required for ball planting processing to ensure welding quality. This process is very important in electronic manufacturing, because it directly affects the reliability and performance of electronic products.

Tin removal of QFN chips refers to the process of removing solder paste from QFN packaging chips in surface mount technology. Tin removal processing is an important part of the PCB manufacturing process, which can ensure the connection quality between the chip and the PCB board, and avoid problems such as poor soldering or short circuit caused by solder paste residue.

The tin removal process usually includes the following steps:
1. Hot air blowing: melt the solder paste on QFN chip by hot air flow and blow it off;
2. Vacuum suction: use vacuum suction to suck the melted solder paste away;
3. Cleaning: use chemical solvent or ultrasonic cleaning to remove the solder paste left on the chip.

The key of tin removal process is to control the heating temperature, blow off air flow and cleaning method. It is necessary to ensure that the tin removal process can effectively remove solder paste without damaging chips and PCBs. At the same time, the tin removal operation process should be strictly followed to ensure product quality and production efficiency.

QFP chip repair welding refers to the welding repair operation on QFP (Quad Flat Package) chips. QFP is a common surface mount package with four flat ports, making them suitable for installation and connection on PCB (Printed Circuit Board).

Rework welding may involve the following situations:

1. Repair of welding defects: When QFP chips have problems in the welding process, such as poor welding, poor welding contact, etc., repair welding is required to repair these problems.

2. Chip replacement: If the QFP chip itself has problems or needs to be upgraded to a higher version, it may be necessary to remove the existing chip and solder a new one.

3. Line connection repair: sometimes there may be problems with the surrounding circuit lines, which need to be welded around the QFP chip to repair these lines.

When repairing and welding QFP chips, it is necessary to use appropriate tools and technologies to ensure the welding quality and connection reliability. This may include the use of soldering iron, hot air gun or other equipment, as well as the use of correct solder and welding technology to avoid damage to chips or PCBs. In addition, repair welding usually requires certain technical experience and operating skills to ensure the smooth progress of the repair process and achieve the desired results.