Loctite Ablebond 84-1LMI conductive silver adhesive Low temperature curing viscosity: 28 PaS Shear strength: 12 Mpa Operating temperature: - 55~150 ℃ Shelf life: 12 months Curing condition: 150 ℃ * 60 min, 125 ℃ * 2hrs Main application: IC packaging: 3.5g/1cc pcs
Ablestik Ablebond 84-1LMI is a silver filled, conductive epoxy adhesive. Ablebond 84-1 LMI adhesive can meet the requirements of MIL-STD-883 and Method 5011. ABLEBOND 84-1LMI is mainly used for bonding microelectronic chips. This high-purity adhesive has a very low tendency to overflow and a low gas overflow, with a thermal conductivity of 2.5W/(m-K)
TYPICAL PROPERTIES OF UNCURED MATERIAL Thixotropic Index (0.5/5 rpm) 4.0 Viscosity, Brookfield CP51, 25 °C, mPa·s (cP): Speed 5 rpm 30,000 Work Life @ 25°C, days 14 Shelf Life (from date of manufacture): @ 5°C, days 91 @ -10°C, days 183 @ -40ºC, days 365 TYPICAL CURING PERFORMANCE Cure Schedule 1 hour @ 150°C Alternate Cure Schedule 2 hours @ 125°C
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Xiyuan Technology Electronic Materials:
Potting glue: Rodham High Road Corning Loctite, etc. Widely used in electronic power supply thick film circuit, automobile battery and other industries.
Conductive adhesive: Beijing EPO-TEK 3M Beijing ablestik Beijing Emerson&Cuming, etc. Used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The scope of application covers electronic components, electronic components, circuit board assembly, display, lighting, industrial communication, automobile electronic smart card/radio frequency identification and other fields of Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Xiyuan Technology Electronic Materials:
Potting glue: Rodham High Road Corning Loctite, etc. Widely used in electronic power supply thick film circuit, automobile battery and other industries.
Conductive adhesive: Beijing EPO-TEK 3M Beijing ablestik Beijing Emerson&Cuming, etc. Used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers electronic components, electronic components, circuit board assembly, display, lighting, industrial communication, automobile electronic smart card, radio frequency identification and other fields
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
The company sells all kinds of electronic materials, light fluorine oil, heavy fluorine oil, business brand: Beijing Hangao Beijing potting adhesive, Beijing heat conduction adhesive, Tianjin Hangao Tianjin Hanxin Tianjin potting adhesive, Shijiazhuang potting adhesive, Shijiazhuang heat conduction silicone, Beijing Daokangning, Beijing lord, Beijing Daokangning, 184 Beijing Hangao 5295B potting adhesive, 5295B 3M shielding tape, 3M protective equipment, 3M respirator 3M earplug Henkel electronic glue LOD EP-937 LOD SC-305 SC-309 SC-320 conductive silver glue: ABLEBOND 84-1A 84-1LMI 84-1LMINB (B1) 84-1LMISR4 84-1LMIT (T1) 826-1DS 826-2 2600AT 2600BT 2185A 2030SC 2100A 3185 8290 8340 8360 suitable for semiconductor (IC) packaging (such as DIP/SOP/TO/BGA) LED power tubes and other fields are used in various processes such as patch dispensing and adhesive backing. Insulation adhesive: ABLEBOND84-3 84-3J 84-3LV 84-3MV 789-3 789-4 2025D 2025M 2035SC 8384 8387A 8387B 2039H DX-10 DX-20-4 and other products are suitable for semiconductor (IC) packaging camera CMOS/CCD process LED Smart cards and other fields are used for various mounting or pasting processes UV adhesive: ABLELUXHGA-3E HGA-3S A4021T A4035T A4039T A4061T A4083T A4086T A4088T CC4310 AA50T BF-4 OG RFI146T and other UV curing adhesives are suitable for photoelectric instruments, optical phone cameras, CMOS and other fields; For example, mobile phone camera LENS fixed fiber coupler laser jumper Jamper, etc. Dow Corning 184 Dow Corning DC160 Dow Corning 1-2577 Metu TSE3033 Eligo DCR three proof paint Metu YG6260 Dow Corning Q1-9226 heat conduction adhesive Henkel Dow Corning TC-5022 heat dissipation paste Dow Corning Q3-6611 Emerson&Cuming ABLEBOND 84-1 AMICON 50262-3 ABLEBOND 84-3J Emerson&Cuming E1211 E1213 E1330 Ablestik Ablestik Conductive Adhesive Ablestik Hysol QMI516 Hysol Electronic Adhesive Hysol Hysol QMI 600 Hysol QMI168 Hysol MG40F Hysol KL-2500 Hysol KL-5000HT KL-6500H KL-7000HA Hysol GR828D KL-8500 MOLDING COMPOUND Hysol GR9810-1 GR9820 Emerson&cutting Hermiseal three proof paint CRC three proof paint CRC 70 Shi Min Hard Horn Glue Three key Electronic Glue Three key TB120 Three key TB1230 Three key TB3160 Three key TB3300 series Three key TB2500 Three key 1401D Static electricity prevention agent Pando 29A Three key organic silicone Loctite Loctite 7649 Loctite Loctite 3492 Loctite Loctite 349 Loctite Loctite 598 Loctite Loctite 595 Loctite Loctite 495 Elco DCA-SCC3 three proof paint Xiaoxi 14241 Hanxin 5295B Hanxin 2081 Dow Corning Q3-3600. Electrolube Henkel hanxin Hanxin Japan Konishi Shi Min Hardening Cemedine Loctite Dow Corning Japan Mineral Oil TripleBond MAXBOND EPO-TEK H20E and other insulation and heat conduction adhesives Moisture proof insulation adhesive Pouring sealant One component room temperature vulcanized silicone rubber Electronic silicone adhesive Adhesive Sealant Sealant Heat resistant adhesive Fire resistant adhesive Bonding adhesive Green adhesive Red adhesive Transparent adhesive Green red adhesive Horn adhesive Epoxy resin Silicone oil transformer rubber Mobile phone rubber Mata rubber Speaker adhesive Silicone thermal conductive silicone adhesive for camera, LCD adhesive for LED adhesive for power supply, semiconductor electronic adhesive, COB adhesive, UV adhesive, conductive adhesive, electrical sealing adhesive, hair foam adhesive, bottom filling adhesive, epoxy resin, polyurethane, organic silicone RTV silicone HTV silicone dispenser anti-static coating anti-static work clothes anti-static pad white light welding sales of various electronic products, with UL and SGS MIL certification. It is an electronic semiconductor electrical photoelectric motor and other industries. Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
The company sells all kinds of electronic materials, light fluorine oil, heavy fluorine oil, business brand: Beijing Hangao Beijing potting adhesive, Beijing heat conduction adhesive, Tianjin Hangao Tianjin Hanxin Tianjin potting adhesive, Shijiazhuang potting adhesive, Shijiazhuang heat conduction silicone, Beijing Daokangning, Beijing lord, Beijing Daokangning, 184 Beijing Hangao 5295B potting adhesive, 5295B 3M shielding tape, 3M protective equipment, 3M respirator 3M earplug Henkel electronic glue LOD EP-937 LOD SC-305 SC-309 SC-320 conductive silver glue: ABLEBOND 84-1A 84-1LMI 84-1LMINB (B1) 84-1LMISR4 84-1LMIT (T1) 826-1DS 826-2 2600AT 2600BT 2185A 2030SC 2100A 3185 8290 8340 8360 suitable for semiconductor (IC) packaging (such as DIP/SOP/TO/BGA) LED power tubes and other fields are used in various processes such as patch dispensing and adhesive backing. Insulation adhesive: ABLEBOND84-3 84-3J 84-3LV 84-3MV 789-3 789-4 2025D 2025M 2035SC 8384 8387A 8387B 2039H DX-10 DX-20-4 and other products are suitable for semiconductor (IC) packaging camera CMOS/CCD process LED Smart cards and other fields are used for various mounting or pasting processes UV adhesive: ABLELUXHGA-3E HGA-3S A4021T A4035T A4039T A4061T A4083T A4086T A4088T CC4310 AA50T BF-4 OG RFI146T and other UV curing adhesives are suitable for photoelectric instruments, optical phone cameras, CMOS and other fields; For example, mobile phone camera LENS fixed fiber coupler laser jumper Jamper, etc. Dow Corning 184 Dow Corning DC160 Dow Corning 1-2577 Metu TSE3033 Eligo DCR three proof paint Metu YG6260 Dow Corning Q1-9226 heat conduction adhesive Henkel Dow Corning TC-5022 heat dissipation paste Dow Corning Q3-6611 Emerson&Cuming ABLEBOND 84-1 AMICON 50262-3 ABLEBOND 84-3J Emerson&Cuming E1211 E1213 E1330 Ablestik Ablestik Conductive Adhesive Ablestik Hysol QMI516 Hysol Electronic Adhesive Hysol Hysol QMI 600 Hysol QMI168 Hysol MG40F Hysol KL-2500 Hysol KL-5000HT KL-6500H KL-7000HA Hysol GR828D KL-8500 MOLDING COMPOUND Hysol GR9810-1 GR9820 Emerson&cutting Hermiseal three proof paint CRC three proof paint CRC 70 Shi Min Hard Horn Glue Three key Electronic Glue Three key TB120 Three key TB1230 Three key TB3160 Three key TB3300 series Three key TB2500 Three key 1401D Static electricity prevention agent Pando 29A Three key organic silicone Loctite Loctite 7649 Loctite Loctite 3492 Loctite Loctite 349 Loctite Loctite 598 Loctite Loctite 595 Loctite Loctite 495 Elco DCA-SCC3 three proof paint Xiaoxi 14241 Hanxin 5295B Hanxin 2081 Dow Corning Q3-3600. Electrolube Henkel hanxin Hanxin Japan Konishi Shi Min Hardening Cemedine Loctite Dow Corning Japan Mineral Oil TripleBond MAXBOND EPO-TEK H20E and other insulation and heat conduction adhesives Moisture proof insulation adhesive Pouring sealant One component room temperature vulcanized silicone rubber Electronic silicone adhesive Adhesive Sealant Sealant Heat resistant adhesive Fire resistant adhesive Bonding adhesive Green adhesive Red adhesive Transparent adhesive Green red adhesive Horn adhesive Epoxy resin Silicone oil transformer rubber Mobile phone rubber Mata rubber Speaker adhesive Silicone thermal conductive silicone adhesive for camera, LCD adhesive for LED adhesive for power supply, semiconductor electronic adhesive, COB adhesive, UV adhesive, conductive adhesive, electrical sealing adhesive, hair foam adhesive, bottom filling adhesive, epoxy resin, polyurethane, organic silicone RTV silicone HTV silicone dispenser anti-static coating anti-static work clothes anti-static pad white light welding sales of various electronic products, with UL and SGS MIL certification. It is an electronic semiconductor electrical photoelectric motor and other industries.
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire wire defoamer parallel sealing and welding glue dispenser wafer cleaning liquid crystal circular scribing protective liquid.
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Epoxy resin adhesive system, with low moisture absorption of silver adhesive, is used for packaging and bonding of electronic components and components such as LCD, LED, wireless wired communication equipment, crystal oscillator, integrated circuit chip, etc., as well as bonding between metals.
Product benefits
N Suitable for high-speed dispensing process, with thixotropy and no creeping phenomenon
N Meet the requirements of high temperature resistance
Bonding force of n
85 ℃/85% RH stability of n
Domestic chip conductive adhesive, H20E domestic substitute conductive adhesive, insulating adhesive 9969 conductive adhesive 9973 insulating adhesive.
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
Operating equipment: wafer scribe, chip bonding machine, dispensing machine, parallel sealing welder, TSV/TGC electroplating platform, MEMS capping machine, etc. Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
Operating equipment: wafer scribe, chip bonding machine, dispensing machine, parallel sealing welder, TSV/TGC electroplating platform, MEMS capping machine, etc.
