Loctite 2280LV adhesive, Loctite 2280LV structural adhesive, 2280lv sensor adhesive, black light curing adhesive, ceramic adhesive, LCP adhesive, stainless steel adhesive, light blocking adhesive, light blocking insulation adhesive, camera adhesive, camera adhesive, high temperature resistant adhesive, solvent-free structural adhesive, solvent-free adhesive, patch adhesive, red adhesive, wave soldering adhesive, SMT red adhesive, Loctite 3609 red adhesive, Loctite patch adhesive, Loctite red adhesive, silk screen conductive adhesive, silk screen red adhesive. Electromagnetic shielding conductive adhesive, electromagnetic shielding adhesive strip, optical device crystal adhesive, optical module crystal adhesive, optical communication conductive adhesive, optical communication crystal adhesive, optical communication crystal adhesive, optical module positioning adhesive, optical module thermal adhesive, optical module 2280LV positioning adhesive, Loctite 2280 positioning adhesive, Loctite ablestik2032 conductive adhesive, Loctite 2032s optical communication conductive adhesive, Loctite 1505thtg optical path adhesive, Loctite F113 pigtail adhesive, Loctite F121 pigtail adhesive, pigtail adhesive, BF-4 optical device potting adhesive, Loctite 50T positioning adhesive, optical device positioning adhesive LUX AA50T. 2030SC low stress conductive adhesive, light module low stress conductive adhesive, Loctite 8068ta high conductivity conductive adhesive, Loctite 3555r conductive adhesive, ablestik 3555r glass conductive adhesive, Loctite QMI2569 black porcelain conductive adhesive, Loctite 5025E conductive adhesive film, ablestik 5025e conductive adhesive film, light module conductive adhesive film, filler at the bottom of light module, filler at the bottom of light module, filler at the bottom of light module.
VALTRON®UltraLux ™ It is a temporary adhesive wax, mainly used for polishing and grinding in semiconductor industry. This special adhesive product is available in solid and liquid forms, providing low viscosity and high adhesive strength. The physical properties of wax make it possible to control the processing rate at high speed. The new water-soluble liquid wax is designed to facilitate the disassembly of precision and ultra-thin semiconductor chips with water. Using VALTRON ® Wax removal with water-based cleaning agent.
ABLESTIK QMI2569 is a silver glass chip mounting agent semiconductor adhesive conductive adhesive chip adhesive
LOCTITE ABLESTIK QMI2569、 Silver glass, semiconductor, conductive adhesive
LOCTITE ® ABLESTIK QMI2569 is a silver glass chip mounting agent used to connect integrated circuits in solder sealed glass seals. The material allows simultaneous processing of chip connection and lead wire frame insertion, while producing a bonding layer without gaps to limit heat dissipation. Good RGA moisturizing effect can be obtained by using lead borate glass. LOCTITE ABLESTIK QMI2569 also allows online drying during firing to improve processability up to 0.800 "x 0.800". This material can be coated with multiple needles or starfish. LOCTITE ABLESTIK QMI2569 can only be used for sealed packaging.
• Bubble free adhesive layer
• Thermal capacity
Stycast 2850ft is a two-component, heat-conducting epoxy encapsulation/potting material. It has low expansion coefficient, good thermal conductivity (thermal conductivity is 1.3) and excellent electrical insulation performance. The 2850ft is designed for components requiring heat dissipation and thermal shock resistance. It can be used with a variety of curing agents. Due to different curing agents, the curing temperature ranges from room temperature to high temperature.
Stycast 2850ft is widely used in the encapsulation of sensors, especially thermal sensors, and has a long market share. There are a variety of colors to choose from. It has two components, long storage life and good thermal conductivity (1.3w/m.k). It is widely used in electronics, automobile, aviation and other industries.
Appearance: black or blue liquid,
Operating temperature - 70 ℃ - 180 ℃,
Viscosity cps,
Product specification: (main agent+curing agent=1 set)
Main agent - 8.17kg (18lb/barrel) curing agent - 0.454kg (1lb/barrel)
LOCTITE ABLESTIK SSP 2020 provides the following product features: process silver sintering paste appearance silver heat curing product advantages ● long service life ● good processability ● syringe is available or not ● printable template ● high conductivity ● high thermal conductivity ● high shear strength of the mold for application of high-power patch typical package application of high heat packaging key substrate back metallization into Ag or Au coating substrate Or other metallized lead frame LOCTITE ABLESTIK SSP 2020 sintered silver paste patch is designed for adhesive conductivity of equipment requiring high heat and electricity. LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated by power devices. Loctite ABLESTIK SSP 2020 maintains high adhesion temperature up to 260 º C during operation.
5G chip conductive adhesive, high power chip conductive adhesive, 5G base station conductive adhesive, 5G base station adhesive, high temperature resistant conductive adhesive.
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply and new energy industries. The company has a group of high-quality technical personnel to provide customers with one-stop solutions for adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
