ABLESTIK QMI2569 is a silver glass chip mounting agent semiconductor adhesive conductive adhesive chip adhesive
LOCTITE ABLESTIK QMI2569、 Silver glass, semiconductor, conductive adhesive
LOCTITE ® ABLESTIK QMI2569 is a silver glass chip mounting agent used to connect integrated circuits in solder sealed glass seals. The material allows simultaneous processing of chip connection and lead wire frame insertion, while producing a bonding layer without gaps to limit heat dissipation. Good RGA moisturizing effect can be obtained by using lead borate glass. LOCTITE ABLESTIK QMI2569 also allows online drying during firing to improve processability up to 0.800 "x 0.800". This material can be coated with multiple needles or starfish. LOCTITE ABLESTIK QMI2569 can only be used for sealed packaging.
• Bubble free adhesive layer
• Thermal capacity
VALTRON®TriAct ™ DF dicing solution series is made of non-ionic surfactant, disinfectant and other functional ingredients, and is suitable for semiconductor wafer dicing process. This product can effectively eliminate silica dust particles and sterilize the production system pipeline. It has low foam, fast defoaming and easy washing. The concentrated solution or low diluent of the scribing solution can prevent microbial growth, prevent corrosion, and reduce and neutralize the static charge. In addition to cleaning, VALTRON ® TriAct ™ DF series lubricating cutting blade can significantly reduce friction and surface tension when the dilution ratio is up to 1:4000, and act as a coolant to reduce the heat of silicon wafer cracking.
Electrically conductive ● Thermally conductive ● Solvent-free ● High adhesion ● Two component ● Room temperature cure ● Good adhesion to a variety of substrates
Ablestik 2902 low-temperature curing conductive adhesive, two-component conductive adhesive, solvent-free conductive adhesive, low-temperature resistant conductive adhesive, - 60 ℃ conductive adhesive, minus 60 ℃ conductive adhesive, medical grade conductive adhesive, passed ISO-10993-5 NASA certification. Room temperature curing conductive adhesive, low stress, low stress conductive adhesive, low expansion coefficient conductive adhesive, optical fiber conductive adhesive, drive chip conductive adhesive, sensor chip conductive adhesive.
Loctite TEROSON Ablestik BiPax Tra Bond 2151 is a two-part, solid thixotropic adhesive that can improve strong impact at room temperature. It passes the NASA degassing standard, and the overall operating temperature is - 70 to 115 ° C. Loctite Ablestik 2151 (formerly known as Hysol TRA Bond 2151) BiPax Tra Bond is a two-part, solid, thixotropic adhesive that can improve strong impact at room temperature. This product provides improved overall heat transfer while maintaining electrical insulation, and is usually used to rivet transistors, diodes, circuits, and resistors. Loctite Ablestik 2151 Adhesive provides adhesives resistant to alkali, salt, weak acid, lubricating oil, alcohol and petroleum products. Ablestik 2151 also passed the NASA degassing standard, and the overall operating temperature is - 70 to 115 ° C.
Loctite Ablestik 2151 Adhesive provides adhesives resistant to alkali, salt, weak acid, lubricating oil, alcohol and petroleum products. The product provides improved overall heat transfer while maintaining electrical insulation.
Appearance: blue
Component: two-component
Curing: room temperature or heating
Operating temperature: - 70 to 115 ° C
Application: conductive adhesive
Viscosity @ 25 ℃: 40000mPa
Thixotropy index (5/5 rpm): 1.7
Specific gravity: 2300g/cm3
Tensile strength: 7500 psi
Optocoupler adhesive Optocoupler reflective adhesive Optical fiber adhesive F113 Optical fiber adhesive F131 Optical fiber adhesive
Product name: ECCOBOND 104 A/B
Ingredients: epoxy resin
Appearance: black
Shear/tensile strength Mpa: 10
Active life min: 720
Operating temperature ℃: 230
Shelf life month: 9
Curing conditions: 120 ° C × 6 hours, 150 ° C × 3 hours, 180 ° C × 2 hours, 200 ° C × 1 hour
Features: high temperature resistance, chemical resistance
Main applications: connectors, aviation/* * electronics
Package: 470.8g/set
Emerson&cuming 104A/B is a two-component epoxy adhesive, which also has excellent physical and electrical properties at working temperature up to 230 ℃, and can withstand 290 ℃ in a short term. 104A/B contains no solvents and volatiles, and can be bonded to porous and non porous materials. It has strong adhesion to aluminum, stainless steel, carbon steel, brass, ceramics, glass and thermoplastic plastics, and its solvent resistance and chemical resistance are much better than those of common adhesives in the market.
Brand: Loctite Model: 84-3 Product name: non-conductive adhesive Type: conductive adhesive Hardening/curing method: heating hardening Main adhesive type: other substrate: adhesive Physical form: solution Performance characteristics: non-conductive bonding purpose: component bonding viscosity: 50000CPS Curing time: 1h Storage method: - 40 ℃ Shelf life: 1 year Origin: Beijing curing type : Heating curing Service life: 2 weeks @ 25 ℃ Storage life: 12 months @ - 40 ℃
Curing type Heat curing
Curing condition 1 hour @ 175 ℃
Viscosity 50000 mpa s
Storage life 12 months @ - 40 ℃
Service life 2 weeks @ 25 ℃
Conductive chip bonding, suitable for high-yield, automatic chip bonding, with little residue and wire drawing.
