LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Wafer temporary adhesive, wafer scribing fluid, wafer temporary bonding and debonding, wafer blue film, chip temporary adhesive, chip temporary adhesive paraffin, chip paraffin, wafer paraffin, chip blue film, engine controller potting adhesive, corrosion resistant potting adhesive, corrosion resistant adhesive, aviation adhesive, aerospace adhesive, military adhesive, military adhesive, flexible conductive adhesive, low-temperature curing conductive adhesive, Room temperature curing conductive adhesive, flexible insulating adhesive, chip insulating adhesive, ic insulating adhesive, MMIC conductive adhesive, GaAs conductive adhesive, solvent-free conductive adhesive, automatic chip bonding conductive adhesive, automatic chip insulating adhesive
Wafer temporary adhesive, wafer scribing fluid, wafer temporary bonding and debonding, wafer blue film, chip temporary adhesive, chip temporary adhesive paraffin, chip paraffin, wafer paraffin, chip blue film, engine controller potting adhesive, corrosion resistant potting adhesive, corrosion resistant adhesive, aviation adhesive, aerospace adhesive, military adhesive, military adhesive, flexible conductive adhesive, low-temperature curing conductive adhesive, Room temperature curing conductive adhesive, flexible insulating adhesive, chip insulating adhesive, ic insulating adhesive, MMIC conductive adhesive, GaAs conductive adhesive, solvent-free conductive adhesive, automatic chip bonding conductive adhesive, automatic chip insulating adhesive
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃ LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire wire defoamer parallel sealing and welding glue dispenser wafer cleaning liquid crystal circular scribing protective liquid.
Beijing Xiyuan Technology Co., Ltd
With the continuous upgrading of electronic products and semiconductor products, Xiyuan Technology also provides good protection for the electronic semiconductor industry with the strong support of the state for the high-tech industry.
Xiyuan Technology Electronic Materials:
Potting glue: Rodham Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers the fields of electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card/radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding and thinning of liquid crystal circles, etc.
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire wire defoamer parallel sealing and welding glue dispenser wafer cleaning liquid crystal circular scribing protective liquid.
Beijing Xiyuan Technology Co., Ltd
With the continuous upgrading of electronic products and semiconductor products, Xiyuan Technology also provides good protection for the electronic semiconductor industry with the strong support of the state for the high-tech industry.
Xiyuan Technology Electronic Materials:
Potting glue: Lodhenhan High Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers the fields of electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card/radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding and thinning of liquid crystal circles, etc.
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire wire defoamer parallel sealing and welding glue dispenser wafer cleaning liquid crystal circular scribing protective liquid.
LOCTITE ABLESTIK 84-1LMIT1
Loctite ABLESTIK 84-1LMIT1
characteristic:
epoxy resin
Appearance silver
Heat curing
PH 4.5
● Conductivity
● High thermal conductivity
● Solvent free formula
● Low viscosity
Loctite ABLESTIK 84-1LMIT1 adhesive is specially designed for medium package
325 meshes can be screen printed.
mil - std - 883 c
Loctite ABLESTIK 84-1LMIT1 meets the requirements of MIL-STD883C Method 5011.
Typical characteristics of uncured materials
Viscosity, 25 ℃, mPa · s (cP):
Speed: 5 to 22000
Service life @ 25 ° C, 14th day
Shelf life: - 40 ° C (from the date of production), 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Curing conditions
2 hours @ 125 ° C
Wide temperature resistance range: - 65~250 ℃
LOCTITE ECCOBOND LUX OGR150THTG photocurable adhesive is designed for high throughput optoelectronic assembly operations. This product also contains a secondary thermal cure mechanism for applications that contain shadowed areas where light is unable to penetrate. The secondary thermal cure can be done in conventional box or convection conveyor ov ens.
Ablestik optical communication device glue, high transmittance UV glue, optical fiber tail glue, optical fiber head glue, passing the double 85 test, low temperature resistance - 65 degrees.
Loctite 3900 three proof paint, Loctite 3900 three proof paint, military three proof paint, military three proof paint, fast curing three proof paint, transparent coating, UV curing three proof paint, spraying three proof paint, common film coating three proof paint, silicon based three proof paint. Solventless three proof paint, automobile application three proof paint, compatible with solder mask, no cleaning flux, environmental protection three proof paint. Crc70 three proof paint, crc three proof paint, crc2403 three proof paint, red three proof paint, transparent three proof paint. The circuit board is coated with three proofing paint. Marine paint, seawater resistant paint
