Henkel Loctite UF1173, Hubei Henkel Loctite UF1173 bottom filled with rubber semiconductor
The LOCTITE ABLESTIK NCA 2286 chip adhesive launched by Han Gaoxin is used for automatic lens alignment. Its dual curing formula meets the high imaging assembly requirements of the camera module, and achieves better adhesion while achieving rapid curing. After curing, it has lower shrinkage (up to 5%) and higher elongation (up to 60%) than similar applications in the industry, and the active lens alignment is reliable. In addition, Henkel also showed the chip adhesive used for the bonding of dual camera and multi camera brackets, which has excellent bonding power for various materials, and the production process is simple, reducing the total production cost.
With the increasing degree of electronic and intelligent cars, the market for car cameras and on-board radars is also developing rapidly. In terms of on-board cameras and on-board radars, in the face of continuous vibration and harsh use environment, Henkel specially introduced LOCTITE ECCOBOND UF 1173 bottom filling material to improve the reliability performance of on-board cameras and on-board radar equipment. Its material characteristics of low viscosity and high-speed flow are suitable for filling the slit at the bottom of various chips, providing protection against dropping and frequent vibration for core, key and fragile chips. In addition, under extreme high and low temperature cycles, the product shows reliability: it has passed 5000 times of thermal cycle tests at minus 40 to 150 degrees Celsius without failure; Through 2000 hours of environmental testing at 85 ℃ and 85% humidity, the test has an effective service life of up to 15 years, fully meeting the requirements of the specification for vehicle safety integrity level.
Henkel has brought powerful adhesive technology applications and solutions in various fields. The speed, low latency, and data throughput brought by 5G communication have great pressure on chips and terminal devices. Excellent thermal management performance and reliability are the basis for ensuring 5G communication quality. Henkel introduced LOCTITE ABLESTIK ABP 8068 series semi sintered chip adhesive for power IC and discrete devices.
In order to meet the high imaging assembly requirements of the camera module, Henkel introduced a new LOCTITE ABLESTIK NCA 2286 chip adhesive for automatic lens alignment to achieve rapid curing and better adhesion. It is reported that after curing, it has lower shrinkage (up to 5%) and higher elongation (60%) than similar applications in the industry.
The arrival of the era of the Internet of Everything has also accelerated automatic driving into our lives, which can not be separated from the on-board camera, on-board radar and data processing module. However, the car application scenario is much more complex and harsh than that of mobile phones, so the test of long-term stability and reliability of the device is naturally different from the past. In this regard, Henkel specially introduced LOCTITE ECCOBOND UF 1173 bottom filling material to provide reinforcement performance for key and fragile chips, so that the equipment will not be affected by frequent and continuous vibration, electronic components will not be desoldered, and it will remain stable and reliable.
