Company Profile
Tong Microelectronics Co., Ltd. was listed on the Shenzhen Stock Exchange on August 16, 2007. Stock abbreviation: Tongfu WeChat, stock code: 002156. The company specializes in integrated circuit packaging and testing. Shi Mingda, the chairman of the board of directors, is the vice chairman of China Semiconductor Industry Association, the leader of China's integrated circuit industry, a professor level senior engineer, the winner of the special allowance of the State Council, and a representative of Jiangsu Provincial People's Congress. Founded in October 1997, the company has more than 18000 employees. As a national high-tech enterprise, the vice chairman unit of China Semiconductor Industry Association, and the executive vice chairman unit of China Integrated Circuit Sealing and Testing Industry Chain Technology Innovation Alliance of the Ministry of Science and Technology, Tongfu Microelectronics has always stood at the forefront of the industry's scientific and technological development and insisted on promoting development through science and technology. The company has a national postdoctoral workstation, a provincial technology center and an engineering technology research center, and has taken the lead in passing the three international management system certifications of ISO9001, ISO14001 and ISO/TS16949 in the industry. Over the years, the company has undertaken and completed a number of national and provincial technological transformation projects, which has strongly promoted the industrialization of China's advanced packaging and testing technology. In 2009, the company undertook the implementation of two major national science and technology projects of the "Eleventh Five Year Plan", namely, "Advanced Packaging Process Development and Industrialization" and "Key Sealing and Testing Equipment and Material Application Engineering". Since the implementation of the special project, it has achieved fruitful technological innovation, and the products and technologies successfully developed, such as WLCSP, BGA, BUMP, and highly reliable automotive electronics, are leading in China. The company has strong overseas market development ability and competitiveness, with exports accounting for 70%. The main customers are world famous semiconductor enterprises. More than half of the world's top 20 semiconductor enterprises, such as Motorola, Siemens, Toshiba, are our customers. With more than ten years of development, Tongfu Microelectronics has achieved many goals of "China's first" in the comprehensive level of professional integrated circuit packaging and testing. The company is one of the top 100 electronic information enterprises in China, one of the top ten integrated circuit packaging and testing enterprises in China, and one of the top 500 enterprises with the largest import and export volume in China. With the help of the capital market, the company will accelerate its progress towards the goal of "world-class" enterprise, and strive to become the world's leading integrated circuit packaging and testing enterprise and a world-class packaging and testing enterprise during the "12th Five Year Plan" period.
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