Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Xiyuan Technology now has a ten thousand level purification production and manufacturing plant, a 500 square meter test plant and a 300 square meter production and testing equipment, which are widely used and recognized in the industry. It is equipped with semiconductor integrated circuit tester, discrete device tester, full-automatic gold wire silicon aluminum wire pressure welder, full-automatic coarse aluminum wire pressure welder, parallel seam welder, laser seam welder, sintering furnace, parallel seam welder, helium mass spectrometer leak detector, fluorine oil rough detector, high temperature reverse bias aging, high and low temperature environment test chamber, tensile shear force tester, constant acceleration centrifuge, particle noise The acoustic detector shock table and electric vibration table ensure that the products are strictly screened according to the project.
Provide small batch packaging test for semiconductor industry design companies, Chinese Academy of Sciences and other research and development units.
Ablestik：
Conductive silver glue: mainly engaged in ABLEBOND 84-1A, 84-1LMI, 84-1LMINB (B1), 84-1LMISR4, 84-1LMIT (T1), 826-1DS, 826-2, 2600AT, 2600BT, 2185A, 2030SC, 2100A, 3185, 8290, 8340, 8360, 8352L, 968-2, 979-1, 71-1, JM7000 and a series of products, suitable for semiconductor (IC) packaging (such as DIP/SOP/TO-92/BGA...) LED (such as ordinary LED/LAMP/high-power tube/digital tube...) It is used in various processes such as sticking, dispensing and backing
Insulating adhesive: mainly engaged in ABLEBOND84-3, 84-3J, 84-3LV, 84-3MV, 789-3, 789-4, 2025D, 2025M, 2035SC, 8384, 8387A, 8387B, 2039H, DX-10, DX-20-4 and a series of products, which are suitable for semiconductor (IC) packaging, camera (CMOS/CCD) process, LED, smart card and other fields, and are used for various pastes, or sticking and other processes
UV adhesive: mainly engaged in a series of UV curing adhesives such as ABLELUXHGA-3E, HGA-3S, A4021T, A4035T, A4039T, A4061T, A4083T, A4086T, A4088T, A4502, CC4310, AA50T, BF-4, OG RFI146T, which are suitable for photoelectric, photoelectric instrument, optical fiber, mobile phone camera (CMOS) and other fields; For example, phone camera Lens fixation, fiber coupler, laser, jumper, attenuator, detector, etc.
Adhesive film: mainly engaged in ABLEFILM506, 508, 550S, 561K, 570K, 5020, 5020K, 5025E and a series of products, suitable for various electronic products, military products, power supplies, etc.
Bottom filling glue: FP4450, UF1173, 4531, 4451 and other series.
Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Ablestik：
Conductive silver glue: mainly engaged in ABLEBOND 84-1A, 84-1LMI, 84-1LMINB (B1), 84-1LMISR4, 84-1LMIT (T1), 826-1DS, 826-2, 2600AT, 2600BT, 2185A, 2030SC, 2100A, 3185, 8290, 8340, 8360, 8352L, 968-2, 979-1, 71-1, JM7000 and a series of products, suitable for semiconductor (IC) packaging (such as DIP/SOP/TO-92/BGA...) LED (such as ordinary LED/LAMP/high-power tube/digital tube...) It is used in various processes such as sticking, dispensing and backing
Insulating adhesive: mainly engaged in ABLEBOND84-3, 84-3J, 84-3LV, 84-3MV, 789-3, 789-4, 2025D, 2025M, 2035SC, 8384, 8387A, 8387B, 2039H, DX-10, DX-20-4 and a series of products, which are suitable for semiconductor (IC) packaging, camera (CMOS/CCD) process, LED, smart card and other fields, and are used for various pastes, or sticking and other processes
UV adhesive: mainly engaged in a series of UV curing adhesives such as ABLELUXHGA-3E, HGA-3S, A4021T, A4035T, A4039T, A4061T, A4083T, A4086T, A4088T, A4502, CC4310, AA50T, BF-4, OG RFI146T, which are suitable for photoelectric, photoelectric instrument, optical fiber, mobile phone camera (CMOS) and other fields; For example, phone camera Lens fixation, fiber coupler, laser, jumper, attenuator, detector, etc.
Adhesive film: mainly engaged in ABLEFILM506, 508, 550S, 561K, 570K, 5020, 5020K, 5025E and a series of products, suitable for various electronic products, military products, power supplies, etc.
Bottom filling glue: FP4450, UF1173, 4531, 4451 and other series.
Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Ablestik：
Conductive silver glue: mainly engaged in ABLEBOND 84-1A, 84-1LMI, 84-1LMINB (B1), 84-1LMISR4, 84-1LMIT (T1), 826-1DS, 826-2, 2600AT, 2600BT, 2185A, 2030SC, 2100A, 3185, 8290, 8340, 8360, 8352L, 968-2, 979-1, 71-1, JM7000 and a series of products, suitable for semiconductor (IC) packaging (such as DIP/SOP/TO-92/BGA...) LED (such as ordinary LED/LAMP/high-power tube/digital tube...) It is used in various processes such as sticking, dispensing and backing
Insulating adhesive: mainly engaged in ABLEBOND84-3, 84-3J, 84-3LV, 84-3MV, 789-3, 789-4, 2025D, 2025M, 2035SC, 8384, 8387A, 8387B, 2039H, DX-10, DX-20-4 and a series of products, which are suitable for semiconductor (IC) packaging, camera (CMOS/CCD) process, LED, smart card and other fields, and are used for various pastes, or sticking and other processes
UV adhesive: mainly engaged in a series of UV curing adhesives such as ABLELUXHGA-3E, HGA-3S, A4021T, A4035T, A4039T, A4061T, A4083T, A4086T, A4088T, A4502, CC4310, AA50T, BF-4, OG RFI146T, which are suitable for photoelectric, photoelectric instrument, optical fiber, mobile phone camera (CMOS) and other fields; For example, phone camera Lens fixation, fiber coupler, laser, jumper, attenuator, detector, etc.
Adhesive film: mainly engaged in ABLEFILM506, 508, 550S, 561K, 570K, 5020, 5020K, 5025E and a series of products, suitable for various electronic products, military products, power supplies, etc.
Bottom filling glue: FP4450, UF1173, 4531, 4451 and other series.
