LORD CoolTherm ® SC-320 thermal conductive silicone potting adhesive is a two-component system, which exhibits thermal conductivity in electrical/electronic packaging applications while maintaining the ideal properties related to silicone.
quality guarantee period
Keep the original container unopened. The shelf life of each component is nine months from the date of manufacture under the storage condition of 25 ° C.
CoolTherm SC-320 potting adhesive will release trace hydrogen. Do not pack or store this type of material in an unventilated container. The working area shall be adequately ventilated to prevent gas accumulation.
Features and advantages
Low stress - shrinkage and stress are small after curing when used for device bonding.
Durable - It is composed of addition curable polydimethylsiloxane polymer, which will not be depolymerized when heated in a confined space.
Low viscosity - maintain low viscosity, which is easy to package components compared with other materials with high thermal conductivity.
Environmental resistance - it has heat shock resistance.
UL certification - excellent flame retardancy; Passed UL 94 V-0 certification.
Typical properties of uncured*
Light pink liquid with mixed appearance
Mixed viscosity, at 25 ° C, in centipoise 22000
Specific gravity 3.1
Gelation time, at 121 ° C, in minutes 2-5
Operating time at 25 ° C, in minutes 40
The curing time is 24 hours at 25 ° C; or
60 minutes at 125 ° C
Typical properties after curing*
Volume resistivity, at 25 ° C, unit: ohm cm>1 × 1014
Heat conductivity (W/mK) 3.2
Linear thermal expansion coefficient (ppm/° C) 110
Hardness, Shore A 60
Tensile strength (psi) 313
Elongation at break (%) 50
Moisture absorption rate (%)
Dielectric constant at 25 ° C 6
Dissipation factor in% at 25 ° C
Extractable ion impurity Chloride ion=Sodium ion=Potassium ion=Ammonium ion=Bromide=Sulfate=
CoolTherm SC-320 Resin - Typical Properties*
Appearance Pink liquid
Viscosity, cps @ 25 ° C 25000
Specific gravity 3.1
CoolTherm SC-320 Curing Agent - Typical Properties*
Appearance white liquid
Viscosity, cps @ 25 ° C 20000
Specific gravity 3.1
*Typical data cannot be used as product standards.
Cure at 125 ℃ for 60 minutes.
LORD CoolTherm ® SC-320 thermal conductive silicone potting adhesive is a two-component system, which exhibits thermal conductivity in electrical/electronic packaging applications while maintaining the ideal properties related to silicone.
quality guarantee period
Keep the original container unopened. The shelf life of each component is nine months from the date of manufacture under the storage condition of 25 ° C.
CoolTherm SC-320 potting adhesive will release trace hydrogen. Do not pack or store this type of material in an unventilated container. The working area shall be adequately ventilated to prevent gas accumulation.
Features and advantages
Low stress - shrinkage and stress are small after curing when used for device bonding.
Durable - It is composed of addition curable polydimethylsiloxane polymer, which will not be depolymerized when heated in a confined space.
Low viscosity - maintain low viscosity, which is easy to package components compared with other materials with high thermal conductivity.
Environmental resistance - it has heat shock resistance.
UL certification - excellent flame retardancy; Passed UL 94 V-0 certification.
LORD CoolTherm ® SC-320 thermal conductive silicone potting adhesive is a two-component system, which exhibits thermal conductivity in electrical/electronic packaging applications while maintaining the ideal properties related to silicone.
quality guarantee period
Keep the original container unopened. The shelf life of each component is nine months from the date of manufacture under the storage condition of 25 ° C.
CoolTherm SC-320 potting adhesive will release trace hydrogen. Do not pack or store this type of material in an unventilated container. The working area shall be adequately ventilated to prevent gas accumulation.
Features and advantages
Low stress - shrinkage and stress are small after curing when used for device bonding.
Durable - It is composed of addition curable polydimethylsiloxane polymer, which will not be depolymerized when heated in a confined space.
Low viscosity - maintain low viscosity, which is easy to package components compared with other materials with high thermal conductivity.
Environmental resistance - it has heat shock resistance.
UL certification - excellent flame retardancy; Passed UL 94 V-0 certification.
Xiyuan Technology Electronic Materials:
Potting glue: Lodhenhan High Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments TSV Electroplating Equipment Bonding Machine Parallel Sealing Welder.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The scope of application involves electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card, radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding of liquid crystal circles, thinning of bond alloy wires and other fields.
In 2017, Xiyuan Technology started joint research and development of integrated circuit/discrete device materials, domestic conductive silver adhesive insulation adhesive gold solder and other products. It has been recognized by China Electronics Technology Group/Aerospace Science and Industry Group and other enterprises. It has passed the relevant test certification of GJB.
LORD CoolTherm ® SC-320 thermal conductive silicone potting adhesive is a two-component system, which exhibits thermal conductivity in electrical/electronic packaging applications while maintaining the ideal properties related to silicone.
quality guarantee period
Keep the original container unopened. The shelf life of each component is nine months from the date of manufacture under the storage condition of 25 ° C.
CoolTherm SC-320 potting adhesive will release trace hydrogen. Do not pack or store this type of material in an unventilated container. The working area shall be adequately ventilated to prevent gas accumulation.
Features and advantages
Low stress - shrinkage and stress are small after curing when used for device bonding.
Durable - It is composed of addition curable polydimethylsiloxane polymer, which will not be depolymerized when heated in a confined space.
Low viscosity - maintain low viscosity, which is easy to package components compared with other materials with high thermal conductivity.
Environmental resistance - it has heat shock resistance.
UL certification - excellent flame retardancy; Passed UL 94 V-0 certification.
The company sells all kinds of electronic materials Business brand: Beijing Hangao Beijing potting adhesive Beijing heat conduction adhesive Tianjin Hangao Tianjin Hanxin Tianjin potting adhesive Shijiazhuang potting adhesive Shijiazhuang heat conduction silicone Beijing Daokangning Beijing lord Beijing Daokangning 184 Beijing Hangao 5295B potting adhesive 5295B 3M shielding tape 3M protective equipment 3M mask 3M earplug Han High electronic glue LOD EP-937 LOD SC-305 SC-309 SC-320 conductive silver glue: ABLEBOND 84-1A 84-1LMI 84-1LMINB (B1) 84-1LMISR4 84-1LMIT (T1) 826-1DS 826-2 2600AT 2600BT 2185A 2030SC 2100A 3185 8290 8340 8360 Applicable to semiconductor (IC) packaging (such as DIP/SOP/TO/BGA) LED power tubes and other fields are used in various processes such as patch dispensing and adhesive backing. Insulation adhesive: ABLEBOND84-3 84-3J 84-3LV 84-3MV 789-3 789-4 2025D 2025M 2035SC 8384 8387A 8387B 2039H DX-10 DX-20-4 and other products are suitable for semiconductor (IC) packaging camera CMOS/CCD process LED Smart cards and other fields are used for various mounting or pasting processes UV adhesive: ABLELUXHGA-3E HGA-3S A4021T A4035T A4039T A4061T A4083T A4086T A4088T CC4310 AA50T BF-4 OG RFI146T and other UV curing adhesives are suitable for photoelectric instruments, optical phone cameras, CMOS and other fields; For example, mobile phone camera LENS fixed fiber coupler laser jumper Jamper, etc. Dow Corning 184 Dow Corning DC160 Dow Corning 1-2577 Metu TSE3033 Eligo DCR three proof paint Metu YG6260 Dow Corning Q1-9226 heat conduction adhesive Henkel Dow Corning TC-5022 heat dissipation paste Dow Corning Q3-6611 Emerson&Cuming ABLEBOND 84-1 AMICON 50262-3 ABLEBOND 84-3J Emerson&Cuming E1211 E1213 E1330 Ablestik Ablestik Conductive Adhesive Ablestik Hysol QMI516 Hysol Electronic Adhesive Hysol Hysol QMI 600 Hysol QMI168 Hysol MG40F Hysol KL-2500 Hysol KL-5000HT KL-6500H KL-7000HA Hysol GR828D KL-8500 MOLDING COMPOUND Hysol GR9810-1 GR9820 Emerson&cutting Hermiseal three proof paint CRC three proof paint CRC 70 Shi Min Hard Horn Glue Three key Electronic Glue Three key TB120 Three key TB1230 Three key TB3160 Three key TB3300 series Three key TB2500 Three key 1401D Static electricity prevention agent Pando 29A Three key organic silicone Loctite Loctite 7649 Loctite Loctite 3492 Loctite Loctite 349 Loctite Loctite 598 Loctite Loctite 595 Loctite Loctite 495 Elco DCA-SCC3 three proof paint Xiaoxi 14241 Hanxin 5295B Hanxin 2081 Dow Corning Q3-3600. Electrolube Henkel hanxin Hanxin Japan Konishi Shi Min Hardening Cemedine Loctite Dow Corning Japan Mineral Oil TripleBond MAXBOND EPO-TEK H20E and other insulation and heat conduction adhesives Moisture proof insulation adhesive Pouring sealant One component room temperature vulcanized silicone rubber Electronic silicone adhesive Adhesive Sealant Sealant Heat resistant adhesive Fire resistant adhesive Bonding adhesive Green adhesive Red adhesive Transparent adhesive Green red adhesive Horn adhesive Epoxy resin Silicone oil transformer rubber Mobile phone rubber Mata rubber Speaker adhesive Silicone thermal conductive silicone adhesive for camera, LCD adhesive for LED adhesive for power supply, semiconductor electronic adhesive, COB adhesive, UV adhesive, conductive adhesive, electrical sealing adhesive, hair foam adhesive, bottom filling adhesive, epoxy resin, polyurethane, organic silicone RTV silicone HTV silicone dispenser anti-static coating anti-static work clothes anti-static pad white light welding sales of various electronic products, with UL and SGS MIL certification. It is an electronic semiconductor electrical photoelectric motor and other industries.
Brand: other models: SC-320 Product name: thermal conductive potting adhesive Type: thermal conductive adhesive Hardening/curing mode: heating hardening Performance characteristics: thermal conductive use: thermal conductive potting Storage method: normal temperature Shelf life: one year Origin: Beijing Thermal conductivity: 3.2W
Beijing Xiyuan Technology Co., Ltd. General agent of Henkel Beijing Road Kangning 3M Luode dealer
LED、 The adhesive supplier in the power supply and new energy industries, and technicians provide overall adhesive solutions.
Potting glue, sealant, thermal conductive silicone grease, thermal conductive gasket, anti-static products, UV glue, etc
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LORD Thermoset SC-320LV (H) thermal conductive silicone potting adhesive is a two-component system, which can not only provide excellent thermal conductivity required for electronic/electrical packaging, but also retain the necessary silicon related properties.
Low Stress - When cured, shrinkage and component stress are low.
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SC-320 is a two-component silicone high thermal conductivity potting adhesive with thermal conductivity of 3.2W/mK. Low viscosity version SC-320LV, thermal conductivity: 2.6W/mK. They are suitable for potting with heat dissipation requirements, especially for electronic modules requiring heat dissipation.
Electronic potting adhesive is mainly used for bonding, sealing and potting of electronic and electrical components. The role of potting adhesive is to strengthen the integrity of electronic components and improve the resistance to external impact and vibration; Improve the insulation performance of internal components and lines, which is conducive to the miniaturization and lightweight of devices; Avoid direct exposure of components and circuits to the air, and improve the waterproof and moisture-proof performance of devices. Therefore, it can improve the use performance, stability and reliability of electronic devices. Because it is liquid before curing, it is easy to pour and use.
