Ablestik：
Conductive silver glue: mainly engaged in ABLEBOND 84-1A, 84-1LMI, 84-1LMINB (B1), 84-1LMISR4, 84-1LMIT (T1), 826-1DS, 826-2, 2600AT, 2600BT, 2185A, 2030SC, 2100A, 3185, 8290, 8340, 8360, 8352L, 968-2, 979-1, 71-1, JM7000 and a series of products, suitable for semiconductor (IC) packaging (such as DIP/SOP/TO-92/BGA...) LED (such as ordinary LED/LAMP/high-power tube/digital tube...) It is used in various processes such as sticking, dispensing and backing
Insulating adhesive: mainly engaged in ABLEBOND84-3, 84-3J, 84-3LV, 84-3MV, 789-3, 789-4, 2025D, 2025M, 2035SC, 8384, 8387A, 8387B, 2039H, DX-10, DX-20-4 and a series of products, which are suitable for semiconductor (IC) packaging, camera (CMOS/CCD) process, LED, smart card and other fields, and are used for various pastes, or sticking and other processes
UV adhesive: mainly engaged in a series of UV curing adhesives such as ABLELUXHGA-3E, HGA-3S, A4021T, A4035T, A4039T, A4061T, A4083T, A4086T, A4088T, A4502, CC4310, AA50T, BF-4, OG RFI146T, which are suitable for photoelectric, photoelectric instrument, optical fiber, mobile phone camera (CMOS) and other fields; For example, phone camera Lens fixation, fiber coupler, laser, jumper, attenuator, detector, etc.
Adhesive film: mainly engaged in ABLEFILM506, 508, 550S, 561K, 570K, 5020, 5020K, 5025E and a series of products, suitable for various electronic products, products, power supplies, etc.
Bottom filling glue: FP4450, UF1173, 4531, 4451 and other series.
Stycast 2850ft is a two-component, heat-conducting epoxy encapsulation/potting material. It has low expansion coefficient, good thermal conductivity (thermal conductivity is 1.3) and excellent electrical insulation performance. The 2850ft is designed for components requiring heat dissipation and thermal shock resistance. It can be used with a variety of curing agents. Due to different curing agents, the curing temperature ranges from room temperature to high temperature.
Stycast 2850ft is widely used in the encapsulation of sensors, especially thermal sensors, and has a long market share. There are a variety of colors to choose from. It has two components, long storage life and good thermal conductivity (1.3w/m.k). It is widely used in electronics, automobile, aviation and other industries.
Appearance: black or blue liquid,
Operating temperature - 70 ℃ - 180 ℃,
Viscosity cps,
Product specification: (main agent+curing agent=1 set)
Main agent - 8.17kg (18lb/barrel) curing agent - 0.454kg (1lb/barrel)
Loctite ABLESTIK 2902 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. LOCTITE ABLESTIK 2902 Passes American Space (NASA) Exhaust Standard
Conductive
Thermally conductive
Solvent free
High adhesion
Medical device conductive adhesive, low-temperature curing conductive adhesive, optical fiber conductive adhesive, 2902 low stress conductive adhesive.
Volume resistivity, 24 hr. @ 25 ° C 0.001 Ohm cm
Storage temperature 27.0 ° C
Shear strength, aluminum 700.0 psi
Curing method Room temperature curing
Curing time, recommended @ 25.0 ° C 24.0 hours
Base material ceramics
Appearance Paste
Type of technology Epoxy resin
Operating temperature - 60.0 - 110.0 ° C
Viscosity CP52, Speed 10 rpm 20000.0 mPa. s (cP)
Component quantity Two component
Beijing Xiyuan Technology Co., Ltd
With the continuous upgrading of electronic products and semiconductor products, with the strong support of the state for high-tech industries, Xiyuan Technology also provides good protection for the electronic and semiconductor industries.
Xiyuan Technology Electronic Materials:
Potting glue: Lord, Henkel, Dow Corning, Huitian, etc. It is widely used in electronic power supply, thick film circuit, automotive battery and other industries.
Conductive adhesive: Beijing EPO-TEK, 3M, Beijing ablestik, Beijing Emerson&Cuming, etc. Used in semiconductor, LED and other industries
Experimental equipment: provide X-RAY, FIB, microscope, etc. FBI、 Musashi dispenser, Nordson dispenser, potting machine, laboratory instruments.
Our electronic chemical materials include: adhesive, potting materials, conductive and thermal conductive interface materials, bare core bonding materials, COB packaging materials, CSP/Flip chip/BGA bottom filler, patch adhesive, electronic coatings, and UV curing materials. The application scope covers electronic components, electronic components, circuit board assembly, display and lighting industry, communication, automotive electronics, smart card/RFID and other fields.
Henkel Henkel Loctite 2651 two-component epoxy potting adhesive Stycast 2651MM epoxy resin adhesive
LOCTITE ® STYCAST 2651MM CAT 23LV is a general-purpose packaging material designed for machine distribution and parts requiring post forming processing. LOCTITE ® STYCAST 2651MM CAT 23LV can be used for a variety of catalysts. For more information on mixing performance when used with other available catalysts, contact your local Technical Service Representative for assistance and advice. Product advantages: general low viscosity, low color, good processability, good adhesion to glass, thermal shock resistance and impact resistance, reducing wear of instruments/mixing equipment.
Laser scribing protective liquid
Product Profile
Price:
¥0.00
VALTRON®TriAct ™ DF dicing solution series is made of non-ionic surfactant, disinfectant and other functional ingredients, and is suitable for semiconductor wafer dicing process. This product can effectively eliminate silica dust particles and sterilize the production system pipeline. It has low foam, fast defoaming and easy washing. The concentrated solution or low diluent of the scribing solution can prevent microbial growth, prevent corrosion, and reduce and neutralize the static charge. In addition to cleaning, VALTRON ® TriAct ™ DF series lubricating cutting blade can significantly reduce friction and surface tension when the dilution ratio is up to 1:4000, and act as a coolant to reduce the heat of silicon wafer cracking.
