The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
Rapid curing
Rapid flow
Exhaust through NASA
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
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The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Beijing Xiyuan Technology Co., Ltd
Conductive adhesive, insulating adhesive, three proofing paint, potting adhesive, thermal conductive material, parallel sealing and welding, electroplate table, bonding wire, bottom filling adhesive, phase adhesive, high-frequency adhesive, optical fiber adhesive, LOCTITE ECCOBOND FP4531, bottom filling design, used for flip chip applications with 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Beijing Xiyuan Technology Co., Ltd
Conductive adhesive, insulating adhesive, three proofing paint, potting adhesive, conductive material, parallel sealing and welding, electroplating table, bonding wire, bottom filling adhesive, phase adhesive, high-frequency adhesive, optical fiber adhesive
