Product name: ablestik 2030SC
Appearance: silver
Viscosity: Pas 11.6
Shear/tensile strength: Mpa 20.6
Active life: min 1440
Operating temperature ℃-
Shelf life: December
Curing condition: 110 ℃ * 90 Sec 150 ℃ * 10 Sec
Features Low temperature fast curing, good conductivity
Main applications: camera modeling group, touch screen
Package: 22.5g/piece
Loctite BONOTEC Ablestik 2030SC is a single component, fast curing conductive silver adhesive, which is specially developed for high-speed production. This product has proper flexibility, which can reduce stress and thus bend different surfaces. The ablestik 2030SC can be cured very quickly under equipment such as directional heat source and hot plate Curing in an oven or conveyor belt oven, it can also be cured quickly at temperatures as low as 100 º C.
Product description:
ABLEBOND 2030SC provides the following products
Technology proprietary mixed chemistry
Appearance silver
Curing Heat curing
pH 4.5
Product advantages • Fast curing
• Low voltage
Application chip connection
Filler type Silver
Key matrix Most metals
ABLEBOND 2030SC chip adhesive has been prepared
For high throughput chip bonding applications. This material
Designed to minimize stress and resulting warpage
Different surfaces. It can be used for various package sizes.
Typical properties of undamaged materials
Thixotropic index (0.5/5 rpm) 4.6
Viscosity, Brookfield CP51,25 ° C, mPa · s (cP):
Speed 5 rpm 11600
Service life @ 25 ° C, 24 hours
Shelf life @ - 40 ° C (from the date of production), 1st year
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card/radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding, thinning, bonding, alloy wire, light fluorine oil, heavy fluorine oil, DET D02 and other fields.
In 2017, Xiyuan Technology started joint research and development of integrated circuit/discrete device materials, domestic conductive silver adhesive insulation adhesive gold solder and other products. It has been recognized by China Electronics Technology Group/Aerospace Science and Industry Group and other enterprises. It has passed the relevant test certification of GJB.
Xiyuan Technology now has a ten thousand level purification production and manufacturing plant, a 500 square meter test plant and a 300 square meter production and testing equipment, which are widely used and recognized in the industry. It is equipped with semiconductor integrated circuit tester, discrete device tester, full-automatic gold wire silicon aluminum wire pressure welder, full-automatic coarse aluminum wire pressure welder, parallel seam welder, laser seam welder, sintering furnace, parallel seam welder, helium mass spectrometer leak detector, fluorine oil rough detector, high temperature reverse bias aging, high and low temperature environment test chamber, tensile shear force tester, constant acceleration centrifuge, particle noise The acoustic detector shock table and electric vibration table ensure that the products are strictly screened according to the project.
Provide small batch packaging test for semiconductor industry design companies, Chinese Academy of Sciences and other research and development units. Product name: ablestik 2030SC
Appearance: silver
Viscosity: Pas 11.6
Shear/tensile strength: Mpa 20.6
Active life: min 1440
Operating temperature ℃-
Shelf life: December
Curing condition: 110 ℃ * 90 Sec 150 ℃ * 10 Sec
Features Low temperature fast curing, good conductivity
Main applications: camera modeling group, touch screen
Package: 22.5g/piece
Loctite BONOTEC Ablestik 2030SC is a single component, fast curing conductive silver adhesive, which is specially developed for high-speed production. This product has proper flexibility, which can reduce stress and thus bend different surfaces. The ablestik 2030SC can be cured very quickly under equipment such as directional heat source and hot plate Curing in an oven or conveyor belt oven, it can also be cured quickly at temperatures as low as 100 º C.
Product description:
ABLEBOND 2030SC provides the following products
Technology proprietary mixed chemistry
Appearance silver
Curing Heat curing
pH 4.5
Product advantages • Fast curing
• Low voltage
Application chip connection
Filler type Silver
Key matrix Most metals
ABLEBOND 2030SC chip adhesive has been prepared
For high throughput chip bonding applications. This material
Designed to minimize stress and resulting warpage
Different surfaces. It can be used for various package sizes.
Typical properties of undamaged materials
Thixotropic index (0.5/5 rpm) 4.6
Viscosity, Brookfield CP51,25 ° C, mPa · s (cP):
Speed 5 rpm 11600
Service life @ 25 ° C, 24 hours
Shelf life @ - 40 ° C (from the date of production), 1st year
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card/radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding, thinning, bonding, alloy wire, light fluorine oil, heavy fluorine oil, DET D02 and other fields.
In 2017, Xiyuan Technology started joint research and development of integrated circuit/discrete device materials, domestic conductive silver adhesive insulation adhesive gold solder and other products. It has been recognized by China Electronics Technology Group/Aerospace Science and Industry Group and other enterprises. It has passed the relevant test certification of GJB.
Xiyuan Technology now has a ten thousand level purification production and manufacturing plant, a 500 square meter test plant and a 300 square meter production and testing equipment, which are widely used and recognized in the industry. It is equipped with semiconductor integrated circuit tester, discrete device tester, full-automatic gold wire silicon aluminum wire pressure welder, full-automatic coarse aluminum wire pressure welder, parallel seam welder, laser seam welder, sintering furnace, parallel seam welder, helium mass spectrometer leak detector, fluorine oil rough detector, high temperature reverse bias aging, high and low temperature environment test chamber, tensile shear force tester, constant acceleration centrifuge, particle noise The acoustic detector shock table and electric vibration table ensure that the products are strictly screened according to the project.
Provide small batch packaging test for semiconductor industry design companies, Chinese Academy of Sciences and other research and development units.
Product name: ablestik 2030SC
Appearance: silver
Viscosity: Pas 11.6
Shear/tensile strength: Mpa 20.6
Active life: min 1440
Operating temperature ℃-
Shelf life: December
Curing condition: 110 ℃ * 90 Sec 150 ℃ * 10 Sec
Features Low temperature fast curing, good conductivity
Main applications: camera modeling group, touch screen
Package: 22.5g/piece
Loctite BONOTEC Ablestik 2030SC is a single component, fast curing conductive silver adhesive, which is specially developed for high-speed production. This product has proper flexibility, which can reduce stress and thus bend different surfaces. The ablestik 2030SC can be cured very quickly under equipment such as directional heat source and hot plate Curing in an oven or conveyor belt oven, it can also be cured quickly at temperatures as low as 100 º C.
Product description:
ABLEBOND 2030SC provides the following products
Technology proprietary mixed chemistry
Appearance silver
Curing Heat curing
pH 4.5
Product advantages • Fast curing
• Low voltage
Application chip connection
Filler type Silver
Key matrix Most metals
ABLEBOND 2030SC chip adhesive has been prepared
For high throughput chip bonding applications. This material
Designed to minimize stress and resulting warpage
Different surfaces. It can be used in various package sizes.
Typical properties of undamaged materials
Thixotropic index (0.5/5 rpm) 4.6
Viscosity, Brookfield CP51,25 ° C, mPa · s (cP):
Speed 5 rpm 11600
Service life @ 25 ° C, 24 hours
Shelf life @ - 40 ° C (from the date of production), 1st year
Electronic coating UV curing material Wafer scribing protection Liquid crystal circle Temporary bonding Thinning conductive silver glue Sintering silver nano silver channel Corning COB glue red glue SMT red glue Aviation aerospace glue High temperature resistant potting glue Bond alloy wire insulation coating Bond alloy wire defoaming machine Parallel sealing machine Gluing machine KS Splitter SPT Chopper Chopper Ceramic Chopper Rodham Road Corning Dow X-RAY FIB FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Potting Machine Failure Analysis Fast Packaging Ceramic Shell Package COB Package Chip Bonding Package Cleaning Liquid Crystal Circle Cleaning Solution Silicon Wafer Cleaning Solution Sapphire Cutting Solution Ceramic Scribe Cleaning Solution Chip Adhesive IC Adhesive IC Conductive Adhesive Chip Conductive Adhesive IC insulation glue Henkel Loctite Henkel agent Henkel glue Loctite water channel Corning glue Lode glue structure glue automobile electronic glue COMS adhesive sensor adhesive sensor potting adhesive electronic potting adhesive high thermal conductivity epoxy potting adhesive high thermal conductivity epoxy potting adhesive low temperature resistant adhesive optical fiber adhesive pigtail adhesive optical communication adhesive light transmitting adhesive light blocking adhesive optocoupler adhesive Loctite agent ablestik adhesive heat conducting adhesive heat conducting adhesive glass silver adhesive conductive adhesive film insulation adhesive film DAF film blue film UV blue film, UV film, conductive adhesive, defoamer, bottom filling, defoamer, chip adhesive, chip adhesive, chip adhesive, insulating adhesive, CSP, bottom filling, die adhesive, die adhesive, conductive adhesive, conductive adhesive, film 5020, film 506, film JM7000, conductive adhesive, 84-1, conductive adhesive Ablestik conductive adhesive Henkel conductive adhesive Loctite conductive adhesive Lot potting adhesive Loctite film chip capping machine Glue defoamer Airtightness detection Shear force detection Chip tension test Ceramic packaging Chip Metal packaging Wafer passivation equipment Wafer etcher TSV Wafer deposition Product name: ablestik 2030SC
Appearance: silver
Viscosity: Pas 11.6
Shear/tensile strength: Mpa 20.6
Active life: min 1440
Operating temperature ℃-
Shelf life: December
Curing condition: 110 ℃ * 90 Sec 150 ℃ * 10 Sec
Features Low temperature fast curing, good conductivity
Main applications: camera modeling group, touch screen
Package: 22.5g/piece
Loctite BONOTEC Ablestik 2030SC is a single component, fast curing conductive silver adhesive, which is specially developed for high-speed production. This product has proper flexibility, which can reduce stress and thus bend different surfaces. The ablestik 2030SC can be cured very quickly under equipment such as directional heat source and hot plate Curing in an oven or conveyor belt oven, it can also be cured quickly at temperatures as low as 100 º C.
Product description:
ABLEBOND 2030SC provides the following products
Technology proprietary mixed chemistry
Appearance silver
Curing Heat curing
pH 4.5
Product advantages • Fast curing
• Low voltage
Application chip connection
Filler type Silver
Key matrix Most metals
ABLEBOND 2030SC chip adhesive has been prepared
For high throughput chip bonding applications. This material
Designed to minimize stress and resulting warpage
Different surfaces. It can be used in various package sizes.
Typical properties of undamaged materials
Thixotropic index (0.5/5 rpm) 4.6
Viscosity, Brookfield CP51,25 ° C, mPa · s (cP):
Speed 5 rpm 11600
Service life @ 25 ° C, 24 hours
Shelf life @ - 40 ° C (from the date of production), 1st year
Electronic coating UV curing material Wafer scribing protection Liquid crystal circle Temporary bonding Thinning conductive silver glue Sintering silver nano silver channel Corning COB glue red glue SMT red glue Aviation aerospace glue High temperature resistant potting glue Bond alloy wire insulation coating Bond alloy wire defoaming machine Parallel sealing machine Gluing machine KS Splitter SPT Chopper Chopper Ceramic Chopper Rodham Road Corning Dow X-RAY FIB FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Potting Machine Failure Analysis Fast Packaging Ceramic Shell Package COB Package Chip Bonding Package Cleaning Liquid Crystal Circle Cleaning Solution Silicon Wafer Cleaning Solution Sapphire Cutting Solution Ceramic Scribe Cleaning Solution Chip Adhesive IC Adhesive IC Conductive Adhesive Chip Conductive Adhesive IC insulation glue Henkel Loctite Henkel agent Henkel glue Loctite water channel Corning glue Lode glue structure glue automobile electronic glue COMS adhesive sensor adhesive sensor potting adhesive electronic potting adhesive high thermal conductivity epoxy potting adhesive high thermal conductivity epoxy potting adhesive low temperature resistant adhesive optical fiber adhesive pigtail adhesive optical communication adhesive light transmitting adhesive light blocking adhesive optocoupler adhesive Loctite agent ablestik adhesive heat conducting adhesive heat conducting adhesive glass silver adhesive conductive adhesive film insulation adhesive film DAF film blue film UV blue film, UV film, conductive adhesive, defoamer, bottom filling, defoamer, chip adhesive, chip adhesive, chip adhesive, insulating adhesive, CSP, bottom filling, die adhesive, die adhesive, conductive adhesive, conductive adhesive, film 5020, film 506, film JM7000, conductive adhesive, 84-1, conductive adhesive Ablestik conductive adhesive Henkel conductive adhesive Loctite conductive adhesive Lot potting adhesive Loctite film chip capping machine Glue defoamer Airtightness detection Shear force detection Chip tension test Ceramic packaging Chip Metal packaging Wafer passivation equipment Wafer etcher TSV Wafer deposition Product name: ablestik 2030SC
Appearance: silver
Viscosity: Pas 11.6
Shear/tensile strength: Mpa 20.6
Active life: min 1440
Operating temperature ℃-
Shelf life: December
Curing condition: 110 ℃ * 90 Sec 150 ℃ * 10 Sec
Features Low temperature fast curing, good conductivity
Main applications: camera modeling group, touch screen
Package: 22.5g/piece
Loctite BONOTEC Ablestik 2030SC is a single component, fast curing conductive silver adhesive, which is specially developed for high-speed production. This product has proper flexibility, which can reduce stress and thus bend different surfaces. The ablestik 2030SC can be cured very quickly under equipment such as directional heat source and hot plate Curing in an oven or conveyor belt oven, it can also be cured quickly at temperatures as low as 100 º C.
Product description:
ABLEBOND 2030SC provides the following products
Technology proprietary mixed chemistry
Appearance silver
Curing Heat curing
pH 4.5
Product advantages • Fast curing
• Low voltage
Application chip connection
Filler type Silver
Key matrix Most metals
ABLEBOND 2030SC chip adhesive has been prepared
For high throughput chip bonding applications. This material
Designed to minimize stress and resulting warpage
Different surfaces. It can be used for various package sizes.
Typical properties of undamaged materials
Thixotropic index (0.5/5 rpm) 4.6
Viscosity, Brookfield CP51,25 ° C, mPa · s (cP):
Speed 5 rpm 11600
Service life @ 25 ° C, 24 hours
Shelf life @ - 40 ° C (from the date of production), 1st year
Electronic coating UV curing material Wafer scribing protection Liquid crystal circle Temporary bonding Thinning conductive silver glue Sintering silver nano silver channel Corning COB glue red glue SMT red glue Aviation aerospace glue High temperature resistant potting glue Bond alloy wire insulation coating Bond alloy wire defoaming machine Parallel sealing machine Gluing machine KS Splitter SPT Chopper Chopper Ceramic Chopper Rodham Road Corning Dow X-RAY FIB FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Potting Machine Failure Analysis Fast Packaging Ceramic Shell Package COB Package Chip Bonding Package Cleaning Liquid Crystal Circle Cleaning Solution Silicon Wafer Cleaning Solution Sapphire Cutting Solution Ceramic Scribe Cleaning Solution Chip Adhesive IC Adhesive IC Conductive Adhesive Chip Conductive Adhesive IC insulation glue Henkel Loctite Henkel agent Henkel glue Loctite water channel Corning glue Lode glue structure glue automobile electronic glue COMS adhesive sensor adhesive sensor potting adhesive electronic potting adhesive high thermal conductivity epoxy potting adhesive high thermal conductivity epoxy potting adhesive low temperature resistant adhesive optical fiber adhesive pigtail adhesive optical communication adhesive light transmitting adhesive light blocking adhesive optocoupler adhesive Loctite agent ablestik adhesive heat conducting adhesive heat conducting adhesive glass silver adhesive conductive adhesive film insulation adhesive film DAF film blue film UV blue film, UV film, conductive adhesive, defoamer, bottom filling, defoamer, chip adhesive, chip adhesive, chip adhesive, insulating adhesive, CSP, bottom filling, die adhesive, die adhesive, conductive adhesive, conductive adhesive, film 5020, film 506, film JM7000, conductive adhesive, 84-1, conductive adhesive Ablestik conductive adhesive Henkel conductive adhesive Letai conductive adhesive Lot potting adhesive Letai film chip capping machine Glue defoamer Airtightness detection Shear force detection Chip tension test Ceramic packaging Chip Metal packaging Wafer passivation equipment Wafer etcher TSV Wafer deposition
LOCTITE ABLESTIK 2030SC provides the following products
features:
Technically proprietary mixed chemistry
Appearance silver
Heat curing
PH 4.5
Product advantage ● fast curing
● Low pressure
Application chip mounting
Filler Type Silver
Main substrate Most metals
LOCTITE ABLESTIK 2030SC chip adhesive has been prepared
For high-throughput chip mounting applications. This material is
Designed to minimize the stress between different materials and the resulting warpage
Surface. It can be used in various package sizes.
Application of ABLESTIK 2030SC photovoltaic laminated conductive adhesive solar photovoltaic module
Sell all kinds of electronic materials, operating brands: 3M shielding tape, 3M conductive adhesive, 3M conductive adhesive, 3M protective products, 3M masks, 3M earplugs, Henkel electronic adhesive, Lode EP-937, Lode SC-305, SC-309, SC-320, Dow Corning 184, Dow Corning DC160,,,,,,,,,,,,,,, Emerson&Cuming, ABLEBOND 84-1,AMICON 50262-3,, Emerson&Cuming E1211,E1213,E1330， ,, Ablestik, Loctite QMI516, Loctite electronic glue, Loctite, Loctite QMI 600, Loctite QMI168, Loctite MG40F, Loctite KL-2500, Loctite KL-5000HT, KL-6500H,KL-7000HA, Loctite GR828D, KL-8500 MOLDING COMPOUND, Loctite GR9810-1, GR9820, Emerson&Cuming, CRC three proof paint, CRC70,, Shi Min hard horn glue,, three key TB120, three key TB1230, three key TB3160, three key TB3300 series, three key TB2500,,, three key organic silica gel,,,,, Loctite 595, Loctite Loctite 495, Eligo DCA-SCC3 three proofing glue, Xiaoxi 14241, Hanxin 5295B, Hanxin 2081, Dow Corning Q3-3600. Electrolube,,, Konishi, Loctite, Dow Corning, Japan Mineral Oil MAXBOND and other insulation and heat conduction adhesive, moisture-proof insulation adhesive, pouring sealing adhesive, one component room temperature vulcanized silicone rubber, electronic silicone adhesive, adhesive, sealant, sealing adhesive, heat resistant adhesive, fireproof adhesive, bonding adhesive, green adhesive, red adhesive, transparent adhesive, cyan red adhesive, horn adhesive, epoxy resin, lead-free heat dissipation paste, silicone oil, transformer adhesive, mobile phone adhesive, motor adhesive, loudspeaker adhesive, Organic silicone, thermal conductive silicone grease, camera adhesive, LCD adhesive, LED adhesive, power supply adhesive, semiconductor electronic adhesive, COB adhesive, UV adhesive, conductive adhesive, thermal conductive adhesive, electrical potting adhesive, foam adhesive, bottom filling adhesive, epoxy resin, polyurethane, organic silicone, RTV silicone, HTV silicone dispenser sales of various electronic glue products MIL certification qualification. It is a supporting industry for electronics, electrical appliances, home appliances, optoelectronics, motors and other industries. High thermal conductivity epoxy resin potting adhesive 2850FT, Loctite 2850ft cat11 curing agent, sensor potting adhesive, power module potting adhesive.
