Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire defoamer parallel sealing adhesive dispenser wafer cleaning liquid crystal circular scribing protective liquid
Xiyuan Technology Electronic Materials:
Potting glue: Lodhenhan High Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments TSV Electroplating Equipment Bonding Machine Parallel Sealing Welder.
Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire defoamer parallel sealing adhesive dispenser wafer cleaning liquid crystal circular scribing protective liquid
Xiyuan Technology Electronic Materials:
Potting glue: Lodhenhan High Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments TSV Electroplating Equipment Bonding Machine Parallel Sealing Welder.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The scope of application involves electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card, radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding of liquid crystal circles, thinning of bond alloy wires and other fields. Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire defoamer parallel sealing adhesive dispenser wafer cleaning liquid crystal circular scribing protective liquid
Xiyuan Technology Electronic Materials:
Potting glue: Lodhenhan High Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments TSV Electroplating Equipment Bonding Machine Parallel Sealing Welder.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The scope of application involves electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card, radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding of liquid crystal circles, thinning of bond alloy wires and other fields.
Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Potting glue: Lodhenhan High Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments TSV Electroplating Equipment Bonding Machine Parallel Sealing Welder.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The scope of application involves electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card, radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding of liquid crystal circles, thinning of bond alloy wires and other fields. Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Potting glue: Rodham Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments TSV Electroplating Equipment Bonding Machine Parallel Sealing Welder.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The scope of application involves electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card, radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding of liquid crystal circles, thinning of bond alloy wires and other fields.
Product description
Loctite ECCOBOND f131 BIPAX offers the following products.
characteristic:
epoxy resin
Clear color
Clear color (mixing)
Room temperature curing or heat curing
Operating temperature - 60 to 120 degrees
● High Tg
Mix proportion by weight-
Resin: curing agent
100:30
Applied optics/optoelectronics
Typical optical application optical fiber connector, LED display,
Lens and other optical elements
Loctite ECCOBOND F 131 BIPAX fiber adhesive is designed to terminate all types of fiber optic connectors, as well as LED displays, lenses and other optical components. The typical Tg produced by it is 95 ° C, thus meeting the specification requirements of Bellcore and connector manufacturers
Xiyuan Technology now has a ten thousand level purification production and manufacturing plant, a 500 square meter test plant and a 300 square meter production and testing equipment, which are widely used and recognized in the industry. It is equipped with semiconductor integrated circuit tester, discrete device tester, full-automatic gold wire silicon aluminum wire pressure welder, full-automatic coarse aluminum wire pressure welder, parallel seam welder, laser seam welder, sintering furnace, parallel seam welder, helium mass spectrometer leak detector, fluorine oil rough detector, high temperature reverse bias aging, high and low temperature environment test chamber, tensile shear force tester, constant acceleration centrifuge, particle noise The acoustic detector shock table and electric vibration table ensure that the products are strictly screened according to the project.
Provide small batch packaging test for semiconductor industry design companies, Chinese Academy of Sciences and other research and development units.
LOCTITE STYCAST 2651MM/CATALYST 23LV
LOCTITE STYCAST 2651MM/CATALYST 9
LOCTITE STYCAST 2850FT/CAT 11
LOCTITE STYCAST 2850FT/CAT 23 LV
LOCTITE STYCAST 2850KT/CATALYST 9
LOCTITE STYCAST 2850MT/CATALYST 24LV
Loctite STYCAST 50500D
Loctite STYCAST A312
Loctite STYCAST E1070
Loctite STYCAST E1847
LOCTITE STYCAST EFF15 SYNTACTIC FOAM POWDER
Loctite STYCAST U2500
LOCTITE ABLESTIK 104
LOCTITE ABLESTIK 16-1
LOCTITE ABLESTIK 2000
LOCTITE ABLESTIK 2000B
LOCTITE ABLESTIK 2000T
LOCTITE ABLESTIK 2025D
LOCTITE ABLESTIK 2025DSI
LOCTITE ABLESTIK 2030SC
LOCTITE ABLESTIK 2035SC
LOCTITE ABLESTIK 2053S
LOCTITE ABLESTIK 2100A
LOCTITE ABLESTIK 2106
LOCTITE ABLESTIK 2106T
LOCTITE ABLESTIK 2115
LOCTITE ABLESTIK 2116
LOCTITE ABLESTIK 2151
LOCTITE ABLESTIK 2158
LOCTITE ABLESTIK 2300
LOCTITE ABLESTIK 2310
LOCTITE ABLESTIK 2332
LOCTITE ABLESTIK 2332-17
LOCTITE ABLESTIK 2600AT
LOCTITE ABLESTIK 2700B
LOCTITE ABLESTIK 2700HT
LOCTITE ABLESTIK 281
LOCTITE ABLESTIK 282
LOCTITE ABLESTIK 285
LOCTITE ABLESTIK 2902
LOCTITE ABLESTIK 2958
LOCTITE ABLESTIK 3230
LOCTITE ABLESTIK 3230A
LOCTITE ABLESTIK 3290
LOCTITE ABLESTIK 342-37
LOCTITE ABLESTIK 3880
LOCTITE ABLESTIK 3888
LOCTITE ABLESTIK 45
LOCTITE ABLESTIK 5020K
LOCTITE ABLESTIK 5025E
LOCTITE ABLESTIK 550
LOCTITE ABLESTIK 550K
LOCTITE ABLESTIK 551
LOCTITE ABLESTIK 561
LOCTITE ABLESTIK 561K
LOCTITE ABLESTIK 563K
LOCTITE ABLESTIK 566K
Optocoupler adhesive Optocoupler reflective adhesive Optical fiber adhesive F113 Optical fiber adhesive F131 Optical fiber adhesive
Assembly adhesive conductive adhesive
LOCTITE ABLESTIK ABLEBOND 84-1LMI
LOCTITE ABLESTIK ABLEBOND 84-1LMISR4
LOCTITE ABLESTIK ICP-3535M1
LOCTITE ABLESTIK ICP-4001
LOCTITE ECCOBOND CE3103WLV
LOCTITE ECCOBOND CE3520-3
LOCTITE ECCOBOND CE8500
LOCTITE 3880
LOCTITE 59C
LOCTITE 3888
LOCTITE 2902
LOCTITE 56C
Non-conductive adhesive
LOCTITE ABLESTIK ABLEBOND 2025D
LOCTITE ABLESTIK ABLEBOND 84-3
LOCTITE ABLESTIK ABLEBOND 8700D
LOCTITE ABLESTIK ABLEBOND 104 A/B
LOCTITE ABLESTIK ABLEBOND QMI536NB
Thin film conductive type
Loctite CF3350
MEMS conductive adhesive insulating adhesive low stress adhesive 2025D 84-1LMI JM7000
Thick film conductive adhesive 84-1A 84-1LMI 84-1LMIT1 JM7000 84-3 2025D
Thick film circuit adhesive film 506 adhesive film 5020 adhesive film thick film circuit potting adhesive IGBT potting adhesive for thick film circuit
84-3J insulation adhesive chip insulation adhesive Loctite conductive adhesive Loctite three proof paint 3900, Loctite insulation adhesive, chip packaging adhesive,
Optical fiber adhesive, optocoupler adhesive, circuit potting adhesive, sensor potting adhesive, power potting adhesive, Loctite UF3808 bottom filling adhesive, microwave device conductive adhesive, low stress bottom filling adhesive, high thermal conductivity potting adhesive, BGA bottom filling agent, BGA thermal conductivity adhesive, DAF film, FOW film, DAF film, conductive adhesive film, thermal conductivity adhesive film, chip adhesive film, packaging adhesive film, IC adhesive film, wafer adhesive film, UF1173 RF device bottom filling adhesive, high-frequency transmission adhesive, phase adhesive, 5G bottom filling adhesive, base station adhesive.
Ablestik optical communication device glue, high transmittance UV glue, optical fiber tail glue, optical fiber head glue, passing the double 85 test, low temperature resistance - 65 degrees.
Loctite 3900 three proof paint, Loctite 3900 three proof paint, military three proof paint, military three proof paint, fast curing three proof paint, transparent coating, UV curing three proof paint, spraying three proof paint, common film coating three proof paint, silicon based three proof paint. Solventless three proof paint, automobile application three proof paint, compatible with solder mask, no cleaning flux, environmental protection three proof paint. Crc70 three proof paint, crc three proof paint, crc2403 three proof paint, red three proof paint, transparent three proof paint. The circuit board is coated with three proofing paint. Marine paint, seawater resistant paint
Loctite EO1058 single group epoxy adhesive, single group epoxy potting adhesive, automotive sensor potting adhesive, COB potting adhesive, Loctite EO1058 potting adhesive, Loctite eo1016 low-temperature storage potting adhesive, power module potting adhesive, military potting adhesive, military potting adhesive. High pressure resistant potting adhesive, underwater potting adhesive, oil pump potting adhesive, oil resistant potting adhesive, black potting adhesive, transparent potting adhesive, silicon gel, Dow Corning 184 adhesive, micro inverter potting adhesive, industrial sensor potting adhesive, medical sensor potting adhesive, medical sensor conductive adhesive
Wafer temporary adhesive, wafer scribing fluid, wafer temporary bonding and debonding, wafer blue film, chip temporary adhesive, chip temporary adhesive paraffin, chip paraffin, wafer paraffin, chip blue film, engine controller potting adhesive, corrosion resistant potting adhesive, corrosion resistant adhesive, aviation adhesive, aerospace adhesive, military adhesive, military adhesive, flexible conductive adhesive, low-temperature curing conductive adhesive, Room temperature curing conductive adhesive, flexible insulating adhesive, chip insulating adhesive, ic insulating adhesive, MMIC conductive adhesive, GaAs conductive adhesive, solvent-free conductive adhesive, automatic chip bonding conductive adhesive, automatic chip insulating adhesive
High temperature resistant chip insulation adhesive, extremely low stress insulation adhesive, low stress insulation adhesive, thin film thick film conductive adhesive, thin film conductive adhesive, thick film conductive adhesive, 8700K thick film conductive adhesive, 8700K thick film gold surface conductive adhesive, MIL conductive adhesive, national military standard conductive adhesive, non collapse conductive adhesive, non collapse insulating adhesive, military standard conductive adhesive
Loctite 2280LV adhesive, Loctite 2280LV structural adhesive, 2280lv sensor adhesive, black light curing adhesive, ceramic adhesive, LCP adhesive, stainless steel adhesive, light blocking adhesive, light blocking insulation adhesive, camera adhesive, camera adhesive, high temperature resistant adhesive, solvent-free structural adhesive, solvent-free adhesive, patch adhesive, red adhesive, wave soldering adhesive, SMT red adhesive, Loctite 3609 red adhesive, Loctite patch adhesive, Loctite red adhesive, silk screen conductive adhesive, silk screen red adhesive. Electromagnetic shielding conductive adhesive, electromagnetic shielding adhesive strip, optical device crystal adhesive, optical module crystal adhesive, optical communication conductive adhesive, optical communication crystal adhesive, optical communication crystal adhesive, optical module positioning adhesive, optical module thermal adhesive, optical module 2280LV positioning adhesive, Loctite 2280 positioning adhesive, Loctite ablestik2032 conductive adhesive, Loctite 2032s optical communication conductive adhesive, Loctite 1505thtg optical path adhesive, Loctite F113 pigtail adhesive, Loctite F121 pigtail adhesive, pigtail adhesive, BF-4 optical device potting adhesive, Loctite 50T positioning adhesive, optical device positioning adhesive LUX AA50T. 2030SC low stress conductive adhesive, light module low stress conductive adhesive, Loctite 8068ta high conductivity conductive adhesive, Loctite 3555r conductive adhesive, ablestik 3555r glass conductive adhesive, Loctite QMI2569 black porcelain conductive adhesive, Loctite 5025E conductive adhesive film, ablestik 5025e conductive adhesive film, light module conductive adhesive film, filler at the bottom of light module, filler at the bottom of light module, filler at the bottom of light module. Optocoupler adhesive Optocoupler reflective adhesive Optical fiber adhesive F113 Optical fiber adhesive F131 Optical fiber adhesive
Assembly adhesive conductive adhesive
LOCTITE ABLESTIK ABLEBOND 84-1LMI
LOCTITE ABLESTIK ABLEBOND 84-1LMISR4
LOCTITE ABLESTIK ICP-3535M1
LOCTITE ABLESTIK ICP-4001
LOCTITE ECCOBOND CE3103WLV
LOCTITE ECCOBOND CE3520-3
LOCTITE ECCOBOND CE8500
LOCTITE 3880
LOCTITE 59C
LOCTITE 3888
LOCTITE 2902
LOCTITE 56C
Non-conductive adhesive
LOCTITE ABLESTIK ABLEBOND 2025D
LOCTITE ABLESTIK ABLEBOND 84-3
LOCTITE ABLESTIK ABLEBOND 8700D
LOCTITE ABLESTIK ABLEBOND 104 A/B
LOCTITE ABLESTIK ABLEBOND QMI536NB
Thin film conductive type
Loctite CF3350
MEMS conductive adhesive insulating adhesive low stress adhesive 2025D 84-1LMI JM7000
Thick film conductive adhesive 84-1A 84-1LMI 84-1LMIT1 JM7000 84-3 2025D
Thick film circuit adhesive film 506 adhesive film 5020 adhesive film thick film circuit potting adhesive IGBT potting adhesive for thick film circuit
84-3J insulation adhesive chip insulation adhesive Loctite conductive adhesive Loctite three proof paint 3900, Loctite insulation adhesive, chip packaging adhesive,
Optical fiber adhesive, optocoupler adhesive, circuit potting adhesive, sensor potting adhesive, power potting adhesive, Loctite UF3808 bottom filling adhesive, microwave device conductive adhesive, low stress bottom filling adhesive, high thermal conductivity potting adhesive, BGA bottom filling agent, BGA thermal conductivity adhesive, DAF film, FOW film, DAF film, conductive adhesive film, thermal conductivity adhesive film, chip adhesive film, packaging adhesive film, IC adhesive film, wafer adhesive film, UF1173 RF device bottom filling adhesive, high-frequency transmission adhesive, phase adhesive, 5G bottom filling adhesive, base station adhesive.
Ablestik optical communication device glue, high transmittance UV glue, optical fiber tail glue, optical fiber head glue, passing the double 85 test, low temperature resistance - 65 degrees.
Loctite 3900 three proof paint, Loctite 3900 three proof paint, military three proof paint, military three proof paint, fast curing three proof paint, transparent coating, UV curing three proof paint, spraying three proof paint, common film coating three proof paint, silicon based three proof paint. Solventless three proof paint, automobile application three proof paint, compatible with solder mask, no cleaning flux, environmental protection three proof paint. Crc70 three proof paint, crc three proof paint, crc2403 three proof paint, red three proof paint, transparent three proof paint. The circuit board is coated with three proofing paint. Marine paint, seawater resistant paint
Loctite EO1058 single group epoxy adhesive, single group epoxy potting adhesive, automotive sensor potting adhesive, COB potting adhesive, Loctite EO1058 potting adhesive, Loctite eo1016 low-temperature storage potting adhesive, power module potting adhesive, military potting adhesive, military potting adhesive. High pressure resistant potting adhesive, underwater potting adhesive, oil pump potting adhesive, oil resistant potting adhesive, black potting adhesive, transparent potting adhesive, silicon gel, Dow Corning 184 adhesive, micro inverter potting adhesive, industrial sensor potting adhesive, medical sensor potting adhesive, medical sensor conductive adhesive
Wafer temporary adhesive, wafer scribing fluid, wafer temporary bonding and debonding, wafer blue film, chip temporary adhesive, chip temporary adhesive paraffin, chip paraffin, wafer paraffin, chip blue film, engine controller potting adhesive, corrosion resistant potting adhesive, corrosion resistant adhesive, aviation adhesive, aerospace adhesive, military adhesive, military adhesive, flexible conductive adhesive, low-temperature curing conductive adhesive, Room temperature curing conductive adhesive, flexible insulating adhesive, chip insulating adhesive, ic insulating adhesive, MMIC conductive adhesive, GaAs conductive adhesive, solvent-free conductive adhesive, automatic chip bonding conductive adhesive, automatic chip insulating adhesive
High temperature resistant chip insulation adhesive, extremely low stress insulation adhesive, low stress insulation adhesive, thin film thick film conductive adhesive, thin film conductive adhesive, thick film conductive adhesive, 8700K thick film conductive adhesive, 8700K thick film gold surface conductive adhesive, MIL conductive adhesive, national military standard conductive adhesive, non collapse conductive adhesive, non collapse insulating adhesive, military standard conductive adhesive
Assembly adhesive conductive adhesive
LOCTITE ABLESTIK ABLEBOND 84-1LMI
LOCTITE ABLESTIK ABLEBOND 84-1LMISR4
LOCTITE ABLESTIK ICP-3535M1
LOCTITE ABLESTIK ICP-4001
LOCTITE ECCOBOND CE3103WLV
LOCTITE ECCOBOND CE3520-3
LOCTITE ECCOBOND CE8500
LOCTITE 3880
LOCTITE 59C
LOCTITE 3888
LOCTITE 2902
LOCTITE 56C
Non-conductive adhesive
LOCTITE ABLESTIK ABLEBOND 2025D
LOCTITE ABLESTIK ABLEBOND 84-3
LOCTITE ABLESTIK ABLEBOND 8700D
LOCTITE ABLESTIK ABLEBOND 104 A/B
LOCTITE ABLESTIK ABLEBOND QMI536NB
Thin film conductive type
Loctite CF3350
MEMS conductive adhesive insulating adhesive low stress adhesive 2025D 84-1LMI JM7000
Thick film conductive adhesive 84-1A 84-1LMI 84-1LMIT1 JM7000 84-3 2025D
Thick film circuit adhesive film 506 adhesive film 5020 adhesive film thick film circuit potting adhesive IGBT potting adhesive for thick film circuit
84-3J insulation adhesive chip insulation adhesive Loctite conductive adhesive Loctite three proof paint 3900, Loctite insulation adhesive, chip packaging adhesive,
Optical fiber adhesive, optocoupler adhesive, circuit potting adhesive, sensor potting adhesive, power potting adhesive, Loctite UF3808 bottom filling adhesive, microwave device conductive adhesive, low stress bottom filling adhesive, high thermal conductivity potting adhesive, BGA bottom filling agent, BGA thermal conductivity adhesive, DAF film, FOW film, DAF film, conductive adhesive film, thermal conductivity adhesive film, chip adhesive film, packaging adhesive film, IC adhesive film, wafer adhesive film, UF1173 RF device bottom filling adhesive, high-frequency transmission adhesive, phase adhesive, 5G bottom filling adhesive, base station adhesive.
Ablestik optical communication device glue, high transmittance UV glue, optical fiber tail glue, optical fiber head glue, passing the double 85 test, low temperature resistance - 65 degrees.
Loctite 3900 three proof paint, Loctite 3900 three proof paint, military three proof paint, military three proof paint, fast curing three proof paint, transparent coating, UV curing three proof paint, spraying three proof paint, common film coating three proof paint, silicon based three proof paint. Solventless three proof paint, automobile application three proof paint, compatible with solder mask, no cleaning flux, environmental protection three proof paint. Crc70 three proof paint, crc three proof paint, crc2403 three proof paint, red three proof paint, transparent three proof paint. The circuit board is coated with three proofing paint. Marine paint, seawater resistant paint
Loctite EO1058 single group epoxy adhesive, single group epoxy potting adhesive, automotive sensor potting adhesive, COB potting adhesive, Loctite EO1058 potting adhesive, Loctite eo1016 low-temperature storage potting adhesive, power module potting adhesive, military potting adhesive, military potting adhesive. High pressure resistant potting adhesive, underwater potting adhesive, oil pump potting adhesive, oil resistant potting adhesive, black potting adhesive, transparent potting adhesive, silicon gel, Dow Corning 184 adhesive, micro inverter potting adhesive, industrial sensor potting adhesive, medical sensor potting adhesive, medical sensor conductive adhesive
Wafer temporary adhesive, wafer scribing fluid, wafer temporary bonding and debonding, wafer blue film, chip temporary adhesive, chip temporary adhesive paraffin, chip paraffin, wafer paraffin, chip blue film, engine controller potting adhesive, corrosion resistant potting adhesive, corrosion resistant adhesive, aviation adhesive, aerospace adhesive, military adhesive, military adhesive, flexible conductive adhesive, low-temperature curing conductive adhesive, Room temperature curing conductive adhesive, flexible insulating adhesive, chip insulating adhesive, ic insulating adhesive, MMIC conductive adhesive, GaAs conductive adhesive, solvent-free conductive adhesive, automatic chip bonding conductive adhesive, automatic chip insulating adhesive
