1 Characteristics of spherical silicon powder
Spherical silicon micro powder is a white powder with high purity and fine particles. It has good dielectric properties and thermal conductivity, and has the advantages of low expansion coefficient, high heat resistance, high moisture resistance, high filling amount, low expansion, low stress, low impurities, low friction coefficient, etc. Compared with angular silicon powder, spherical silicon powder has the following advantages.
(1) The surface fluidity of the ball is good, and it is evenly stirred with the resin to form a film, so that the amount of resin added is small, and the amount of silicon powder filled is * * * high. Therefore, spheroidization means that the filling rate of silicon powder increases. The higher the filling rate of silicon powder, the smaller its thermal expansion coefficient, the lower its thermal conductivity, and the closer it is to the thermal expansion coefficient of monocrystalline silicon, The use performance of the electronic components produced thereby is also better.
(2) Compared with the plastic packaging material made of angular silicon powder, the stress concentration of spherical plastic packaging material is * * * small and the strength is * * * high. When the stress concentration of angular silicon powder plastic packaging material is 1, the stress of spherical powder is only 0.6. The microelectronic device made by the method has high yield, is convenient for transportation and installation, and is not easy to produce mechanical damage in the use process.
(3) Compared with angular silicon powder, spherical powder has smaller friction coefficient and less wear on the mold, which can double the service life of the mold.
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