Our company is located in Suzhou, Jiangsu Province and Dongguan, Guangdong Province. The main products of the company are the R&D, production and manufacturing of domestic ceramic cleavers (ceramic beak cleavers). The cleavers have complete specifications and models, completely replacing imported ceramic cleavers. They are customized according to samples and parameters, customized according to requirements, quality assurance and timely delivery.. Welcome to consult and cooperate! 1. Our company is committed to the R&D and production of medium and high domestic ceramic cleavers in the field of IC packaging. Production and manufacturing of ceramic cleavers in the field of led packaging. 2. Ceramic powder and embryo parts are completely independently researched, developed and produced 3. The full series of ceramic cleavers (ceramic tip cleavers) used for gold, silver and copper wire are widely used in semiconductor IC chip packaging and LED packaging, and are core materials in chip bonding process. Our ceramic cleavers fill the gap of domestic ceramic cleavers in the middle and high market. Once it was launched into the market, it was supported and cooperated by semiconductor chip packaging * * *, and was unanimously recognized. Our company provides a full range of cleavers for gold wire, silver wire and copper wire applications. Provide cost-effective solutions for IC packaging and bonding materials. Support domestic production. Your recognition is our driving force. We sincerely look forward to your call. Hot selling areas: Shanghai, Suzhou, Wuhan, Xi'an, Ningbo, Hangzhou, Wuxi, Nantong, Dongguan, Shenzhen, Guangzhou, Zhongshan, Jiangmen, Zhengzhou, Foshan, Jinan, Hefei, Beijing, Tianjin, Chengdu, Chongqing. Welcome to call for advice on ceramic cleavers, customized domestic ceramic mouth cleavers, and customized samples. The surface treatment of our company's ceramic cleaver core technology is uniform and stable between batches. The sample production process of our company's ceramic cleaver: the customer provides two physical objects or relevant important dimensions, and the company designs and produces according to the requirements to the plan. Our company has complete models of ceramic cleavers, which can completely replace imported ceramic cleavers. Stable quality. Welcome consultation and cooperation. Standing stock, customized in different shapes, timely delivery. Ceramic cleaver is widely used in semiconductor IC packaging and LED packaging, and is a key core tool in the packaging process. Ceramic cleavers are used as wire bonding tools in the wire bonding process, and can be used for bonding and packaging of SCR, SAW, LED, diode, triode, IC chip and other circuits. The main product is to provide the electrical connection between the chip and the external system, provide a stable and reliable working environment for the chip, play a mechanical and environmental protection role for the integrated circuit chip, provide a thermal path, and ensure the normal heat dissipation of the chip. In semiconductor technology, packaging is one of the important links, and "wire bonding" is the main way to realize the circuit connection between the chip and the substrate. In this process, one kind of tool is indispensable, that is, ceramic cleaver. Welcome consultation, support and cooperation. The company is mainly engaged in the research and development of semiconductor bonding tools, namely ceramic cleavers, which are widely used in semiconductor IC packaging and LED packaging, and are key core tools in the packaging process. The main product is to provide the electrical connection between the chip and the external system, provide a stable and reliable working environment for the chip, play a mechanical and environmental protection role for the integrated circuit chip, provide a thermal path, and ensure the normal heat dissipation of the chip. Our products aim at the advanced market. We highlight the integrated advantages of materials, processes and processing technology, focus on the high-precision ceramic industry, and are committed to becoming the leader of the domestic semiconductor bonding tool industry. In semiconductor technology, packaging is one of the key links, and "wire bonding" is the main way to realize the circuit connection between the chip and the substrate. In this process, one kind of tool is indispensable, that is, ceramic cleaver. Ceramic bonding tool, also known as ceramic tip, is an axisymmetric ceramic tool with vertical holes, which belongs to accurate micro structure ceramic parts. In application, ceramic cleavers are used as wire bonding tools in wire bonding process, and can be used for bonding and packaging of SCR, SAW, LED, diode, triode, IC chip and other circuits.
