The company has experienced technicians who can provide customers with high-precision glass wafers with thickness ≥ 0.1mm and overall dimension ≥ Φ 2 ", which can be used in CMOS, CCD sensors, integrated circuits or micro mechanical component packaging (ME MS ）, communication and data processing, optics, electronic products, household appliances, * * *, scientific research and other high-tech products.
Glass wafer processing technical parameters:
a) Material: Corning E-XG 、 PYREX7740、 quartz glass 、BOROFLOAT、B270 、 D263T 、 AF32 、 BK-7
b) Standard thickness: 0.1mm 、 0.145mm 、 0.2mm 、 0.3mm、0.4mm 、 0.5mm、0.7mm、1.0mm、1.1mm 、 1.5mm (thickness tolerance ± 0.02mm)
c) Standard size: Φ 2 ", Φ 3", Φ 4 ", Φ 5", Φ 6 ", Φ 8", Φ 12“（ other Customizable size)
d) Appearance: 60/40; 40/20 ； 20/10
e) Surface roughness (Ra)<1.5nm
f) Parallelism<0.01mm
Basic properties of Corning E-XG glass wafer:
Technical parameters: |
Density (g/cc) | two point three |
Thermal Expansion | three |
Transmittance | ＞ 90% |
Softening point | nine hundred and seventy-one ℃ |
TTV/ planeness | <0.005 |
Bow/ Warpage | <0.01 |
Warp/ Curvature | <0.01 |
Vickers Modulus/ Vickers hardness | six hundred and forty |
Product features:
● Application of special glass materials
● Experience in polishing field, with uniform surface quality
● Clean room capable of encapsulating ready to use substrates
● Structural wafer with good tolerance
● Customers * * * products that meet all requirements and industry standards (e.g. SEMI)
● Integrated production steps that meet all requirements of ISO 9001:2000
Typical applications:
● Micro optics
● MEMS (pressure sensor, accelerometer ）
● Wafer level packaging (image sensor packaging...)
● Bioengineering (microfluidics, DNA analysis...)
● and many other customer * * * applications
g) Edge rounding off C0.05-0.2mm
h) Crack<0.2mm, no internal crack
i) The surface shall be clean and free of marks and stains. It shall be packed in Class 1000 ultra clean room, Class 100 ultra clean bag or single chip box. v
