According to foreign media, recently Indian software company Zoho plans to invest 700 million dollars in chip manufacturing. Zoho was founded in 1996 and is currently headquartered in Tamil Nadu, India, providing software and related services to enterprises in 150 countries.

This time Zoho is considering the production of compounds semiconductor And seek incentives from the Indian government. The Ministry of Electronics and Information Technology of India is responsible for promoting India chip The proposal is being reviewed by the planned team.

Data shows that compound semiconductor refers to a semiconductor material composed of atoms of two or more different elements. Compared with traditional silicon (Si) semiconductor, compound semiconductor usually has higher electron mobility, wider energy band gap, better thermal stability and radiation resistance, and is suitable for high speed, high frequency High temperature environment and high efficiency applications with special requirements. There are many kinds of compound semiconductor materials. Silicon carbide and gallium nitride are representative products. At present, their applications in consumer electronics and electric vehicles have attracted much attention.

In recent years, India has actively promoted chip assembly and local production, aiming to become an important player in the global semiconductor market. The industry pointed out that the Indian chip plan aims to enhance the country's position and competitiveness in the global semiconductor industry by increasing investment, seeking international cooperation, building infrastructure and cultivating talents.

In February this year, India approved a semiconductor manufacturing investment plan with a total investment of 1.26 trillion rupees (15.2 billion US dollars), involving the field of wafer factories and chip packaging, including the first Indian wafer factory cooperated by Tata Group and Lijiadian. It is reported that the wafer factory is expected to produce 50000 wafers per month, covering more than 28nm, 40nm, 55nm, 90nm and 110nm mature nodes. The goal is to produce 3 billion chips per year for various market segments, including high-power computers, electric vehicles, telecommunications and power electronics products.