TSMC first disclosed 1.6 nanometer technology A16

Recently, TSMC held the "2024 TSMC North America Technology Forum" in the United States, which publicly demonstrated its cutting-edge manufacturing technology, advanced packaging technology, and three-dimensional integrated circuit (3D IC) technology to the world. Among them, the highly anticipated TSMC A16 (1.6nm) process technology debuted for the first time.

According to TSMC, A16 process technology combines the company's super rail framework and nano chips transistor The technology is expected to achieve mass production in 2026. The unique feature of the super rail technology is that it can skillfully move the power supply network to the back of the wafer, thereby releasing more space for the front of the wafer. This innovative design significantly improves the logic density and performance, and also makes A16 process technology particularly suitable for high-performance computing (HPC) products that require complex signal wiring and dense power supply networks.

Compared with the N2P process, the A16 chip density is increased by 1.10 times. At the same operating voltage, the speed of A16 increases by 8-10%, while at the same speed, its power consumption decreases by 15-20%.

In addition to A16 technology, TSMC also announced N4C technology. As a continuation and optimization of the existing N4P technology, N4C not only reduces the grain cost by up to 8.5%, but also provides a more easily adopted design rule. The N4C technology is fully compatible with the popular N4P technology, providing customers with a smooth migration path to the N4C technology. It is reported that N4C technology is expected to achieve mass production in 2025.

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