Henkel Loctite Henkel bottom filling glue, Chongqing UF1173 bottom filling glue chip

Thermal conductive silica gel
Thermal conductive silica gel is a composite of one component silicone adhesive added with thermal conductive materials. It has good thermal conductivity and adhesion, and can effectively fill the gap between radiator parts and heat sources. At room temperature, the heat transfer adhesive absorbs the moisture in the air and reacts and solidifies to form a silicone gel with flame retardancy, pressure resistance, heat conduction and high adhesion.

Thermal conductive silicone grease
Thermal conductive silicone grease is a paste shaped heat dissipation product, which is filled between electronic components and heat sinks. It can fully wet the contact surface, thus forming a very low thermal resistance interface. Its heat dissipation efficiency is much higher than other types of heat dissipation products.

Thermal conductive silica gel sheet
Thermal conductive silica gel sheets are used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable them to cover very uneven surfaces. Heat is transmitted from the separation device or the entire PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of the heating electronic components.

Heat conductive double-sided adhesive
Thermal conductive double-sided adhesive tape is widely used to bond heat sinks to microprocessors and other power consuming semiconductors. These adhesive tapes have low adhesive strength and thermal impedance, and can effectively replace grease and mechanical fixation

An epoxy resin type bonding system with low moisture absorption of silver glue is used for packaging and bonding of electronic components and modules such as LCD, LED, wireless wired communication equipment, crystal oscillator, integrated circuit chip, etc., and also for bonding between metals.
Product benefits
• Suitable for high-speed dispensing process, with thixotropy and no creeping phenomenon
• Meet the requirements of high temperature resistance
Adhesive force of
85 ℃/85% RH stability
Domestic chip conductive adhesive, domestic substitute conductive adhesive, insulating adhesive 9969 conductive adhesive 9973 insulating adhesive.

LOCTITE ABLESTIK 104， Epoxy resin, components
LOCTITE ® ABLESTIK 104 adhesive is designed for applications requiring temperature exposure. This adhesive can withstand continuous exposure temperatures up to 230 º C. It can also withstand short-term exposure temperatures up to 280 º C.
Chemical resistance of
Non-conductive
High shear strength







YSOL STYCAST 2561/CAT 11
HYSOL STYCAST 2651MM/CATALYST 23LV
HYSOL STYCAST 2651MM/CATALYST 9
HYSOL STYCAST 2850FT/CAT 11
HYSOL STYCAST 2850FT/CAT 23 LV
HYSOL STYCAST 2850KT/CATALYST 9
HYSOL STYCAST 2850MT/CATALYST 24LV

Selection of bottom filling glue?
UF1173 Beijing Xiyuan Technology
Selection of bottom filling glue?
UF1173 Beijing Xiyuan Technology
How to choose the bottom filling glue?
Beijing Xiyuan Technology