Intel Realizes Mass Production of 3D Advanced Packaging Technology

Intel announced that it has realized mass production based on industry-leading semiconductor packaging solutions, including Intel's breakthrough 3D packaging technology, Foveros, which provides flexible choices for the combination of multiple chips and brings better power consumption, performance and cost optimization.

This technology was put into production in the newly upgraded Fab 9 in New Mexico, USA. Keyvan Esfarjani, executive vice president and chief global operating officer of Intel, said, "Advanced packaging technology makes Intel stand out and helps our customers gain competitive advantages in terms of chip product performance, size, and flexibility in design and application."

This milestone will also promote Intel's next stage of advanced packaging technology innovation. As the entire semiconductor industry enters the heterogeneous era of integrating multiple "chips" in a single package, Intel's advanced packaging technologies such as Foveros and EMIB (embedded multi chip interconnect bridge) provide faster and lower cost paths to integrate one trillion chips in a single package transistor And continue to promote Moore's Law after 2030.

Foveros, Intel's 3D advanced packaging technology, is a leading solution in the industry. During the manufacturing process of processors, computing modules can be stacked vertically rather than horizontally. In addition, Foveros enables Intel and its OEM customers to integrate different computing chips to optimize cost and energy efficiency.

Intel will continue to be committed to promoting technological innovation, expanding its business scale and meeting the growing demand for semiconductors.

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