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Power management

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How to use CSA for constant pressure?
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Single chip synchronous step-down converter of new specification of STC is oriented to the application of light load and low noise electrically isolated power supply

Analysis of thermal resistance characteristics of power converter What is thermal resistance? Thermal resistance (0) refers to the ratio of temperature rise on the heat dissipation path to the heat flowing through the same path. It is described by the path length limit, such as the node to the shell (0 j-c) of the semiconductor device or the node to
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ROHM began to provide the industry's advanced "analog digital fusion control" power supply LogiCoA ™ Power Solutions

Diodes Company Launches High Rated Current Load Switch to Provide Intelligent Power Supply Solutions for Modern Digital ICs [June 6, 2024, Prano, Texas, USA] Diodes announced the expansion of the popular DML30xx intelligent load switch series. Four new products are launched this time: DML3008
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SynQor ® recommends an advanced military field level three-phase programmable output power supply MPPS-4000

ROHM developed a new two in one SiC packaging module "TRCDRIVE pack ™” The 4th generation SiC MOSFET is built in the small package to achieve ultra-high power density in the industry and help the xEV inverter achieve miniaturization! ROHM (headquartered in Kyodo, Japan), a world-famous semiconductor manufacturer, is oriented to 300
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The knack of realizing multi-channel high-precision output flyback power supply without DC-DC conversion

Infineon works with Cool Cool to create the industry's first 850W and 1100W fanless power supply and 2000W high wattage power supply scheme [May 31, 2024, Shanghai, China] In the near future, the requirements for system computing capability and performance are constantly improving, whether it is the development of high-order e-sports or AI applications. Therefore, the power supply is
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Krypton made its debut in Beijing Auto Show with several new models, and Ames Osram helped to create an intelligent driving experience

Melexis promotes industry change: automobile lighting LED driver chip realizes super miniaturization On June 14, 2024, Tyssendro, a global microelectronics engineering company, Melexis recently announced that as the leader in the field of LED driver chips for automotive dynamic lighting, it officially launched a new product MLX8
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Power design elements of remote patient monitor powered by primary battery

How to Design Low Power Consumption and High Precision Bicycle Power Meter This technical article mainly discusses the application of signal chain, power management and microcontroller IC in a practical force detection product bicycle dynamometer. The physics of bicycle dynamometer operation will be explained
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Accurate current detection for safer solar energy systems and electric vehicle chargers

How does electronic fuse help software define regional architecture innovation of vehicles The biggest change in the automotive industry over the past decade has been the rise of software defined vehicles. In traditional vehicle design, specific functions such as powertrain system or infotainment system are equipped with
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Infineon launched EPR electronic marking cable assembly controller to provide over-voltage protection up to 54 V for USB-C passive cable

Dalian Pinka Group Launches BLDC Frequency Conversion Control Scheme Based on Infineon Products On November 2, 2023, Dalianda Holdings, a leading international semiconductor component distributor dedicated to the Asia Pacific market, announced that its Pinkai launched the IM564-X6D module based on Infineon
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Trade Electronics and Bourns launched a new e-book to discuss surge protection technology Trade Ze Electronics and Bourns launched a new e-book to discuss the design challenges of surge protection technology November 30, 2021 - electronic component distribution trade Zedian focusing on introducing new products to promote industrial innovation
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Do domestic enterprises have the opportunity to "dig holes" for SiC?
Do domestic enterprises have the opportunity to "dig holes" for SiC? In spite of this, in the planning of SiC MOSFET, manufacturers have taken trench devices as the ultimate goal. Behind this, does China have opportunities
keyword: SiC silicon carbide
Published on: June 17, 2024
PI launched a new Bridge Switch-2 to make motor design simpler and more efficient
PI launched a new Bridge Switch-2 to make motor design simpler and more efficient A few days ago, Power Intergrations (PI) launched a new second-generation Bridge Switch-2, which has significantly improved its power level and efficiency compared with the first generation. The new product is suitable for
keyword: PI motor drive
Published on: June 17, 2024
400mA, high output voltage swing rate, nano core micro NSOPA240x series, "difficult" to crack resolvers
400mA, high output voltage swing rate, nano core micro NSOPA240x series, "difficult" to crack resolvers June 17, 2024, Shanghai - As the market continues to pursue high-precision and high-performance motor control technology, the resolver, as one of its core components, accurately measures the angular position and speed
keyword: Pendulum rate Nanocore micro transformer
Published on: June 17, 2024
Bourns launched automotive grade chip inductors that meet AEC-Q200 standards
Bourns launched automotive grade chip inductors that meet AEC-Q200 standards Bourns launched an ideal space saving solution for automotive grade chip inductors and coaxial cable circuits in line with AEC-Q200 standard Bourns ® CWP3230A series has high current, high inductance and high
keyword: Bourns Automotive Inductor Coaxial cable
Published on: June 17, 2024
Bourns launched the second generation of high creepage/clearance distance in line with AEC-Q200 standard
Bourns launched the second generation of high creepage/clearance distance in line with AEC-Q200 standard Automotive grade isolated power transformer HCT8xxxxEAL series transformers - high reliability, compact solution, providing up to 800 V reinforced insulation and up to 1000 V basic insulation. 202 ...
keyword: Bourns AEC-Q200 Creepage distance Clearance distance
Published on: June 14, 2024
Melexis promotes industry change: automobile lighting LED driver chip realizes super miniaturization
Melexis promotes industry change: automobile lighting LED driver chip realizes super miniaturization On June 14, 2024, Tyssendro, a global microelectronics engineering company, Melexis recently announced that as the leader in the field of LED driver chips for automotive dynamic lighting, it officially launched a new product MLX8
keyword: Melexis Automotive lighting LED Driver chip
Published on: June 14, 2024
The new wireless charger development board of STC is oriented to industrial, medical and smart home applications
The new wireless charger development board of STC is oriented to industrial, medical and smart home applications 50W transmitter and receiver supporting scheme, using ST overcharge protocol to simplify the design of fast charging. On June 14, 2024, China - STF Semiconductor launched a Qi wireless charging including 50W transmitter and receiver
keyword: STC wireless charger Development board Industry medical care Smart home
Published on: June 14, 2024
NXP and ZF jointly develop SiC based traction inverter to help enhance the power system of electric vehicles
NXP and ZF jointly develop SiC based traction inverter to help enhance the power system of electric vehicles ● NXP's high-voltage isolation grid driver series is integrated into ZF's next-generation 800 V SiC electric vehicle traction inverter solution ● This cooperation aims to improve the safety and energy efficiency of electric vehicles
keyword: NXP ZF SiC inverter electric vehicle power
Published on: June 14, 2024
Infineon launched a new industrial CoolSiC packaged with TOLT and Thin TOLL ™ MOSFET 650 V G2， Increase system power density
Infineon launched a new industrial CoolSiC packaged with TOLT and Thin TOLL ™ MOSFET 650 V G2， Increase system power density [Munich, Germany, June 13, 2024] Driven by technological progress and increasing attention to low-carbon technology, the electronic industry is transforming to a more compact and powerful system. Infineon Technology
keyword: Infineon TOLT Thin TOLL package CoolSiC MOSFET power density
Published on: June 13, 2024
Nexperia's 650 V SiC diode portfolio now meets automotive and broader industrial applications
Nexperia's 650 V SiC diode portfolio now meets automotive and broader industrial applications Schottky diodes that meet automotive standards are now packaged in R2P DPAK Nijmegen, June 13, 2024: Nexperia announced today that its first-class 650 V, 10 A silicon carbide (SiC) Schottky diodes
keyword: Nexperia SiC diode automobile Industrial applications
Published on: June 13, 2024

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