Ningxia Hangao Letai Letai 2651 epoxy adhesive automobile potting adhesive chip, 2651 epoxy potting adhesive

Loctite ABLESTIK 8200T conductive adhesive is designed for high reliability packaging applications. QFN conductive adhesive is used for packaging. High temperature resistance 300 ℃
Low temperature resistance - 60 ℃ conductive adhesive. Pass the double 85 test. High glass transition temperature, low expansion coefficient.



Die attach 8200t conductive adhesive has passed JEDEC certification and is suitable for high reliability integrated circuit packaging, IC conductive adhesive, power device conductive adhesive, IGBT conductive adhesive, IPM conductive adhesive, LED conductive adhesive, LED high-temperature resistant conductive adhesive. COB conductive adhesive
The thermal conductivity is 2.5w/mk.

VALTRON®UltraLux ™ It is a temporary adhesive wax, mainly used for polishing and grinding in semiconductor industry. This special adhesive product is available in solid and liquid forms, providing low viscosity and high adhesive strength. The physical properties of wax make it possible to control the processing rate at high speed. The new water-soluble liquid wax is designed to facilitate the disassembly of precision and ultra-thin semiconductor chips with water. Using VALTRON ® Wax removal with water-based cleaning agent.

• High bonding strength of semiconductor wafer wax adhesive
• H High processing speed
• High softening point
• High melting temperature
• Low viscosity
• Liquidity
• Ultra tight total thickness change