Liaoning Wantai Valtech wafer scribing protection liquid semiconductor, scribing protection liquid

Wafer temporary adhesive, wafer scribing fluid, wafer temporary bonding and debonding, wafer blue film, chip temporary adhesive, chip temporary adhesive paraffin, chip paraffin, wafer paraffin, chip blue film, engine controller potting adhesive, corrosion resistant potting adhesive, corrosion resistant adhesive, aviation adhesive, aerospace adhesive, glue, adhesive, flexible conductive adhesive, low-temperature curing conductive adhesive, Room temperature curing conductive adhesive, flexible insulating adhesive, chip insulating adhesive, ic insulating adhesive, MMIC conductive adhesive, GaAs conductive adhesive, solvent-free conductive adhesive, automatic chip bonding conductive adhesive, automatic chip insulating adhesive



High temperature resistant chip insulation adhesive, extremely low stress insulation adhesive, low stress insulation adhesive, thin film thick film conductive adhesive, thin film conductive adhesive, thick film conductive adhesive, 8700K thick film conductive adhesive, 8700K thick film gold surface conductive adhesive, MIL conductive adhesive, national military standard conductive adhesive, non collapse conductive adhesive, non collapse insulating adhesive, military standard conductive adhesive

VALTRON®UltraLux ™ It is a temporary adhesive wax, mainly used for polishing and grinding in semiconductor industry. This special adhesive product is available in solid and liquid forms, providing low viscosity and high adhesive strength. The physical properties of wax make it possible to control the processing rate at high speed. The new water-soluble liquid wax is designed to facilitate the disassembly of precision and ultra-thin semiconductor chips with water. Using VALTRON ® Wax removal with water-based cleaning agent.

VALTRON®TriAct ™ DF dicing solution series is made of non-ionic surfactant, disinfectant and other functional ingredients, and is suitable for semiconductor wafer dicing process. This product can effectively eliminate silica dust particles and sterilize the production system pipeline. It has low foam, fast defoaming and easy washing. The concentrated solution or low diluent of the scribing solution can prevent microbial growth, prevent corrosion, and reduce and neutralize the static charge. In addition to cleaning, VALTRON ® TriAct ™ DF series lubricating cutting blade can significantly reduce friction and surface tension when the dilution ratio is up to 1:4000, and act as a coolant to reduce the heat of silicon wafer cracking.