The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
Rapid curing
Rapid flow
Exhaust through NASA
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire wire defoamer parallel sealing and welding glue dispenser wafer cleaning liquid crystal circular scribing protective liquid.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Beijing Xiyuan Technology Co., Ltd
Conductive adhesive, insulating adhesive, three proofing paint, potting adhesive, conductive material, parallel sealing and welding, electroplating table, bonding wire, bottom filling adhesive, phase adhesive, high-frequency adhesive, optical fiber adhesive
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Beijing Xiyuan Technology Co., Ltd
Conductive adhesive, insulating adhesive, three proofing paint, potting adhesive, thermal conductive material, parallel sealing and welding, electroplate table, bonding wire, bottom filling adhesive, phase adhesive, high-frequency adhesive, optical fiber adhesive, LOCTITE ECCOBOND FP4531, bottom filling design, used for flip chip applications with 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Beijing Xiyuan Technology Co., Ltd
Conductive adhesive, insulating adhesive, three proofing paint, potting adhesive, conductive material, parallel sealing and welding, electroplating table, bonding wire, bottom filling adhesive, phase adhesive, high-frequency adhesive, optical fiber adhesive
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61
Beijing Xiyuan Technology Co., Ltd
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61
Beijing Xiyuan Technology Co., Ltd
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61
Beijing Xiyuan Technology Co., Ltd
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
Operating equipment: wafer scribing machine, chip bonding machine, dispensing machine, parallel sealing welder, etc.
Failure analysis technology: Decap capping, x-ray, rapid packaging, ceramic packaging, tube and shell packaging, air tightness test, tensile test, shear force test, etc.
MEMS conductive adhesive insulating adhesive low stress adhesive 2025D 84-1LMI JM7000
Thick film conductive adhesive 84-1A 84-1LMI 84-1LMIT1 JM7000 84-3 2025D
Thick film circuit adhesive film 506 adhesive film 5020 adhesive film thick film circuit potting adhesive IGBT potting adhesive for thick film circuit
84-3J insulation adhesive chip insulation adhesive Loctite conductive adhesive Loctite three proof paint 3900, Loctite insulation adhesive, chip packaging adhesive,
Optical fiber adhesive, optocoupler adhesive, circuit potting adhesive, sensor potting adhesive, power potting adhesive, Loctite UF3808 bottom filling adhesive, microwave device conductive adhesive, low stress bottom filling adhesive, high thermal conductivity potting adhesive, BGA bottom filling agent, BGA thermal conductivity adhesive, DAF film, FOW film, DAF film, conductive adhesive film, thermal conductivity adhesive film, chip adhesive film, packaging adhesive film, IC adhesive film, wafer adhesive film, UF1173 RF device bottom filling adhesive, high-frequency transmission adhesive, phase adhesive, 5G bottom filling adhesive, base station adhesive LOCTITE ECCOBOND FP4531 bottom filling is designed for flip chip applications with 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61
Beijing Xiyuan Technology Co., Ltd
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
Operating equipment: wafer scribing machine, chip bonding machine, dispensing machine, parallel sealing welder, etc.
Failure analysis technology: Decap capping, x-ray, rapid packaging, ceramic packaging, tube and shell packaging, air tightness test, tensile test, shear force test, etc.
MEMS conductive adhesive insulating adhesive low stress adhesive 2025D 84-1LMI JM7000
Thick film conductive adhesive 84-1A 84-1LMI 84-1LMIT1 JM7000 84-3 2025D
Thick film circuit adhesive film 506 adhesive film 5020 adhesive film thick film circuit potting adhesive IGBT potting adhesive for thick film circuit
84-3J insulation adhesive chip insulation adhesive Loctite conductive adhesive Loctite three proof paint 3900, Loctite insulation adhesive, chip packaging adhesive,
Optical fiber adhesive, optocoupler adhesive, circuit potting adhesive, sensor potting adhesive, power potting adhesive, Loctite UF3808 bottom filling adhesive, microwave device conductive adhesive, low stress bottom filling adhesive, high thermal conductivity potting adhesive, BGA bottom filling agent, BGA thermal conductivity adhesive, DAF film, FOW film, DAF film, conductive adhesive film, thermal conductivity adhesive film, chip adhesive film, packaging adhesive film, IC adhesive film, wafer adhesive film, UF1173 RF device bottom filling adhesive, high-frequency transmission adhesive, phase adhesive, 5G bottom filling adhesive, base station adhesive LOCTITE ECCOBOND FP4531 bottom filling is designed for flip chip applications with 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61
Beijing Xiyuan Technology Co., Ltd
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
Operating equipment: wafer scribing machine, chip bonding machine, dispensing machine, parallel sealing welder, etc.
Failure analysis technology: Decap capping, x-ray, rapid packaging, ceramic packaging, tube and shell packaging, air tightness test, tensile test, shear force test, etc.
MEMS conductive adhesive insulating adhesive low stress adhesive 2025D 84-1LMI JM7000
Thick film conductive adhesive 84-1A 84-1LMI 84-1LMIT1 JM7000 84-3 2025D
Thick film circuit adhesive film 506 adhesive film 5020 adhesive film thick film circuit potting adhesive IGBT potting adhesive for thick film circuit
84-3J insulation adhesive chip insulation adhesive Loctite conductive adhesive Loctite three proof paint 3900, Loctite insulation adhesive, chip packaging adhesive,
Optical fiber adhesive, optocoupler adhesive, circuit potting adhesive, sensor potting adhesive, power potting adhesive, Loctite UF3808 bottom filling adhesive, microwave device conductive adhesive, low stress bottom filling adhesive, high thermal conductivity potting adhesive, BGA bottom filling agent, BGA thermal conductivity adhesive, DAF film, FOW film, DAF film, conductive adhesive film, thermal conductivity adhesive film, chip adhesive film, packaging adhesive film, IC adhesive film, wafer adhesive film, UF1173 RF device bottom filling adhesive, high-frequency transmission adhesive, phase adhesive, 5G bottom filling adhesive, base station adhesive LOCTITE ECCOBOND FP4531 bottom filling is designed for flip chip applications with 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61
Beijing Xiyuan Technology Co., Ltd
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
Operating equipment: wafer scribing machine, chip bonding machine, dispensing machine, parallel sealing welder, etc.
Failure analysis technology: Decap capping, x-ray, rapid packaging, ceramic packaging, tube and shell packaging, air tightness test, tensile test, shear force test, etc.
MEMS conductive adhesive insulating adhesive low stress adhesive 2025D 84-1LMI JM7000
Thick film conductive adhesive 84-1A 84-1LMI 84-1LMIT1 JM7000 84-3 2025D
Thick film circuit adhesive film 506 adhesive film 5020 adhesive film thick film circuit potting adhesive IGBT potting adhesive for thick film circuit
84-3J insulation adhesive chip insulation adhesive Loctite conductive adhesive Loctite three proof paint 3900, Loctite insulation adhesive, chip packaging adhesive,
Optical fiber adhesive, optocoupler adhesive, circuit potting adhesive, sensor potting adhesive, power potting adhesive, Loctite UF3808 bottom filling adhesive, microwave device conductive adhesive, low stress bottom filling adhesive, high thermal conductivity potting adhesive, BGA bottom filling agent, BGA thermal conductivity adhesive, DAF film, FOW film, DAF film, conductive adhesive film, thermal conductivity adhesive film, chip adhesive film, packaging adhesive film, IC adhesive film, wafer adhesive film, UF1173 RF device bottom filling adhesive, high-frequency transmission adhesive, phase adhesive, 5G bottom filling adhesive, base station adhesive
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
The LOCTITE ECCOBOND FP4531 bottom fill is designed for flip chip applications with a 1mm gap.
High frequency chip application.
Rapid curing
Rapid flow
Exhaust through NASA
Typical curing properties
Gel time
Gel time: 121 º C, 6 minutes
Electrical performance
Volume resistivity, ohm cm 1.71 × 10+16
Surface resistivity, ohm 1.87 × 10+16
Dielectric strength, volts/mil 1470
Dielectric constant/dissipation coefficient @ 25 ℃:
@ 100 khz 3.34/0.0088
@ 1 mhz 3.29/0.0071
@ 2 mhz 3.3/0.007
Thermal expansion coefficient, ppm/℃:
Tg 28 below
Tg 104Up
Glass transition temperature (Tg) is determined by TMA, ° C 161
Extractable ion content:
Chlorination (Cl) 20
Sodium (Na+) 5
Potassium (K+) 5
Bending modulus N/mm ² 7600
(psi) (1102000)
Thermal conductivity, W/(m-K) 0.61
Beijing Xiyuan Technology Co., Ltd
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
Loctite 3900 three proof paint, Loctite 3900 three proof paint, military three proof paint, military three proof paint, fast curing three proof paint, transparent coating, UV curing three proof paint, spraying three proof paint, common film coating three proof paint, silicon based three proof paint. Solventless three proof paint, automobile application three proof paint, compatible with solder mask, no cleaning flux, environmental protection three proof paint. Crc70 three proof paint, crc three proof paint, crc2403 three proof paint, red three proof paint, transparent three proof paint. The circuit board is coated with three proofing paint. Marine paint, seawater resistant
