Loctite Ablebond 84-1LMI conductive silver adhesive Low temperature curing viscosity: 28 PaS Shear strength: 12 Mpa Operating temperature: - 55~150 ℃ Shelf life: 12 months Curing condition: 150 ℃ * 60 min, 125 ℃ * 2hrs Main application: IC packaging: 3.5g/1cc pcs
Ablestik Ablebond 84-1LMI is a silver filled, conductive epoxy adhesive. Ablebond 84-1 LMI adhesive can meet the requirements of MIL-STD-883 and Method 5011. ABLEBOND 84-1LMI is mainly used for bonding microelectronic chips. This high-purity adhesive has a very low tendency to overflow and a low gas overflow, with a thermal conductivity of 2.5W/(m-K)
TYPICAL PROPERTIES OF UNCURED MATERIAL Thixotropic Index (0.5/5 rpm) 4.0 Viscosity, Brookfield CP51, 25 °C, mPa·s (cP): Speed 5 rpm 30,000 Work Life @ 25°C, days 14 Shelf Life (from date of manufacture): @ 5°C, days 91 @ -10°C, days 183 @ -40ºC, days 365 TYPICAL CURING PERFORMANCE Cure Schedule 1 hour @ 150°C Alternate Cure Schedule 2 hours @ 125°C
Xiyuan Technology Electronic Materials:
Potting glue: Lodhenhan High Road Corning Dow DuPont, etc. It is widely used in electronic power supply thick film circuit, automobile electronic semiconductor packaging and other industries.
Conductive adhesive: 3M Beijing ablestik Beijing Emerson&Cuming, etc., used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers the fields of electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card/radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding and thinning of liquid crystal circles, etc.
Electronic coating UV curing material Wafer scribing protection Liquid crystal circle Temporary bonding Thinning conductive silver glue Sintering silver nano silver channel Corning COB glue red glue SMT red glue Aviation aerospace glue High temperature resistant potting glue Bond alloy wire insulation coating Bond alloy wire defoaming machine Parallel sealing machine Gluing machine KS Splitting Knife SPT Splitter Splitter Ceramic Splitter Rodham Road Corning Dow X-RAY FIB FBI Musashi Dispenser Nuoxin Dispenser Filling Machine Failure Analysis Rapid Packaging Ceramic Shell Packaging COB Packaging Chip Bonding Packaging Cleaning Liquid Crystal Circle Cleaning Fluid Silicon Wafer Cleaning Fluid Sapphire cutting fluid Ceramic scribing cleaning fluid Chip adhesive IC adhesive IC conductive adhesive Chip conductive adhesive IC insulating adhesive Henkel Loctite Henkel agent Henkel glue Loctite water channel Corning glue Lode glue structural adhesive Automotive electronic adhesive COMS adhesive Sensor potting adhesive Electronic potting adhesive High Heat conducting epoxy adhesive, high heat conducting epoxy potting adhesive, high heat conducting potting adhesive, low temperature resistant adhesive, optical fiber adhesive, pigtail adhesive, optical communication adhesive, light transmitting adhesive, light blocking adhesive, optocoupler adhesive, Loctite agent, ablestik adhesive, heat conducting adhesive, heat conducting adhesive, glass silver adhesive, conductive adhesive, insulating adhesive film, DAF film, blue film, UV blue film, UV film, conductive adhesive Glue defoamer bottom filling glue defoamer chip adhesive chip conductive adhesive chip adhesive chip insulating adhesive CSP bottom filling adhesive lamination die bonding lamination die conductive adhesive conductive conductive adhesive film 5020 adhesive film 506 adhesive film JM7000 conductive adhesive 84-1 conductive adhesive ablestik conductive adhesive Henkel conductive adhesive Loctite conductive adhesive Lot potting adhesive Loctite adhesive film chip capping machine Glue defoamer air tightness detection Shear force detection Chip tension test Chip ceramic packaging Chip metal packaging Wafer passivation equipment Wafer etcher TSV Wafer deposition
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Xiyuan Technology Electronic Materials:
Potting glue: Rodham High Road Corning Loctite, etc. Widely used in electronic power supply thick film circuit, automobile battery and other industries.
Conductive adhesive: Beijing EPO-TEK 3M Beijing ablestik Beijing Emerson&Cuming, etc. Used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The scope of application covers electronic components, electronic components, circuit board assembly, display, lighting, industrial communication, automobile electronic smart card/radio frequency identification and other fields of Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Xiyuan Technology Electronic Materials:
Potting glue: Rodham High Road Corning Loctite, etc. Widely used in electronic power supply thick film circuit, automobile battery and other industries.
Conductive adhesive: Beijing EPO-TEK 3M Beijing ablestik Beijing Emerson&Cuming, etc. Used in semiconductor LED and other industries
Experimental equipment: provide X-RAY FIB microscope, etc. FBI Musashi Dispensing Machine Nuoxin Dispensing Machine Filling Machine Laboratory Instruments.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers electronic components, electronic components, circuit board assembly, display, lighting, industrial communication, automobile electronic smart card, radio frequency identification and other fields
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire wire defoamer parallel sealing and welding glue dispenser wafer cleaning liquid crystal circular scribing protective liquid. Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card/radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding, thinning, bonding, alloy wire, light fluorine oil, heavy fluorine oil, DET D02 and other fields.
In 2017, Xiyuan Technology started joint research and development of integrated circuit/discrete device materials, domestic conductive silver adhesive insulation adhesive gold solder and other products. It has been recognized by China Electronics Technology Group/Aerospace Science and Industry Group and other enterprises. It has passed the relevant test certification of GJB.
Xiyuan Technology now has a ten thousand level purification production and manufacturing plant, a 500 square meter test plant and a 300 square meter production and testing equipment, which are widely used and recognized in the industry. It is equipped with semiconductor integrated circuit tester, discrete device tester, full-automatic gold wire silicon aluminum wire pressure welder, full-automatic coarse aluminum wire pressure welder, parallel seam welder, laser seam welder, sintering furnace, parallel seam welder, helium mass spectrometer leak detector, fluorine oil rough detector, high temperature reverse bias aging, high and low temperature environment test chamber, tensile shear force tester, constant acceleration centrifuge, particle noise The acoustic detector shock table and electric vibration table ensure that the products are strictly screened according to the project.
Provide small batch packaging test for semiconductor industry design companies, Chinese Academy of Sciences and other research and development units. Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Beijing Xiyuan Technology Co., Ltd. Henkel Beijing General Agent Ablestik Burgess Road Corning 3M Luode Distributor
LED The technical personnel of the adhesive supplier in the power supply new energy industry provide the overall adhesive solution.
Encapsulated sealant Heat conductive silicone grease Heat conductive gasket Anti static products UV glue, etc
Silicone potting adhesive Heat conductive potting adhesive Three proof paint sealing adhesive Henkel Henkel Loctite epoxy resin potting adhesive Heat conductive adhesive LED adhesive power potting adhesive electronic glue Beijing thermal conductive potting adhesive Beijing Letai Beijing three proof paint Beijing adhesive anaerobic adhesive thread glue optical fiber adhesive thermal conductive adhesive three proof paint bonding adhesive alloy wire bond wire wire defoamer parallel sealing and welding glue dispenser wafer cleaning liquid crystal circular scribing protective liquid. Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card/radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding, thinning, bonding, alloy wire, light fluorine oil, heavy fluorine oil, DET D02 and other fields.
In 2017, Xiyuan Technology started joint research and development of integrated circuit/discrete device materials, domestic conductive silver adhesive insulation adhesive gold solder and other products. It has been recognized by China Electronics Technology Group/Aerospace Science and Industry Group and other enterprises. It has passed the relevant test certification of GJB.
Xiyuan Technology now has a ten thousand level purification production and manufacturing plant, a 500 square meter test plant and a 300 square meter production and testing equipment, which are widely used and recognized in the industry. It is equipped with semiconductor integrated circuit tester, discrete device tester, full-automatic gold wire silicon aluminum wire pressure welder, full-automatic coarse aluminum wire pressure welder, parallel seam welder, laser seam welder, sintering furnace, parallel seam welder, helium mass spectrometer leak detector, fluorine oil rough detector, high temperature reverse bias aging, high and low temperature environment test chamber, tensile shear force tester, constant acceleration centrifuge, particle noise The acoustic detector shock table and electric vibration table ensure that the products are strictly screened according to the project.
Provide small batch packaging test for semiconductor industry design companies, Chinese Academy of Sciences and other research and development units.
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Our electronic chemical materials include: adhesive potting material, conductive heat conduction interface material, bare core adhesive material, COB encapsulating material, CSP/Flip chip/BGA, bottom filling adhesive, patch adhesive, electronic coating, UV curing material. The application scope covers electronic components, electronic components, circuit board assembly, display and lighting, industrial communication, automobile electronic smart card/radio frequency identification, aerospace semiconductor packaging, wafer scribing protection, temporary bonding, thinning, bonding, alloy wire, light fluorine oil, heavy fluorine oil, DET D02 and other fields.
In 2017, Xiyuan Technology started joint research and development of integrated circuit/discrete device materials, domestic conductive silver adhesive insulation adhesive gold solder and other products. It has been recognized by China Electronics Technology Group/Aerospace Science and Industry Group and other enterprises. It has passed the relevant test certification of GJB.
Xiyuan Technology now has a ten thousand level purification production and manufacturing plant, a 500 square meter test plant and a 300 square meter production and testing equipment, which are widely used and recognized in the industry. It is equipped with semiconductor integrated circuit tester, discrete device tester, full-automatic gold wire silicon aluminum wire pressure welder, full-automatic coarse aluminum wire pressure welder, parallel seam welder, laser seam welder, sintering furnace, parallel seam welder, helium mass spectrometer leak detector, fluorine oil rough detector, high temperature reverse bias aging, high and low temperature environment test chamber, tensile shear force tester, constant acceleration centrifuge, particle noise The acoustic detector shock table and electric vibration table ensure that the products are strictly screened according to the project.
Provide small batch packaging test for semiconductor industry design companies, Chinese Academy of Sciences and other research and development units.
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Ablestik：
Conductive silver glue: mainly engaged in ABLEBOND 84-1A, 84-1LMI, 84-1LMINB (B1), 84-1LMISR4, 84-1LMIT (T1), 826-1DS, 826-2, 2600AT, 2600BT, 2185A, 2030SC, 2100A, 3185, 8290, 8340, 8360, 8352L, 968-2, 979-1, 71-1, JM7000 and a series of products, suitable for semiconductor (IC) packaging (such as DIP/SOP/TO-92/BGA...) LED (such as ordinary LED/LAMP/high-power tube/digital tube...) It is used in various processes such as sticking, dispensing and backing
Insulating adhesive: mainly engaged in ABLEBOND84-3, 84-3J, 84-3LV, 84-3MV, 789-3, 789-4, 2025D, 2025M, 2035SC, 8384, 8387A, 8387B, 2039H, DX-10, DX-20-4 and a series of products, which are suitable for semiconductor (IC) packaging, camera (CMOS/CCD) process, LED, smart card and other fields, and are used for various pastes, or sticking and other processes
UV adhesive: mainly engaged in a series of UV curing adhesives such as ABLELUXHGA-3E, HGA-3S, A4021T, A4035T, A4039T, A4061T, A4083T, A4086T, A4088T, A4502, CC4310, AA50T, BF-4, OG RFI146T, which are suitable for photoelectric, photoelectric instrument, optical fiber, mobile phone camera (CMOS) and other fields; For example, phone camera Lens fixation, fiber coupler, laser, jumper, attenuator, detector, etc.
Adhesive film: mainly engaged in ABLEFILM506, 508, 550S, 561K, 570K, 5020, 5020K, 5025E and a series of products, suitable for various electronic products, military products, power supplies, etc.
Bottom filling glue: FP4450, UF1173, 4531, 4451 and other series. Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Ablestik：
Conductive silver glue: mainly engaged in ABLEBOND 84-1A, 84-1LMI, 84-1LMINB (B1), 84-1LMISR4, 84-1LMIT (T1), 826-1DS, 826-2, 2600AT, 2600BT, 2185A, 2030SC, 2100A, 3185, 8290, 8340, 8360, 8352L, 968-2, 979-1, 71-1, JM7000 and a series of products, suitable for semiconductor (IC) packaging (such as DIP/SOP/TO-92/BGA...) LED (such as ordinary LED/LAMP/high-power tube/digital tube...) It is used in various processes such as sticking, dispensing and backing
Insulating adhesive: mainly engaged in ABLEBOND84-3, 84-3J, 84-3LV, 84-3MV, 789-3, 789-4, 2025D, 2025M, 2035SC, 8384, 8387A, 8387B, 2039H, DX-10, DX-20-4 and a series of products, which are suitable for semiconductor (IC) packaging, camera (CMOS/CCD) process, LED, smart card and other fields, and are used for various pastes, or sticking and other processes
UV adhesive: mainly engaged in a series of UV curing adhesives such as ABLELUXHGA-3E, HGA-3S, A4021T, A4035T, A4039T, A4061T, A4083T, A4086T, A4088T, A4502, CC4310, AA50T, BF-4, OG RFI146T, which are suitable for photoelectric, photoelectric instrument, optical fiber, mobile phone camera (CMOS) and other fields; For example, phone camera Lens fixation, fiber coupler, laser, jumper, attenuator, detector, etc.
Adhesive film: mainly engaged in ABLEFILM506, 508, 550S, 561K, 570K, 5020, 5020K, 5025E and a series of products, suitable for various electronic products, military products, power supplies, etc.
Bottom filling glue: FP4450, UF1173, 4531, 4451 and other series.
Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
Operating equipment: wafer scribe, chip bonding machine, dispensing machine, parallel sealing welder, TSV/TGC electroplating platform, MEMS capping machine, etc. Loctite ABLESTIK 84-1LMI patch adhesive
For bonding of microelectronic chips. This adhesive is ideal
Use an automatic dispenser or a manual probe.
mil - std - 883
Loctite ABLESTIK 84-1LMI meets the requirements of MIL-STD 883, Method 5011.
Typical properties of uncured materials
Thixotropy index (0.5/5rpm) 4.0
Viscosity, Brookfield CP51, 25 ℃, mPa · s (cP):
Speed: 5 rpm 30000
Service life @ 25 ° C, 14th day
Shelf life (from production date):
@5 ° C, day 91
@- 10 ° C, day 183
@- 40 º C, 365 days
Typical curing properties
Curing conditions
1 hour @ 150 ° C
Alternative curing conditions
2 hours @ 125 ° C
The above curing conditions are guidelines. cure
The conditions (time and temperature) may be
Experience and their application requirements, as well as customers
Curing equipment, oven loading and actual oven temperature.
Beijing Xiyuan Technology Co., Ltd., an authorized agent of Henkel, focuses on adhesive products in the power supply, new energy, automotive electronics and semiconductor industries. The company has a group of high-quality technicians to provide one-stop solutions for customers in adhesive technology.
The company's main brands include: Henkel, Loctite, Hanxin, Dow Corning, Lode, 3M, etc.
The company's main products include: thermal conductive adhesive, conductive adhesive, potting adhesive, sealant, three proofing paint, thermal conductive gasket, UV glue, chip protection fluid, wafer scribing fluid, temporary wafer bonding adhesive, wafer cleaning fluid, etc.
Operating equipment: wafer scribe, chip bonding machine, dispensing machine, parallel sealing welder, TSV/TGC electroplating platform, MEMS capping machine, etc.
