Write at the front

If the best entry-level CPU on the market, it must be APU. With the introduction of Zen4 CPU architecture and RDNA3 graphics card architecture, everyone is waiting for the APU of the new architecture.

The first thing you need to wait for is the APU on the laptop side or the CPU and APU of the Zen4/Zen4C mobile version - the popular Ryzen 7945HX hits the i9 14900HX, and a 7945HX3D ends the Intel notebook dynasty. Those who know more are looking forward to the desktop APU with the new architecture.

Finally, the new version of APU belongs to the desktop computer. This time, I got the AMD Ryzen 5 8600G. I will use it to compare the popular CPU in the middle end, the i5 13400, and the GTX 1650 graphics card, so that you can intuitively feel the performance of 8600G and 13400/GTX1650 in the game. And the words of AMD - there is no need for low-end entry-level video cards!

Like the AMD Reelung 7040 series on the laptop end, the Ryzen 8xxx APU is also equipped with the latest built-in Ryzen AI engine, which has brought AI popularity to a great extent, giving AI wings to fly into ordinary people's homes!

AMD Ryzen 5 8600G

▲ The outer packaging of AMD Ryzen 5 8600G is the same style as that of Zen 4 series Ryzen 8000 series, but there are some differences.

▲ There is a perspective window on the front of the packaging box, and you can see the logo of the CPU top cover - AMD Ryzen 5 8600G. "AMD RADEON 700M Series Graphics Card Built in 8000 Series Processor" is clearly marked on the lower left corner of the packaging box.

The logo "AMD Ryzen AI" is prominently displayed on the left side of the packaging box - the R5 8600G has been equipped with the latest Ryzen AI engine, which has greatly popularized AI and inserted wings for AI to fly into ordinary people's homes!

▲ The side of the packaging box clearly shows the features of Ryzen 8000 series APUs, including "built-in AMD Ryzen AI engine", "built-in AMD RADEON graphics card", "AMD AM5 platform" and "Zen4 architecture".

▲ The 8600G has a complimentary radiator, instructions, Ryzen stickers, and red team promotional notes.

▲ The 8600G base plate is different from the previous ones. The previous tantalum capacitors and resistors are all moved to the top cover, and there are no electronic parts on the CPU edge, which can maximize the life of the CPU.

Others follow the Zen4 architecture, with AMD Ryzen 5 8600G clearly marked in the middle.

▲ The attached radiator is suitable for emergency use. If you want to fully release the full performance of the AMD R5 8600G, tower fans are recommended.

▲ The core of 8600G is the big core of the full Zen 4 architecture, with 6 cores and 12 threads, the base frequency of 4.3 GHz, the maximum dynamic acceleration frequency of 5.0 GHz, 6 MB L2 L2 L2 L2 L2 L2 L2 L3 L3 cache, TDP of 65W, and the memory controller has also been strengthened. The measured data can be EXPO DDR5 6800, and even DDR5 8000 on the Dashen AUTO FCLK.

As for the integrated core graphics card, the 8600G is Radeon? 760M, its hardware specification is 8CU (512 Unfield) @ 2.8G, 32 ROPs/32 TMUs. In the 3A experiment, 1050Ti can be defeated at 1080P resolution drive The performance will be gradually released after optimization of.

Another good news is that the AMD driver updated on January 31 will add the AFMF function for 8600G/8700G, which will make the 8600G game more fluent!

Finally, the 8600G/8700G provides 20 PCIe 4.0 channels and 8 channels for video cards.

▲ The most important thing is that AMD has equipped a Ryzen AI NPU with XDNA architecture @ 1.6GHz on 8700G/8600G, which is the first NPU equipped with desktop CPU. This seems to be a small step, but it is actually a big step to plan for the future to meet the AI tide. Because AI is not just AI drawing, like Abobe in the latest version PS Firefly plug-in is launched above, and with NPU, it is even an 8600G integrated Radeon? 760M can complete tasks faster than CPUs without NPUs! What's more, in the future, Windows 12 will definitely add many mild AI applications, which will enable 8600G/8700G users to get ahead of the crowd, meet the future AI tide, and seize the opportunity.

Prepare for practical measurement

▲ The same motherboard series and radiator are used—— Jiuzhou Fengshen Dashuang Tower Digital display ARGB version (white), and the same chassis Kyushu Fengshen CH560 white, the same heat dissipation silicone Kyushu Fengshen DM9, and the same power supply, Antioch NE ATX3.0 850W.

In the picture, 8600G+B650 is blowing snow on the right, and 13400+B760 is blowing snow on the back of the left.

▲ This test uses the same memory module - Guangwei Shence DDR5 6800 24G * 2. Interestingly, although AMD was not friendly to the high-frequency memory support of DDR5 6400 and above, this APU 8600G test can EXPO DDR5 6800 24G * 2, and all tests have been run stably.

▲ The heat of 8600G is low, so one fan is theoretically sufficient. For 13400, because of the relationship between small cores, two cooling fans are recommended.

▲ The appearance of the digital display ARGB single fan in Dafrost Tower. You can clearly enjoy the ARGB dazzle of memory module and the ARUA divine light synchronization of the whole machine.

▲ When dual fans are used, the bright lights of the memory will be partially blocked. (Simulate with 8600G.)

▲ The black eye of ASUS's logo is hidden in this corner, which should be more compatible with water cooling.

After the APP is installed, the actual situation will be displayed. LOGO will be displayed on the left display screen, and real-time CPU temperature will be displayed on the right.

Theoretical performance comparison

▲ 8600G CPU and GPU are jointly certified and tested. In terms of CPU performance, R5 7500F is better However, the 8600G is an APU, and its core graphics card is very strong! What's more, it's interesting that Guangwei Shence DDR5 6800 24G * 2 EXPO was successfully lit and all tests were completed! This is the first time for AMD!

▲ The performance of 13400 won the first hand small core, but there are still many problems in the actual use of small core Professional fields should not touch big or small cores.

▲ and subsequent CPU-Z of 13400+1050Ti+ GPU-Z Joint validation.

▲ Performance measurement of the latest CinBench R24. I always said that high-frequency memory has not improved much for high-end hosts, but for APU 8600G/8700G, it has improved a lot, because DDR5 will also be used as video memory, which will greatly improve the performance of the core video card!

However, due to the addition of small cores, the 8600G multi-core performance is slightly weaker than the downwind. However, the single core score of 8600G is better than 13400, which actually proves the excellence of Zen4 architecture.

▲ 3Dmark Performance measurement of Night Raid, an integrated video card project. It is expected that the 8600G Radeon 740m will flip the 13400 UHD730, but the 13400+1050Ti will give me a big surprise. The 8600G is better in both graphics card projects and total scores.

▲ For DX11 In the fire strike project test of the game, 8600G won the first place again. Both the total score and the score of graphics card sub project exceeded the combination of 13400+1050Ti.

▲ 3Dmark Time Spy performance test for DX12. 8600G leads even more! The graphics card scores are directly 10% ahead of 1050Ti.

Of course, these tests can support the 8600G+B650 snow blowing of the Guangwei Shence EXPO DDR5 6800 24G * 2, and they fully reflect that, with the improvement of memory bandwidth, the integrated display is the biggest beneficiary!

▲ aida64 memory level cache item test. AMD's memory controller optimization is indeed inferior to that of Intel, but this is also related to the product positioning. For example, the memory performance of 7900X/7950X is not inferior to that of Intel at the same level.

However, the memory performance is not good enough for the large capacity and high-performance L2+L3. The 8600G has a larger and faster L2+L3, and can have a better practical experience.

▲ The 7-Zip test intuitively shows that the L2+L3 with large capacity and high speed will be more powerful than the performance improvement brought by memory!

▲ Compare the SSDs tested, WalkDisk WN20 Pro 2TB ， It runs in PCIe 4.0 x4 mode. Of course, the 8600G currently only supports PCIe 4.0 x4 SSDs

▲ Measured on the same SSD dual platform. In terms of continuous reading projects, AMD Zen 4 architecture can give full play to the full performance of SSDs. Continuous writing is also more stable.

For continuous 4K writes, the 8600G of AMD Zen 4 architecture is also better. However, in the 4K random single thread test, the 8600G is weaker. Fortunately, this situation is relatively rare in daily use.

▲ In the 3Dmark storage project test, the measured results of WalkDisk WN20 Pro 2TB are almost the same as those of Zhiti TiPlus 7100 2TB. It can be used as the storage medium for games, systems, professional applications, and AI software, providing users with an excellent ultra smooth experience.

Game measurement

▲ Video playback of the fifth final AR vs GG of ESL ONE is adopted for the game. The DOTA2 game screen is set to the highest special effect. The game resolution is 1080P.

The biggest surprise of 8600G to me is that Jixian has conquered the highest special effect under 1080P, and still can't open FSR, AFFF and other technologies! This is an epoch-making promotion!!!!!!!!!!!!!

The average value of 89.5 FPS is an epoch-making smooth value.

▲ LOL is actually a small game. After all, the most distant 2400G can be played smoothly.

▲ Come to the exciting 3A test. So far, the three games of Assassin's Creed Spirit Hall can only play with the lowest special effects However, after the later AFMF bonus, the 8600G should be able to open medium or even high special effects.

The 8600G continued its strong performance and defeated all competitors.

▲ In fact, F1 22 supports dynamic real-time ray tracing and cannot be turned off. Fortunately, it supports FSR2.1. Uniformly set it to FSR2.1 quality mode, turn on the lowest special effect under the resolution of 501080 sharpness, and actually measure 8600G is slightly ahead of 1050Ti. At the same time, it also shows that 8600G can actually turn on higher special effects, especially with the blessing of AFMF in the later stage.

▲ In Ubisoft's FarCry 6, the lowest special effect is turned on at 1080P resolution. Measured by Benchmark, the average frame rate of 8600G is stronger than 1050Ti.

▲ Horizon 5 of Extreme Sports opens the FSR 2.1 quality mode, with the sharpness of 0.51080p and the lowest resolution special effect. Measured by benchmark. This is also one of the most egregious games. 8600G is directly ahead of 1050Ti. If AFMF technology is added later, you can start medium or high special effects!

▲ The Starry Sky, a major work of Party B, was actually measured. Intel graphics card and integrated graphics card become the tears of the times! Because it does not support! Unable to start. News agency B said it would not support it later. When 1080P has the lowest special effect and the sharpness of FSR quality mode is 50, 8600G is one level ahead of 1050Ti. Later, when adding AFMF, you can try medium special effects.

▲ "Land Without Owners 3" has its own Benchmark, so open the minimum special effect under 1080P and start the measurement!

The 8600G is one position ahead of 1050Ti, which is regarded as an upgrade.

▲ According to the actual measurement of Cyberpunk 2077, under 1080P resolution, the lowest special effect is turned on, and the sharpness of FSR 2.1 quality mode is 0.5. The 8600G is two levels ahead of the 1050Ti set in the same setting. If the AFMF technology is added later, the picture quality of the game can be properly improved, or the sharpness can be improved.

Stable diffusion AI actual measurement of painting

▲ Stable diffusion Ai Painting is the free open source AI project most accessible to the majority of users. Of course, whether they can play or not is a day by day. Previously, the entry cost of AI painting was very high. Since the Ryzen AI NPU, it has greatly increased the popularity of AI and given more people a chance to try AI.

This test uses the same prompt words and settings. After the Ryzen AI NPU blessing, what can the AMD 8600G do in Window11?

(In fact, it is necessary to give full play to the strength of AMD graphics card AI drawing. It is necessary to configure the ROCm platform on the Linux system to give full play to the strength. In theory, the performance can be improved by up to 10 times.)

▲ The same forward prompt word and reverse prompt word, with the same setting, generate pictures three times repeatedly, record the time, and calculate the average value.

This is the total composition diagram of the time required for 8600G stable diffusion AI to draw three times.

▲ This is a summary chart of 13400 pictures generated under the same prompt word.

▲ The measured result shows that the average time of 8600G core graphics card Radeon 740m three times is 60.9 seconds. The average time of 13400 core video card UHD 730 is 368.3 seconds. Therefore, the AI drawing performance of 8600G nuclear display is 6 times that of 13400 nuclear display. This is also the performance improvement brought by Ryzen AI NPU!

Power consumption measurement

▲ A large part of the 8600G power consumption is allocated to the core graphics card, but the 13400 has no advantage in terms of standby and full CPU load. The 8600G core core graphics card Radeon 740M is stronger, so it is reasonable to eat more power. Of course, he eats grass and milks.

As for the measured temperature, the maximum measured CPU temperature of 8600G is 73 ℃. This was achieved with the blessing of the excellent double fans of the digital display ARGB version of Dashuang Tower.

AFMF actual measurement

▲ Finally, let's experience the new version. The AFMF option is included in the HYPR-RX mode. It will enable RSR by default. If it is consistent with the highest resolution of the display, RSR does not meet the enabling conditions.

AFMF is the optimization of driver level and belongs to the overall policy setting of the computer. The condition for AFMF to enable the game is that the game supports full screen.

▲ The Starry Sky measured by AFMF. According to the original settings, turn on/off AFMF to see what impact it will have on the actual fluency experience.

After the AFMF is started, the measured smoothness increases by nearly 74%

▲ Cyberpunk 2077 maintains the original settings, and turns on/off the AFMF for measurement. Turning on the AFMF can improve the fluency by 53.5%.

summary

As a new generation of APU, AMD Ryzen 5 8600G follows the advantages of Zen4 architecture in CPU performance, and its core graphics card is more eye-catching. With the help of Guangwei Shence DDR5 6800 24G * 2 EXPO, its performance is completely ahead of 1050Ti in 3A masterpiece. On January 31, AFMF will be launched on the driver update, and 8600G/8700G will receive technical support. According to the current measurement, AFMF has brought about 53% improvement in fluency on Cyberpunk 2077 and 74% improvement in fluency on Starry Sky, which is an epoch-making technology.

The emergence of 8600G has greatly raised the threshold of low-end graphics cards, and also made Intel's CPU with integrated display become the tear of the times.

Ryzen 5 8600G.

Important platform

▲ The ASUS middle end ATX large board - B650 snow blowing WIFI is used for this test motherboard. The packaging style of this motherboard is very close to the X670E snow blowing. If there is a difference, it is the difference between the motherboard model and the motherboard product diagram.

▲ The back is the display area of product features.

▲ B650 snow blowing perfectly inherits the design idea of the snow blowing series. The silver white heat dissipation armor, coupled with the black motherboard, has the beauty of splash ink landscape. The motherboard has solid workmanship, superior materials, reasonable circuit design, excellent electrical performance and excellent compatibility. The three M.2 SSD interfaces allow users to have more high-speed SSD installation areas and enjoy faster response speed. The 6-layer 2-ounce copper PCB allows the motherboard to have more wiring space, and also makes the electrical performance of the motherboard more stable and excellent.

▲ The VRM cooling armor of the motherboard is very thick and huge. The external power supply interface of the CPU is 8+4 pin ProCool power supply reinforcement interface, which is enough to meet the power supply demand of the CPU with a drop of 7900X or more. 4pin and ARUA ARGB+5V/+12V are distributed around the CPU to facilitate users to access the fan and ARGB signals of the radiator nearby. In addition, a 4pin fan pin interface dust boot is also included, which has done a good job of dust prevention for users.

▲ Install 8600G first. The CPU power supply area of B650 snow blowing is designed as 12+2 DIGI+digital power supply module. Each module is equipped with high-quality alloy inductance and durable solid capacitor, which can provide stable and pure power for the CPU and help the CPU release all its performance.

▲ Two sets of dual channel DDR5 DIMM sockets officially support DDR5 7600 (OC) with a maximum capacity of 192GB. However, the 8600G actually measured DDR5 6800 24G * 2 EXPO has no problem, and even the god can directly AUTO FCLK to DDR5 8000. High frequency memory has excellent performance bonus for APU!

ASUS has equipped AEMP memory super technology for memory, which can automatically overclock and optimize the frequency, timing and voltage of memory, so that users can enjoy performance improvement with one click.

▲ The easy to remove key of the graphics card of the snow blowing series is also equipped on the B650 snow blowing. The PCH heat sink with large heat dissipation area is marked with ROG STRIX. On the side of the PCH is a single row of 4 * SATA 6Gbps interfaces, USB 2.0, USB 3.0, USB-C expansion pin interfaces, and other power supply or signal cable interfaces.

▲ The lower half of the motherboard has three M.2 NVMe SSD slots and is equipped with thick thermal armor. The main graphics card slot is a PCIe 4.0 X16 enhanced graphics card slot directly connected to the CPU, as well as 2 * PCIe x1 expansion slots and PCIe full-size expansion slots.

▲ The M.2 slot directly connected to the CPU is an M.2 PCIe 5.0 X4 interface, which can adapt to future PCIe 5.0 X4 SSDs, and is equipped with an extremely thick M.2 thermal armor. It supports SSDs with a maximum size of 2280 and is equipped with an M.2 convenient snap.

▲ The large capacity M.2 SSD, WalkDisk WN20 Pro 2TB, which I equipped for games and AI this time, is easily installed through the convenient snap.

▲ The lower two are PCH extended M.2 PCIe 4.0 x4 interfaces, and are equipped with M.2 convenient snaps, which are convenient for users to install M.2 SSD without tools.

▲ The on-board sound card is ALC4080 from Realtek. Asustek has equipped it with audio protection cable and audio protection cover, together with high-quality audio capacitor and Savitech, which can output pure audio for users. Coupled with the "two-way AI noise reduction" function in Aochuang Center, it can present excellent high fidelity audio effect and two-way noise reduction of audio input and output for users.

▲ The I/O interface area has been pre installed with a baffle. There are HDMI/DP display output interfaces that must be used for 8600G, and 3 * USB 3.0 10Gbps interfaces. In addition, there are 4 * USB 2.0 interfaces, one of which can be matched with the key to realize the CPU free bios, which can realize the rapid upgrade of later products.

The back-end has a USB-C 10Gbps interface and a USB-C 20Gbps interface.

In terms of network interface, it is equipped with 2.5G wired high-speed network interface and wireless network card supporting WiFi 6E, which can adapt to the environment more flexibly.

The on-board sound card supports 7.1 channel output.

▲ Multi angle adjustment of WiFi expansion antenna makes it convenient for users to receive better signals.

▲ The accessories of the product are very rich, including stickers, instructions, quality assurance cards, ROG membership guidelines, etc., which are both stylish and very practical.

ASUS B760 snow blowing and 13400

▲ Too fast to get on the computer I forgot to shoot the 13400 PDD that cost 1280 yuan. Let's take a look at the B760 snow blowing

In this test, for fairness, motherboards of the same series are used, and B760 is used to blow snow on the Intel 13400 platform. Its outer packaging style is the same as that of the B760 Snow Blowing Series and the Z790 Snow Blowing Series, showing differences in details.

▲ The work of B760 snow blowing is also very solid. At first glance, it looks very similar to B650 snow blowing. After all, the CPU power supply area configuration of the two is the same. It also has three M.2 slots, and the motherboard is also equipped with M.2 thermal armor. The PCIe 5.0 X16 graphics card slot directly connected to the CPU has also been strengthened. The motherboard has excellent electrical performance and excellent compatibility.

▲ 8+4 pin ProCool CPU strengthens the power supply interface, and the CPU cooling module is also thick and has excellent cooling capacity. The user-friendly easy to remove key of the graphics card and the M.2 convenient snap also appear on the motherboard. The memory socket is also equipped with AEMP II technology, and the Aochuang Center also supports the same brilliant functions.

Other important accessories

▲ Do you still remember Guangwei, the pioneer of DDR4 popularization? The first DDR4 3600 8G with a price of 199 yuan has kept the price of DDR4 very close to the people up to now. At that station, Guangwei also made a name.

Today, as an important support for APU 8600G and 13400 platforms - DDR5 memory, Guangwei's Shence DDR5 6800 24G * 2 will be used.

▲ Guangwei Shence DDR5 6800 24G * 2 uses M-Die particles from the original manufacturer of Hynix. The quality is excellent, and the price is only 799 yuan, which can be said to be full of cost performance.

▲ As soon as you open the inner packing box, you can see the diy installation artifact - gloves, which is provided by Guangwei. As well as the original design of Guangwei Shence, it is very stylish.

▲ The inner packing box is also a protection box for memory, which can maximize the protection and fixation of memory during transportation.

▲ The design style of Guangwei Shence is deeply rooted in the essence of modern simplicity, and simple lines outline a very elegant shape. That touch of vitality orange is the finishing touch, which highlights the logo and DDR5 logo of Guangwei. The overall white shape of the memory is very popular trend , very versatile.

▲ It can be seen from the side that the Shence DDR5 24GB is a single-sided PCB memory. Plus M-Die, which has good overclocking potential, it can play a stronger role in the hands of experts. The heat dissipation vest is very thick and has wavy lines, which can maximize the use of the chassis air duct for heat dissipation and maintain the stable operation of the memory.

At the same time, you can also see that the light blue high-performance silicone grease heat dissipating adhesive can quickly transfer heat from DRAM particles and PMIC to the heat dissipating vest.

▲ The heat dissipation vest of Guangwei Shence uses copper soaking plate, aluminum armor and copper bone, which is an excellent design with both mechanical strength and ultra-high heat dissipation performance, allowing the memory to operate more stably on high frequencies.

▲ The Guangwei Shence DDR5 is equipped with ECC On Die technology, which can self correct data errors caused by high-speed reading and writing, so that the system can run more stably.

The top light guide bar can be seen from the front, and the memory has excellent ARGB vision after power on.

▲ There is a nameplate sticker on the back of the memory, on which the XMP/EXPO parameters and capacity of the memory are marked in detail, and this is also the warranty certificate.

The memory is equipped with a PMIC chip, which can finely control the voltage and keep the memory in peak performance output state for an ultra long time.

▲ The light guide bar adopts a multi-layer nested design, which makes people fall in love at first sight. After being powered on, it can present a jelly like ARGB light effect, which is unforgettable.

▲ The smooth three-dimensional ARGB jelly like visual effect, coupled with the crystal clear shell, is like the jelly eaten in childhood.

▲ The visual effect of the top is also very unique, and its dazzle is very eye-catching.

SSD

▲ The SSD uses WalkDisk WN20 Pro 2TB. As a newly developed domestic SSD brand, WalkDisk is dominated by domestic Lianyun, and the particles come from the original factory particles of Changjiang Storage, the light of China. Although the brand is not well-known around the world, the quality is still very reliable.

There is a nameplate sticker on the front of the SSD, on which the capacity and model of the product are clearly marked.

▲ The back of the SSD is a smooth PCB. WalkDisk WN20 Pro 2TB centralizes all electronic components in the front for heat dissipation.

▲ Slightly remove the nameplate sticker, you can see the true appearance of the product, and it is indeed the light of domestic - Zhiti TiPlus 7100 2TB

▲ Like Zhiti TiPlus 7100, the master controller uses the MAP1602A-F2C of Maxio of domestic Lianyun Technology. The MAP1602A master adopts a 4-channel non external cache design, uses a 12nm process, and supports PCIe? Gen4x4? NVMe? 2.0 interface technology standard adopts ARM? R5 high-performance CPU core can release PCIe without DRAM cache? 4.0 Performance.

▲ NAND particles are the light of domestic products - the original particles of Changjiang Storage should be the crystal stack of the brand? Xtagging? 3.0 is the latest generation of flash memory particles, with a single 512GB, and a total of four, constituting 2TB.

HDD mechanical hard disk

▲ This 8600G test can be said to be just in time. I just bought Toshiba 18T enterprise helium filled CMR mechanical hard disk on JD. This mechanical hard disk is a professional enterprise level Seiko quality, and is the first choice for large capacity and ultra stable warehouse disks. It has excellent cost performance, and can be used to store many professional and game materials.

▲ There is a product positioning introduction on the back of the packing box, which is convenient for users to choose and buy according to their needs.

▲ In addition to the enterprise level helium filled mechanical hard disk MG09 18TB, the product family photo also includes fastening screws, matching screwdriver, high-quality SATA 6Gbps data cable, and product instructions.

▲ At present, the most stable and reliable technology of super capacity hard disk is helium filling and excellent sealing technology to achieve super capacity density, so the hard disk is different from the traditional hard disk in shape. In order to fully seal the helium inside the hard disk, Toshiba uses precision laser welding technology to seal the helium inside the 9-disk mechanical device, which can reduce the aerodynamic resistance and thus reduce the operating power consumption.

▲ The vertical CMR technology, coupled with helium filling technology, makes the spacing of the 9-disk mechanism sufficiently small. The volume of the hard disk is not significantly different from that of the 6T hard disk in thickness. As an enterprise class hard disk, Toshiba uses power-off data protection technology and 7200 RPM high speed on the hard disk, so that the hard disk has outstanding data transmission, throughput, and storage capabilities, but also has extremely reliable security.

▲ The nameplate of the hard disk clearly indicates the model and capacity of the product and the specifications followed in production.

If we talk about the pearl of high precision manufacturing industry, there must be mechanical hard disk, which is the most brilliant pearl. It can be called the human challenge to the current physics in the field of machinery limit 。

▲ The back side is the overturned circuit board, which can protect all important components.

As an enterprise class hard disk, the MG09 18TB helium filled hard disk is equipped with an anti-seismic RV sensor, which can offset the resonance impact that may be caused by nearby hard disks or fans, so that the hard disk can operate stably in a variety of more environments.

▲ HDTune Pro performance measurement shows that the maximum speed recorded is 284.0 MB/s, the average speed recorded is 219.8 MB/s, the minimum speed recorded is 115.2 MB/s, the access time is 12.7 ms, and the burst rate is 285.3 MB/s. The test curve is shown in the figure. Toshiba MG09 18TB, as the current flagship enterprise HDD hard disk, is fast enough to surpass others.

▲ Although Toshiba MG09 18TB is HDD benchmark, IOPS is not HDD's strength, HDD limit Is the physics of multiple magnetic heads limit 。

▲ Additional test of Toshiba MG09 18TB. It can be seen that the MG09 can produce strong performance as long as it is within its comfort zone, so Toshiba MG09 18TB can have an excellent use experience with SSDs.

▲ The performance test of the Crystal Diks Mark 1GiB test block of Toshiba MG09 18TB shows the all-round performance of the MG09 18TB.

▲ The demonstration mode can intuitively feel the burst performance of Toshiba MG09 18TB in daily use, and this speed can accept all current gigabit broadband downloads.

radiator

▲ In order to ensure the fairness of the test and prevent the radiator from being dismantled to affect the test results, I specially prepared two identical twin tower air-cooled radiators - Jiuzhou Fengshen Dashuang Tower Digital Display ARGB white version. The AG620 digital display version, a classic iteration and upgrade version of Dafrost Tower, integrates all the advantages of Dafrost Tower, and has a more cool appearance and a digital display screen on the top, which can visually display the CPU temperature. This is very friendly for APU.

▲ There are detailed parameters of the product on the back. It is worth mentioning that the digital display ARGB version of Dafrost Tower is precisely designed in volume, which enables it to have excellent hardware compatibility and can be adapted to vertical or horizontal MATX, ATX and other common chassis in the market.

▲ The digital display ARGB version of Dashuang Tower has a mixed feeling of Ice Cube 620+Dashuang Tower+top digital display. The radiator is a twin tower structure, which is very compact, and can be compatible with high memory modules and large size graphics cards.

▲ Fin buckled+Fin folded composite connection mode is adopted between the cooling fins, which can maximize the distance between the cooling fins. Fin penetration technology is used to connect the fins and six two-way constant heat balance heat pipes, and the Fin penetration rate reaches 95%~99%.

▲ The cooling tower body adopts anodic oxidation process, which has excellent appearance and oxidation resistance.

▲ There are two digital display screens on the top of the radiator. One displays the logo of Kyushu Fengshen, and the other displays the CPU temperature in real time, which is convenient for users to sense in time.

▲ The pure copper base is connected with 6 two-way constant heat balance heat pipes by welding technology. The base adopts a slightly convex design, which can maximize the contact area with the CPU surface and achieve faster heat transfer.

▲ Both fans are equipped with Hydro Bearing bearing, which is still very quiet when fully loaded. The fan has a colorful ARGB, which can synchronize with the APP of major motherboard manufacturers.

▲ Full platform fasteners can be bought and used on mainstream platforms on the market. Installation is very simple according to the graphic instructions!

Silicone grease

▲ In order to make the test results more stable and reliable, I used Jiuzhou Fengshen Asaxin IV special silicone grease - Jiuzhou Fengshen DM9 master silicone grease. This silicone grease has excellent thermal conductivity, is easy to apply, and is safe and non corrosive to electronic components.

▲ DM9 master silicone grease, silicone grease scraper and silicone grease cleaning kit are arranged in order.

▲ The application process of silicone grease is smooth, and the difficulty of getting started is extremely low. The Mengxin can also be easily controlled. The silicone grease cover is tightly sealed and easy to open.

Power Supply

▲ In order to test the process quickly, reliably and stably, I used my daily test power supply - ATX3.0 850W. This power supply can be said to be a small test for this test. Thanks to its support for ATX 3.0 and four single pair single PCIe (6+2) pins, it is very suitable for use as a test power supply from entry-level to high-end. This power supply has a 10-year warranty for replacement.

▲ Antique NE ATX3.0 850W is a standard ATX power supply size. Its compact size gives it better compatibility. The MATX and ATX chassis on the market can be installed, and some ITX can also be compatible. The fan in the middle supports ECO intelligent temperature control mode, which can minimize the operating noise of the power supply.

▲ The full module interface of the power supply, the landmark+12HPWR 16pin power interface of ATX 3.0, are configured in the upper left corner. In addition, there are four PCIe 8pin interfaces and CPU dual 8pin interfaces, which are compatible with the use needs of high-end and high-end platforms.

▲ It is worth noting that the interface of ATX3.0 850W+12HPWR 16pin and the corresponding module line of ATX3.0 850W support 450W, up to 4080 Super. If it is 4090/4090D, the NE ATX3.0 1000W model is required.

▲ The standard module wire is of moderate hardness and soft material, which is very convenient for wiring management. The PCIe (6+2) pin power supply line is single to single, which is very suitable for high-end A cards.

Chassis

▲ The case adopts Jiuzhou Fengshen CH560 white digital display version. This chassis has excellent chassis air duct, which can maximize the excellent test platform for APU 8600G and 13400 (1050Ti). Its excellent compatibility speeds up the test process and reduces the time required.

▲ The panel on the other side of the chassis is SECC, which can cover the messy back line and shield the electromagnetic waves inside the chassis, providing a safe environment for the chassis and users.

▲ The hardware architecture of the chassis is excellent, which can be compatible with dual 360 water-cooling heat dissipation. It can also be compatible with ATX motherboard and ultra long video card. The chassis is equipped with a video card support bracket as standard, which can provide a third point of support for the video card.

The bottom of the chassis is the power/hard disk compartment. There is a digital display screen on the upper right corner of the power compartment. You can try to display the temperature and load of the CPU and the graphics card as long as you open the app.

▲ The back line space of the chassis is excellent, with excellent back line supporting system. The chassis supports 4 2.5 inch hard disk bits or 2 2.5 inch hard disk bits+2 * 3.5 inch hard disk bits, which can meet the use needs of most users.

▲ Since the APU 8600G is an integrated graphics card, this test cannot be displayed in the GPU area, but its temperature is summarized in the CPU area. The actual operating temperature of the whole 8600G can be known from the CPU temperature, which does not affect the experience at all.

Colorful

▲ The dual fan version is brilliant.

▲ The digital display ARGB version of Dafrost Tower with single fan can intuitively feel the beauty of memory.