Intel Core i7-13700K Water Cooling Overfrequency and ARC A770 Performance Measurement Experience

It has been some time since Intel launched the first wave of 13th generation Raptor Lake-S architecture new platform in late October, and there has been quite a lot of information about i5-13600K and i9-13900K performance tests on the network, Windwithme has previously shared the evaluation of 13600K air-cooled overclocking and 13900K 6G overclocking. The main character of this article is the Intel Core i7-13700K media version. The outer packaging is obviously different from the retail version. The 13700K is also a relatively rare model for testing and discussion on the network at present.

 

The 13700K still continues the hybrid core architecture. Like the 12900K, it is composed of 8 P-cores+8 E-cores. The entity is 16 cores. The P-core supports HT technology, which is referred to as 16 cores and 24 threads.

The basic frequencies of P-core 3.4GHz, E-core 2.5GHz and Max Turbo are up to 5.4G and 4.2G respectively, Intel Smart Cache 30MB、Total L2 24MB、PL1=125W、PL2=253W， With the latest Raptor Lake-S architecture, the cache and frequency are improved compared with the 12th generation. In short, 13700K is an upgraded and optimized version of 12900K, and the price is more affordable.

 

The main board BIOSTAR Z790 VALKYRIE media kit group is similar in appearance to the concept of treasure chest. With the rise of other main board brands in recent years, BIOSTAR has begun to follow a similar model.

The contents include Z790 VALKYRIE motherboard T-FORCE x VALKYRIE DDR5 6000、 Wireless network card, antenna, VALKYRIE series peripheral, such as pillows, coasters, handheld fans, towels, thermal cups, small backpacks, the above non commercial version with.

In the past, we have collected many brands' peripheral products, such as Intel, AMD, AORUS, ROG, MSI Aaron, and so on. It seems that BIOSTAR regards its VALKYRIE series as a concept of sub brand management, and has seen many peripheral products.

 

Full view of Z790 VALKYRIE:

The previous generation introduced Z690 VALKYRIE. Z790 is the fourth model of VALKYRIE. Its appearance design is more evolved. It supports new specifications such as DDR5, PCIe 5.0, PCIe 5.0 M.2, etc., and 2oz is matched with 8-layer PCB materials. It belongs to the highest level series of BIOSTAR, and its size is standard ATX 305 x 244mm.

 

Below Z790 VALKYRIE:

2 x PCIe 5.0 x16 (x16, x8), 1 x PCIe 4.0 x16 (x4), 1 X M.2 E Key (2230 Wi Fi 6E and Bluetooth network cards are supported, and they are not built in and need to be provided by themselves).

1 x PCIe 5.0 M.2(128Gb/s)、3 x PCIe 4.0 M.2(64Gb/s)、1 x PCIe 3.0 M.2(32Gb/s)、8 x SATA。

On the right is the mirror VALKYRIE logo light and is equipped with a debug light. The network chip is Intel I225V, with a bandwidth of 2500 Mb/s; The sound chip is Realtek ALC1220， Up to 7.1 channels, front and rear Hi -Fi Audio technology.

 

Z790 VALKYRIE Upper right:

4 X DIMM DDR5 supports XMP technology and up to DDR5 6400 (OC). It is said that it will support AMD EXPO technology.

The lower left is the front USB 3.2 C-20G, the right is the power, reset and other function buttons, one group of 12V RGB LED headers and two groups of 5V ARGB LED headers.

 

Z790 VALKYRIE Top left:

Using 8Layer, 2oc Copper, Low loss PCB, digital PWM power supply design up to 20 phases, up to 105A Dr. MOS, 8+8PIN power input on the upper left, Armor Gear configured on the left IO to improve texture, protect and enhance heat dissipation, etc., the same as the silver area of the heat sink above the lower right chipset, all adopt ARGB design, where the silver area displays the word VALKYRIE.

 

IO：

BIOS UPDATE/1 X DisplayPort (1.4)/1 X HDMI (2.1)/6 X USB 3.2 Type A (Gen2)/2 X WiFi Antenna/1 X USB 3.2 Type C (Gen2x2)/1 X USB 3.2 (Gen2) Type-C Port with DP/1 X 2.5G LAN/5 X gold-plated audio source connector/1 X SPDIF_Out.

Import the SMART BIOS UPDATE function on Intel platform to make the BIOS update mode more selective and convenient.

 

The back is equipped with a wide range of enhanced backplanes, which can mainly prevent PCB from bending. There are also functions similar to heat sink, which can significantly improve the protection ability and appearance texture of the back of the motherboard. At present, the common design of flagship motherboards in various board manufacturers, BIOSTAR's previous 10 generations of high-level motherboards have started to upgrade their warranty life activities. The VALKYRIE series has been successfully upgraded to 5 years by logging on the VIP CARE website.

 

Overclocking is one of the topics in this article. Through Intel XTU Software Quick Find limit , and then use the BIOS to complete the setting, regardless of whether overclocking is required or not, with the increasing CPU frequency, in addition to the radiator factor, temperature and voltage are also key points.

The BIOS provides two modes, EZ and Advanced, which can be switched through F7. Tweaker is the main efficiency adjustment page. The 13700K octave P-cores are adjusted from 54/54/53/53/53/53/53/53/53/53 to 58/58/57/56/56/55/55; E-cores frequency multiplication 42 is increased to 45, T-FORCE x VALKYRIE DDR5 6000 16GX2 enables the XMP function, and then manually adjusts it to 6600.

 

The voltage page option has the V/F Point Offset advanced voltage setting function at the bottom. It only takes 1.25 V for this DDR5 to run 6000, and it needs to set the voltage to 1.35 V to run all tests when manually overclocking to 6600. There is a new generation of DDR5 7600 modules on the market, which can operate at 1.4 V, but at present only the version at hand can be used for testing.

 

Set the P-Core Voltage Offset to -0.13V, and the E-core Voltage Offset to -0.1V. The following default values and overclocking mode tests all use this voltage setting, and compare the R23 voltage states of 13700K running on different mainboards.

Z790 AORUS ELITE AX BIOS F2 is about 1.32V, F3 indicates that the optimized voltage is 1.296V, and Z790 VALKYRIE has tried several versions of BIOS, and most of them are 1.34V high. The overclocking target voltage in this chapter wants to be about 1.3V, so the above settings are made.

When the voltage drop exceeds - 0.13V, only 1.298V can be displayed at least. No matter how low the setting is, the voltage value cannot be synchronized. It is recommended that the new BIOS be optimized as soon as possible.

 

The price of Z790 VALKYRIE should be lower than similar materials of other brands or Z790 motherboards of the same grade. The advantage lies in the hardware materials and specifications. It is hoped that BIOS and proprietary software can be further optimized, so that the design level of software and hardware can evolve synchronously to improve product competitiveness.

 

Test platform

CPU: Intel Core i7-13700K

MB: BIOSTAR Z790 VALKYRIE

DRAM: TeamGroup DDR5 6000 16GX2

VGA: Intel Arc A770 Limited Edition 16GB

SSD: ZADAK TWSG4S 512GB

POWER: InWin P85 850W

Cooler: T-FORCE SIREN GD360E ARGB

OS: Update Windows 11 to Bulid 22000.282

When installing the graphics card, watch the light-emitting area of the Z790 VALKYRIE motherboard together. The lower right logo and the upper left IO light bar can also be adjusted synchronously with T-FORCE SIREN GD360E ARGB. The appearance light design of the ARC A770 is quite special in the graphics card market.

 

The actual measurement of 13700K overclocking efficiency was started. The control group used the default value and the data of 13600K, 12900K and 7900X previously tested.

CPUZ：

Single thread=>942.1 (default=>878.3; 13600K=>815; 12900K=>815.3; 7900X=>790.8);

Multitasking thread=>13240.5 (default=>12648.2; 13600K=>9837.3; 12900K=>11459.4; 7900X=>12049.9);

x264 FHD Benchmark =>127.6 (preset=>123.1; 13600K=>103.6; 12900K=>106.4; 7900X=>100.7)

FRYRENDER：

Running Time=>44s (default=>46s; 13600K=>1m 1s； 12900K=>55s； 7900X=>52s);

 

CINEBENCH R23：

CPU (Multi Core)=>31721 pts (preset=>30125; 13600K=>24121; 12900K=>27550; 7900X=>29222);

CPU (Single Core)=>2252 pts (preset=>2046; 13600K=>1976; 12900K=>2012; 7900X=>1992)

 

Geekbench 5：

Single Core Score=>2250 (default=>2140; 13600K=>1999； 12900K=>1981； 7900X=>2168);

Multi Core Score=>21826 (default=>21418; 13600K=>17111； 12900K=>17085； 7900X=>19996)

 

3DMARK CPU Profile：

 

PugetBench for Photoshop 0.93.3=>1470 (default=>1394)

 

CrossMark：

The overall score of 13700K overclocking is 2619/productivity 2381/creativity 2907/responsiveness 2551;

13700K preset overall score 2558/productivity 2306/creativity 2869/responsiveness 2471;

13600K overall score 2338/productivity 2206/creativity 2436/responsiveness 2460;

12900K overall score 2299/productivity 2158/creativity 2443/reaction ability 2318;

7900X overall score 2362/productivity 2248/creativity 2540/responsiveness 2203;

 

SPECworkstation 3.1 performance test:

The test software of this workstation covers a wide range, and also involves many CPU or GPU efficiency projects. Many of them are software that many people have heard of or used in their daily life, which can be closer to the actual use efficiency. The complete running of the above computers takes more than 4 hours. Although the projects are diverse, they are also good software for measuring stability, Sometimes all the software can pass the test, but it will jump out or crash in the process of using this software, especially in the overclock state.

 

PCMARK 10=>7823 (preset=>7601)

 

Both 13700K and 12900K have 8P+8E cores. However, as the new architecture improves the cache and frequency, it is obvious that 13700K is more efficient for single core or full core than 12900K.

If compared with 7900X, which has the same price in the market, CPU performance test of Geekbench 5 is higher than that of Geekbench 5. Most other software is 13700K, and the leading range depends on the special test items of various software.

 

Finally, it is also the most interesting place. The 12th generation 12600K 6P+4E and 12700K 8P+4E differ by two P-cores. From the online discussion, it seems that there were more 12700K lovers during the 12th generation, after all, there were more P-cores. The 13th generation 13600K 6P+8E and 13700K 8P+8E also differ by two P-cores, and the online discussion became more popular as 13600K.

Perhaps it is because the total number of 13600K cores has reached 14 cores, which should meet the needs of most user groups for multitasking. In addition, compared with the number of cores of the 12 generation i7~i9 high-end CPUs, 13600K is more valuable.

Compared with the actual test of 13600K and 13700K, if the frequency of a single core is the same, the efficiency difference is very small. However, the full core efficiency of 13700K is significantly higher. In many software, the efficiency is more than 20% ahead. The benefit of two more P-cores is even higher than the difference in the number of cores on the book.

 

The DDR5 uses TeamGroup T-FORCE DELTA RGB DDR5 6000 2x16GB. This version is co branded with VALKYRIE. It should have been certified for compatibility and stability. It uses popular HYNIX particles with parameters of CL38 38-38-78 1.25V. The black heat sink is mainly used with the RGB light bar above.

 

Open XMP DDR5 6000 mode CL38 38-38-78 2T 1.25V,

AIDA64 Memory Read - 94208 MB/s。

 

Overfrequency DDR5 6600 mode CL40 40-40-80 2T 1.35V,

AIDA64 Memory Read - 101997 MB/s。

 

DDR has evolved from the first generation to the current five generations. Every generation will have several similar differences. For example, the new generation of DDR CL or other parameters will be higher than the previous generation. With the increase of frequency and bandwidth, the first generation of DDR also has beautiful parameters of CL2 2-2-5, but the frequency rate will be more than 500, and the bandwidth will be much lower.

Another difference is that the new generation of DDR will have higher capacity modules in the future as it can follow the evolution of the current technological process. At present, with the transition period of generation conversion, DDR4 has been launched in the market for a long time, and its process and output are more mature. It will have price advantages. In this case, consumers will decide which option is suitable for their own budget and needs.

Returning to the frequency performance of DDR5, it can reach about 6400 stable during the 12th generation. The recently launched AM5 is also the highest frequency of daily use of about 6400 stable. The frequency will increase again after changing to the 13th generation. If HYNIX particles from last year to the near future are used, they can reach more than 6600 stable use, limit You can also see about 6900~7000. In addition to increasing the frequency of the same particles, the CL parameters are also better than last year's 12 generation, and the voltage can also be reduced a bit, which has improved overall.

If we take advantage of the recently popular DDR5 Hynix high-order A-die particles, the market has launched 7000~8000 memory modules, and the 13th generation platform has better performance in DRAM frequency and bandwidth.

 

The 3D efficiency test uses the highest level A770 16GB public card in the Intel Arc series graphics cards. The Arc series has launched three levels of 3, 5 and 7, which is the first representative work of Intel returning to the graphics card market. At present, the highest level A770 has two versions in the Taiwan market: Intel public version and Acer overclocking version. The public packaging is different from the design of many graphics card brands in the market, and the outer box design has a good level.

 

The front is full black with double fans, and the skin like coating is used around it. The shell material that was common in the past in high-class laptops is attached with RGB light signal cable, which can be connected with the motherboard through USB 2.0 connector.

 

The back is marked with A770 Limited Edition. The appearance of the central area is similar to that of Carbon. The surrounding frame also uses skin like coating. The power supply is 6+8Pin from the lower right, and the light number is Intel ARC from the lower left. The code Alchemist uses TSMC 6nm, which supports PCIe 4.0. IO provides DisplayPort 2.0x3 and HDMI 2.1x1.

 

3DMARK Time Spy score => 13919

 

3DMARK Intel XeSS feature test =>

XeSS off 29.34 FPS、XeSS on 43.82 FPS、Preformance difference 49.4%。

Intel XeSS technology Flaunt It can achieve high-efficient or high fidelity visual effects. Having seen the contrast photos with or without opening before can make 3D mapping more detailed. Providing multiple setting modes can significantly improve 3D efficiency.

 

FINAL FANTASY XIV ： Endwalker -

2560 x 1440 HIGH => 18751； 1080P HIGH=> 25726

 

FAR CRY 5 polar region Battle Howl 5, turning 3D special effects into extremely high mode,

2560 x 1440=>minimum 78, average 88, maximum 109 Frames Rendered 5181；

1920 x 1080=>minimum 91, average 113, maximum 147 Frames Rendered 6694

 

Assassin's Creed Odyssey-

2560 x 1440=>50FPS, minimum 26, maximum 141, total frames 3184;

1920 x 1080=>55FPS, minimum 28, maximum 75, total frames 3539

 

DIRT 5 Earth Long March 5, set the highest picture quality-

2560 x 1440 => Average FPS 65.7；

1920 x 1080 => Average FPS 81.5；

 

HITMAN 3 Assassin Task 3, set the highest picture quality-

2560 x 1440=>Overall Score 88.80 FPS, XeSS performance mode 107.30 FPS;

1920 x 1080=>Overall Score 111.63 FPS, XeSS performance mode 125.02 FPS;

 

The A770 supports DirectX 12 Ultimate, which is suitable for 1080P and 1440P resolution games. According to the tests of the above games, the 3D special effects are turned on to the maximum in 1440P and the number of pages is also good. After the version number 3900, the new driver optimizes DX9 games, and the number of CSGO pages seen on the network increases by about 1.79 times at most.

The whole Arc series supports AV1 encoding/decoding, which will be of great help to the creators of audio and video editors who use this technology. Due to the limited space, we will first do some tests here, and then have the opportunity to do more performance tests in the future,

In the initial stage of the driver, there is still a way to go to be more mature and stable. The installation and use of the driver is relatively smooth. At present, the Arc series is positioned below the mid market.

In my impression, the AMD graphics card driver became more and more stable after more than 10 years of adjustment at the initial stage. The launch of the RX580 in that year also met the threshold of the middle market at most. For the consumer market, the entry of the third GPU manufacturer will bring more choices or competition to the market in the future.

 

13700K overfrequency value burning, water-cooled T-FORCE SIREN GD360E ARGB.

Voltage display 1.309V, power 167.7W, AIDA64 Stress CPU, FPU full speed:

P-core is about 84~98 degrees, and the frequency is about 5.2~5.5GHz; E-core is about 77~81 degrees, and the frequency is about 4.2~4.5GHz.

 

The internal temperature status of the mainboard when the AIDA64 CPU is burned when the test platform is overclocking.

 

The whole desktop standby of the 13700K overclocking machine is about 105W, the full speed of the AIDA64 Stress CPU and FPU is about 335W, and the assassin's doctrine: the minimum and maximum instant of the Odyssey test mode is 327W and 348W, and most of the time is about 335W.

The performance comparison table of 13700K overclocking, 13700K presetting, 13600K, 12900K, 7900X in this chapter:

 

In recent years, the two CPU camps have been competing in terms of frequency, number of cores, IPC efficiency, etc. Recently, Intel has seen a large increase in the number of cores, and frequency is also the focus of competition between the two new platforms, Breach It has been close to the critical value of 5G or slightly higher than 5G for a long time, and directly comes to a new state with a preset maximum of 5.8G.

Although the higher-order CPU has more cores and higher frequencies, it also has more requirements than the level of the radiator. 360 water cooling is almost a better choice for the standard threshold. Regardless of preset or overfrequency use, in order to avoid reducing the frequency speed due to the temperature reaching TJ Max, through XTU or BIOS adjustment, the offset voltage reduction function is used to help play its due role, reduce temperature and power consumption.

 

There are many factors that affect the overclocking. The required voltage or upward frequency varies due to the different physical conditions of optical CPUs. This chapter mainly shares the overclocking capability of the hardware at hand with the buck setting. The general direction of the buck setting is roughly as set in the article. Of course, there are also more details about the separate buck setting of a single core or other ways of overclocking, but it will take more time to adjust one by one.

The first wave of the 13th generation K version CPU can be combined with the motherboard of the Z790 high-order chipset, or with the previous generation B660 or Z690 through BIOS update. In addition, the DDR4 and DDR5 motherboards can be selected at the same time, so the platform construction cost is low and the selectivity is high. In addition, the non K version CPU series and the mid-level B760 will be launched in early January.

At present, windwithme has shared the evaluation articles of two AM5 CPUs and three 13th generation CPUs. In the future, there will be test articles of other new platforms in succession. If you want to see which tests, you can also put forward first. If time and resources at hand can be matched, you can share them in the future.

 

The above is windwithme wind's experience on 13700K water cooling overclocking. If you think it is helpful, please reply and support. No matter which platform you are interested in, we hope you can do more homework before starting to choose the best option. See our next review. Thank you:)