Adhesive Bond Improvements
anew modeling method using solid elements to assess the durability of adhesive is introduced.This is in addition to the current method using beam elements。
This new modeling method also enables the use of the standard SN solver.This method is possible due to the more ductile nature if newer adhesives。
The free edges of the solid elements can be wrapped in a skin of membrane elements and the new X_Stress or Y_Stress option can be used for the analysis。